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    • 41. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US08017482B2
    • 2011-09-13
    • US12974819
    • 2010-12-21
    • Toshikazu MatsuiYasuyuki SayamaHiroki EtoTakumi Hosoya
    • Toshikazu MatsuiYasuyuki SayamaHiroki EtoTakumi Hosoya
    • H01L21/336
    • H01L29/66734H01L21/26586H01L29/42376H01L29/7397
    • The invention provides a method of manufacturing a semiconductor device at low cost in which the gate insulation film having a trench structure is not damaged by arsenic ions when the emitter layer or the like is formed and the insulation breakdown voltage is enhanced. A gate electrode made of polysilicon formed in a trench is thermally oxidized in a high temperature furnace or the like to form a thick polysilicon thermal oxide film on the gate electrode. Impurity ions are then ion-implanted to form an N type semiconductor layer that is to be an emitter layer or the like. At this time, the polysilicon thermal oxide film is formed thicker than the projected range Rp of impurity ions in the silicon oxide film for forming the N type semiconductor layer as the emitter layer or the like by ion implantation. This prevents a gate insulation film between the gate electrode and the N type semiconductor layer from being damaged by the impurity ions.
    • 本发明提供了一种以低成本制造半导体器件的方法,其中当形成发射极层等时,具有沟槽结构的栅极绝缘膜不被砷离子损坏并且绝缘击穿电压增强。 在沟槽中形成的由多晶硅形成的栅电极在高温炉等中被热氧化,以在栅电极上形成厚的多晶硅热氧化膜。 然后将杂质离子离子注入以形成作为发射极层等的N型半导体层。 此时,通过离子注入,多晶硅热氧化膜形成得比用于形成N型半导体层的氧化硅膜中的杂质离子的投射范围Rp比发射极层等厚。 这防止了栅电极和N型半导体层之间的栅极绝缘膜被杂质离子损坏。
    • 45. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20080283889A1
    • 2008-11-20
    • US12101959
    • 2008-04-11
    • Keiichi HARAGUCHIToshikazu MatsuiSatoshi KameiHisanori Ito
    • Keiichi HARAGUCHIToshikazu MatsuiSatoshi KameiHisanori Ito
    • H01L29/94H01L29/92
    • H01L27/0805H01L23/5223H01L2924/0002H01L2924/00
    • The present invention aims to enhance the reliability of a semiconductor device having first through fourth capacitive elements. The first through fourth capacitive elements are disposed over a semiconductor substrate. A series circuit of the first and second capacitive elements and a series circuit of the third and fourth capacitive elements are coupled in parallel between first and second potentials. Lower electrodes of the first and third capacitive elements are respectively formed by a common conductor pattern and coupled to the first potential. Lower electrodes of the second and fourth capacitive elements are respectively formed by a conductor pattern of the same layer as the above conductor pattern and coupled to the second potential. Upper electrodes of the first and second capacitive elements are respectively formed by a common conductor pattern and brought to a floating potential. Upper electrodes of the third and fourth capacitive elements are respectively formed by a conductor pattern of the same layer as the above conductor pattern and brought to a floating potential, but not coupled to the upper electrodes of the first and second capacitive elements by a conductor.
    • 本发明旨在提高具有第一至第四电容元件的半导体器件的可靠性。 第一至第四电容元件设置在半导体衬底上。 第一和第二电容元件的串联电路和第三和第四电容元件的串联电路在第一和第二电位之间并联耦合。 第一和第三电容元件的下电极分别由公共导体图案形成并耦合到第一电位。 第二和第四电容元件的下电极分别由与上述导体图案相同的层的导体图案形成并耦合到第二电位。 第一和第二电容元件的上电极分别由公共导体图形形成并且具有浮动电位。 第三和第四电容元件的上电极分别由与上述导体图案相同的层的导体图形形成浮动电位,但不通过导体耦合到第一和第二电容元件的上电极。