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41. 发明申请

US20050249927A1 Copper foil for high-density ultra-fine printed wiring board 失效
标题翻译：铜箔用于高密度超细印刷线路板
公开(公告)号：US20050249927A1
公开(公告)日：2005-11-10
申请号：US11180181
申请日：2005-07-13
申请人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
发明人： Akitoshi Suzuki , Shin Fukuda , Kazuhiro Hoshino , Tadao Nakaoka
IPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D5/10 , C25D7/06 , H05K3/02 , B32B3/00 , B32B9/00 , B32B15/04
CPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D5/10 , C25D7/0614 , H05K3/025 , Y10T428/12431 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12569 , Y10T428/12611 , Y10T428/12771 , Y10T428/12861 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681
摘要： The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.
摘要翻译：本发明提供一种具有载体的超薄铜箔，该载体包括依次层叠的剥离层，扩散防止层和铜电镀层，或层叠了扩散防止层，剥离层和铜电镀层依次在载体箔的表面上，其中铜电镀层的表面被粗糙化; 包括层叠在树脂基板上的具有载体的超薄铜箔的覆铜层压板; 在其超薄铜箔上形成有覆铜层压板的印刷电路板形成布线图案; 以及层叠多个上述印刷电路板的多层印刷电路板。

42. 发明申请

US20050158574A1 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier 审中-公开
标题翻译：超薄铜箔带载体和印刷线路板，采用超薄铜箔带载体
公开(公告)号：US20050158574A1
公开(公告)日：2005-07-21
申请号：US10984896
申请日：2004-11-10
申请人： Akitoshi Suzuki , Shin Fukuda
发明人： Akitoshi Suzuki , Shin Fukuda
IPC分类号： H05K1/09 , C25D5/48 , C25D7/06 , H05K3/02 , H05K3/38 , B32B3/00
CPC分类号： C25D7/0614 , C25D1/04 , C25D5/48 , H05K3/025 , H05K3/383 , H05K3/384 , Y10T428/12028 , Y10T428/12438 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12569 , Y10T428/12903 , Y10T428/12993 , Y10T428/24802 , Y10T428/24917 , Y10T428/265
摘要： To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 μm or less, and the microscopic line and a wiring board have large peel strength even after line of 15 μm is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 μm as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 μm or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment.
摘要翻译：为了制造具有载体箔的超薄铜箔，可以沉积微晶粒而不受载体箔的表面粗糙度的影响，可以进行蚀刻直到超细宽度使得线/间隔为15μm或即使在15um的线被蚀刻之后，微细线和布线板也具有较大的剥离强度。依次层叠载体箔，剥离层，超薄铜箔的超薄铜箔，超薄铜箔（进行粗糙化处理前）是表面粗糙度为2.5的电解铜箔妈妈作为十点高度的粗糙度轮廓，并且基础材料的突起峰之间的最小距离为5um以上。此外，超薄铜箔的表面进行粗糙化处理。

43. 发明授权

US06835442B2 Flexible printed wiring board 失效
标题翻译：柔性印刷线路板
公开(公告)号：US06835442B2
公开(公告)日：2004-12-28
申请号：US10221442
申请日：2002-09-12
申请人： Noriaki Kudo , Asaei Takabayashi , Akitoshi Suzuki , Shin Fukuda
发明人： Noriaki Kudo , Asaei Takabayashi , Akitoshi Suzuki , Shin Fukuda
IPC分类号： B32B1500
CPC分类号： H05K3/384 , H05K1/0346 , H05K2201/0154 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S428/901 , Y10S428/935 , Y10T428/12438 , Y10T428/12569 , Y10T428/12611 , Y10T428/12903 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
摘要翻译：柔性印刷电路板包含非增韧的电沉积铜箔，其上设置有0.25至0.40mg / dm 2的锌基金属层，以及通过酰亚胺化形成的聚酰亚胺树脂层锌基金属层。

44. 发明授权

US06300041B1 Optical recording medium and manufacturing method thereof 有权
标题翻译：光记录介质及其制造方法
公开(公告)号：US06300041B1
公开(公告)日：2001-10-09
申请号：US09551506
申请日：2000-04-17
申请人： Shin Masuhara , Masayoshi Kanno , Akitoshi Suzuki
发明人： Shin Masuhara , Masayoshi Kanno , Akitoshi Suzuki
IPC分类号： G11B724
CPC分类号： G11B7/261 , G11B7/00718 , G11B7/0079 , G11B7/24 , G11B7/24079 , G11B7/263 , Y10S430/146
摘要： An optical recording medium according to the present invention includes a data recording area forming a double spiral structured track having spiral recording tracks each formed of a groove and a land adjacent to the groove, and a reproduction only area forming a single spiral structured track consisting of a pit row.
摘要翻译：根据本发明的光记录介质包括形成双螺旋构造轨道的数据记录区，其具有由凹槽和与凹槽相邻的平台形成的螺旋记录轨道，以及形成单螺旋结构轨迹的仅再现区域，一个坑排。

45. 发明授权

US6005637A Image transmission system having a mesh setting device 失效
标题翻译：图像传输系统具有网格设定装置
公开(公告)号：US6005637A
公开(公告)日：1999-12-21
申请号：US589541
申请日：1996-01-22
申请人： Akitoshi Suzuki
发明人： Akitoshi Suzuki
IPC分类号： A61B5/00 , G06T11/00 , H04N1/387 , H04N1/42 , H04N5/232 , H04N7/18 , H04N9/74
CPC分类号： H04N1/387 , G06T11/00 , H04N1/42
摘要： An image communication system for displaying a subject image imaged by a camera unit locally and at a remote location for discussion of the subject image via telephone or other communication device. The image communication system includes an image transmission device to form mesh image data representing a mesh image and to synthesize the mesh image data with subject image data representing the image of the subject to form synthesized image data for transmission to a remote location. The mesh image data is set by a mesh setting device and synthesized with the subject image data by an image synthesis circuit such that the mesh image is superimposed upon the subject image. The mesh image may be set and synthesized with the subject image at either of the subject image transmission location or the remote location. Further, the mesh image may be modified at either the transmission location or the remote location.
摘要翻译：一种图像通信系统，用于在本地和远程位置显示由相机单元成像的被摄体图像，用于通过电话或其他通信设备讨论被摄体图像。图像通信系统包括图像传输装置，用于形成表示网格图像的网格图像数据，并且将网格图像数据与表示被检体图像的被摄体图像数据合成，以形成用于传输到远程位置的合成图像数据。网格图像数据由网格设置装置设置，并通过图像合成电路与被摄体图像数据合成，使得网格图像叠加在被摄体图像上。网格图像可以在被摄体图像传输位置或远程位置中的任一个处被设置和合成。此外，可以在传输位置或远程位置修改网格图像。

46. 发明授权

US5834140A Electrodeposited copper foil for fine pattern and method for producing the same 失效
标题翻译：用于精细图案的电沉积铜箔及其制造方法
公开(公告)号：US5834140A
公开(公告)日：1998-11-10
申请号：US715104
申请日：1996-09-18
申请人： Adam M. Wolski , Michel Streel , Akitoshi Suzuki , Hideo Otsuka
发明人： Adam M. Wolski , Michel Streel , Akitoshi Suzuki , Hideo Otsuka
IPC分类号： C25D1/04 , C25F3/02 , H05K1/09 , H05K3/00
CPC分类号： C25D1/04 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R.sub.z of the matte side of the untreated copper foil is the same as or less than the surface roughness R.sub.z of the shiny side of this untreated copper foil. The electrodeposited copper foil is made by electrodepositing copper onto a drum from an electrolyte which contains 0.05 to 5 ppm 3-mercapto 1-propanesulfonate; at least one organic compound selected from 0.1 to 15 ppm of a polysaccharide which is a carbohydrate such as starches, celluloses and vegetable rubbers, and 0.3 to 35 ppm of a low molecular weight glue having a weight average molecular weight of 10,000 or less; and 10 to 60 ppm of a chloride ion. The copper foil may be used in making a printed circuit board or as a component of a secondary battery cell.
摘要翻译：本发明是一种电沉积铜箔，其特征在于，在未处理铜箔的无光泽面上进行粗糙化处理，其中未处理铜箔的无光泽面的表面粗糙度Rz与表面粗糙度Rz相同或小于这个未经处理的铜箔的光泽面。电沉积铜箔通过从含有0.05-5ppm 3-巯基1-丙磺酸盐的电解质将铜电沉积到鼓上制成，至少一种选自0.1至15ppm的多糖，其为碳水化合物如淀粉，纤维素和植物橡胶，和0.3至35ppm的重均分子量为10,000或更小的低分子量胶; 和10〜60ppm的氯离子。铜箔可用于制造印刷电路板或二次电池单元的组件。

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