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41. 发明授权

US5525545A Semiconductor chip assemblies and components with pressure contact 失效
公开(公告)号：US5525545A
公开(公告)日：1996-06-11
申请号：US306208
申请日：1994-11-03
申请人： Gary Grube , Igor Khandros , Gaetan Mathieu
发明人： Gary Grube , Igor Khandros , Gaetan Mathieu
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , Y10T29/49004 , Y10T29/4913
摘要： A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.

42. 发明申请

US20090035959A1 INTERCONNECT ASSEMBLIES AND METHODS 审中-公开
标题翻译：互连组合和方法
公开(公告)号：US20090035959A1
公开(公告)日：2009-02-05
申请号：US12251217
申请日：2008-10-14
申请人： Benjamin N. Eldridge , Gaetan Mathieu
发明人： Benjamin N. Eldridge , Gaetan Mathieu
IPC分类号： H01R12/00
CPC分类号： G01R1/06727 , G01R1/07342 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/72 , H01L2224/02311 , H01L2224/02313 , H01L2224/02335 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/03472 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05008 , H01L2224/0502 , H01L2224/05027 , H01L2224/05552 , H01L2224/05563 , H01L2224/056 , H01L2224/10122 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/13012 , H01L2224/13016 , H01L2224/13023 , H01L2224/13026 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13173 , H01L2224/1379 , H01L2224/138 , H01L2224/1412 , H01L2224/1413 , H01L2224/16057 , H01L2224/81007 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2224/819 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01R13/03 , H01L2924/01027 , H01L2924/00014 , H01L2924/00012
摘要： Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
摘要翻译：具有弹性接触元件的互连组件和用于制造这些组件的方法。在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。

43. 发明授权

US07435108B1 Variable width resilient conductive contact structures 失效
标题翻译：可变宽度弹性导电接触结构
公开(公告)号：US07435108B1
公开(公告)日：2008-10-14
申请号：US09364788
申请日：1999-07-30
申请人： Benjamin N. Eldridge , Gaetan Mathieu
发明人： Benjamin N. Eldridge , Gaetan Mathieu
IPC分类号： H05K1/00
CPC分类号： G01R1/06727 , G01R1/07342 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/72 , H01L2224/02311 , H01L2224/02313 , H01L2224/02335 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/03472 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05008 , H01L2224/0502 , H01L2224/05027 , H01L2224/05552 , H01L2224/05563 , H01L2224/056 , H01L2224/10122 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/13012 , H01L2224/13016 , H01L2224/13023 , H01L2224/13026 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13173 , H01L2224/1379 , H01L2224/138 , H01L2224/1412 , H01L2224/1413 , H01L2224/16057 , H01L2224/81007 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2224/819 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01R13/03 , H01L2924/01027 , H01L2924/00014 , H01L2924/00012
摘要： Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
摘要翻译：具有弹性接触元件的互连组件和用于制造这些组件的方法。在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。

44. 发明申请

US20070270041A1 Microelectronic contact structure 失效
标题翻译：微电子接触结构
公开(公告)号：US20070270041A1
公开(公告)日：2007-11-22
申请号：US11228966
申请日：2005-09-16
申请人： Gary Grube , Gaetan Mathieu , Alec Madsen
发明人： Gary Grube , Gaetan Mathieu , Alec Madsen
IPC分类号： H01R24/00
CPC分类号： G01R1/06733 , G01R1/06716 , G01R1/0675 , G01R1/07314 , G01R3/00
摘要： An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.
摘要翻译：沿着中心纵向轴线设置的细长柱状微机械结构; 该结构由层压结构层组成，每层由结构材料构成。这些层在结构的近端处限定基本上刚性的基部，从基部延伸的弹性中间部分沿着中心轴线，以及在结构的远端处从弹性部分延伸的接触尖端。接触结构的弹性部分由限定在层中的弹性臂组成。弹性臂的相对端部可以相对于中心轴线彼此成角度地偏移。因此，当接触结构沿轴向压缩时，接触尖端将围绕中心轴线旋转，同时基座保持固定，为接触尖端提供有益的擦拭作用。

45. 发明申请

US20070247176A1 Method of Manufacturing a Probe Card 失效
标题翻译：制造探针卡的方法
公开(公告)号：US20070247176A1
公开(公告)日：2007-10-25
申请号：US11692035
申请日：2007-03-27
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/26 , G01R31/04
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

46. 发明申请

US20060237856A1 Microelectronic Contact Structure And Method Of Making Same 失效
标题翻译：微电子触点结构及其制作方法
公开(公告)号：US20060237856A1
公开(公告)日：2006-10-26
申请号：US11456568
申请日：2006-07-11
申请人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
发明人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
IPC分类号： H01L23/52
CPC分类号： G01R3/00 , B23K2101/38 , G01R1/06727 , G01R1/06744 , H01L21/6835 , H01L23/4951 , H01L24/72 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01R12/57 , H05K3/4092 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2924/00
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

47. 发明申请

US20060211278A1 Interconnect for microelectronic structures with enhanced spring characteristics 失效
公开(公告)号：US20060211278A1
公开(公告)日：2006-09-21
申请号：US11440145
申请日：2006-05-23
申请人： Gaetan Mathieu , Benjamin Eldridge
发明人： Gaetan Mathieu , Benjamin Eldridge
IPC分类号： H01R12/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/71 , H01L24/72 , H01L2224/05001 , H01L2224/05568 , H01L2224/11002 , H01L2224/11003 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/3011 , H01R12/57 , H01R12/718 , H01R13/03 , H01R13/24 , H05K3/326 , H05K3/4092 , H05K2201/0311 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

48. 发明申请

US20060157839A1 Re-assembly process for MEMS structures 审中-公开
公开(公告)号：US20060157839A1
公开(公告)日：2006-07-20
申请号：US11374761
申请日：2006-03-14
申请人： Benjamin Eldridge , Gaetan Mathieu
发明人： Benjamin Eldridge , Gaetan Mathieu
IPC分类号： H01L21/44
CPC分类号： B81C1/00214 , B81B7/04 , B81C3/002 , B81C2203/051 , G01R1/06711 , G01R1/06744 , G01R1/07314 , G01R1/07342 , G01R3/00 , H01L23/49827 , H01L2924/0002 , H01L2924/15174 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , H01L2924/00
摘要： Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.

49. 发明申请

US20060033517A1 Probe for semiconductor devices 失效
标题翻译：探头用于半导体器件
公开(公告)号：US20060033517A1
公开(公告)日：2006-02-16
申请号：US11256514
申请日：2005-10-19
申请人： Igor Khandros , Gaetan Mathieu
发明人： Igor Khandros , Gaetan Mathieu
IPC分类号： G01R31/02
CPC分类号： B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/06716 , G01R1/06744 , G01R1/07378 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/04042 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/49109 , H01L2224/73203 , H01L2224/73251 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/328 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K7/1069 , H05K2201/0311 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49179 , Y10T29/49204 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/48 , H01L2224/72
摘要： An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
摘要翻译：一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

50. 发明申请

US20050179455A1 Probing a device 失效
标题翻译：探测设备
公开(公告)号：US20050179455A1
公开(公告)日：2005-08-18
申请号：US10781369
申请日：2004-02-18
申请人： Timothy Cooper , Benjamin Eldridge , Igor Khandros , Rod Martens , Gaetan Mathieu
发明人： Timothy Cooper , Benjamin Eldridge , Igor Khandros , Rod Martens , Gaetan Mathieu
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。然后电子设备水平或对角地移动，使得端子接触探针。然后通过探头将测试数据传送到电子设备和从电子设备传送。

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