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1. 发明申请

US20070126443A1 Method of Manufacturing A Probe Card 审中-公开
标题翻译：制造探针卡的方法
公开(公告)号：US20070126443A1
公开(公告)日：2007-06-07
申请号：US11669010
申请日：2007-01-30
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

2. 发明申请

US20070247176A1 Method of Manufacturing a Probe Card 失效
标题翻译：制造探针卡的方法
公开(公告)号：US20070247176A1
公开(公告)日：2007-10-25
申请号：US11692035
申请日：2007-03-27
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/26 , G01R31/04
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

3. 发明申请

US20060237856A1 Microelectronic Contact Structure And Method Of Making Same 失效
标题翻译：微电子触点结构及其制作方法
公开(公告)号：US20060237856A1
公开(公告)日：2006-10-26
申请号：US11456568
申请日：2006-07-11
申请人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
发明人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
IPC分类号： H01L23/52
CPC分类号： G01R3/00 , B23K2101/38 , G01R1/06727 , G01R1/06744 , H01L21/6835 , H01L23/4951 , H01L24/72 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01R12/57 , H05K3/4092 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2924/00
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

4. 发明申请

US20050146339A1 Method of manufacturing a probe card 有权
公开(公告)号：US20050146339A1
公开(公告)日：2005-07-07
申请号：US11073187
申请日：2005-03-04
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/26 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

5. 发明授权

US5414298A Semiconductor chip assemblies and components with pressure contact 失效
标题翻译：半导体芯片组件和压力接触部件
公开(公告)号：US5414298A
公开(公告)日：1995-05-09
申请号：US38178
申请日：1993-03-26
申请人： Gary Grube , Igor Khandros , Gaetan Mathieu
发明人： Gary Grube , Igor Khandros , Gaetan Mathieu
IPC分类号： H01L23/48 , H01L39/02
CPC分类号： H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , Y10T29/49004 , Y10T29/4913
摘要： A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.
摘要翻译：半导体芯片组件包括芯片，通过柔性引线永久地电连接到芯片的芯片和用于将端子偏压离开芯片的弹性元件或元件。芯片与具有接触焊盘的基板永久地接合，使得端子设置在芯片和基板之间，并且端子在由弹性元件施加的力的影响下接合接触焊盘。端子通常设置在柔性片状电介质插入件上，并且弹性元件设置在插入件和芯片之间。可以在与基板接合之前测试芯片和端子的组件。由于该组件与衬底的接合不涉及焊接或其它复杂的结合工艺，所以是可靠的。组件可以非常紧凑，并且可以占据仅比芯片本身的面积稍大的区域。

6. 发明申请

US20070228110A1 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out 审中-公开
公开(公告)号：US20070228110A1
公开(公告)日：2007-10-04
申请号：US11758479
申请日：2007-06-05
申请人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
发明人： Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu
IPC分类号： B23K20/00
CPC分类号： H01L24/72 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6715 , H01L21/67248 , H01L21/67253 , H01L21/67288 , H01L22/20 , H01L23/49811 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/11 , H01L2224/1134 , H01L2224/12 , H01L2224/13099 , H01L2224/16 , H01L2224/16145 , H01L2224/32225 , H01L2224/45 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48599 , H01L2224/49 , H01L2224/49109 , H01L2224/73203 , H01L2224/73251 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/81801 , H01L2224/81901 , H01L2224/85 , H01L2224/85043 , H01L2224/85045 , H01L2224/851 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/8592 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49149 , H01L2924/00014 , H01L2924/20752 , H01L2924/00 , H01L2924/00015 , H01L2924/2075 , H01L2924/01204 , H01L2924/013 , H01L2924/00013 , H01L2924/01048 , H01L2224/72 , H01L2924/00012
摘要： Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

7. 发明申请

US20060223345A1 SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES 审中-公开
标题翻译： “弹簧”半导体器件的插座
公开(公告)号：US20060223345A1
公开(公告)日：2006-10-05
申请号：US11423767
申请日：2006-06-13
申请人： Thomas Dozier , Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu , David Pedersen , Michael Stadt
发明人： Thomas Dozier , Benjamin Eldridge , Gary Grube , Igor Khandros , Gaetan Mathieu , David Pedersen , Michael Stadt
IPC分类号： H01R12/00
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
摘要翻译：从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子抵抗弹簧接触元件的端部。公开了各种终端配置。

8. 发明授权

US5525545A Semiconductor chip assemblies and components with pressure contact 失效
公开(公告)号：US5525545A
公开(公告)日：1996-06-11
申请号：US306208
申请日：1994-11-03
申请人： Gary Grube , Igor Khandros , Gaetan Mathieu
发明人： Gary Grube , Igor Khandros , Gaetan Mathieu
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , Y10T29/49004 , Y10T29/4913
摘要： A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.

9. 发明申请

US20080042668A1 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 有权
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：US20080042668A1
公开(公告)日：2008-02-21
申请号：US11877466
申请日：2007-10-23
申请人： Benjamin Eldridge , Gary Grube , Eric Hobbs , Gaetan Mathieu , Makarand Shinde , Alexander Slocum , A. Sporck , Thomas Watson
发明人： Benjamin Eldridge , Gary Grube , Eric Hobbs , Gaetan Mathieu , Makarand Shinde , Alexander Slocum , A. Sporck , Thomas Watson
IPC分类号： G01R1/073
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

10. 发明申请

US20070270041A1 Microelectronic contact structure 失效
标题翻译：微电子接触结构
公开(公告)号：US20070270041A1
公开(公告)日：2007-11-22
申请号：US11228966
申请日：2005-09-16
申请人： Gary Grube , Gaetan Mathieu , Alec Madsen
发明人： Gary Grube , Gaetan Mathieu , Alec Madsen
IPC分类号： H01R24/00
CPC分类号： G01R1/06733 , G01R1/06716 , G01R1/0675 , G01R1/07314 , G01R3/00
摘要： An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.
摘要翻译：沿着中心纵向轴线设置的细长柱状微机械结构; 该结构由层压结构层组成，每层由结构材料构成。这些层在结构的近端处限定基本上刚性的基部，从基部延伸的弹性中间部分沿着中心轴线，以及在结构的远端处从弹性部分延伸的接触尖端。接触结构的弹性部分由限定在层中的弹性臂组成。弹性臂的相对端部可以相对于中心轴线彼此成角度地偏移。因此，当接触结构沿轴向压缩时，接触尖端将围绕中心轴线旋转，同时基座保持固定，为接触尖端提供有益的擦拭作用。

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