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    • 43. 发明申请
    • Method and apparatus for plasma doping
    • 等离子体掺杂的方法和装置
    • US20070074813A1
    • 2007-04-05
    • US11603146
    • 2006-11-22
    • Tomohiro OkumuraIchiro NakayamaBunji Mizuno
    • Tomohiro OkumuraIchiro NakayamaBunji Mizuno
    • C23F1/00
    • H01J37/32412H01J37/321H01J37/32174H01J37/32935H01J37/3299H01L21/2236
    • A method for impurity implantation, in which a substrate is positioned on a table provided within a chamber in which a vacuum will be introduced and also an implantation impurity is supplied. A first high frequency electric power is applied to a plasma generating element to thereby generate a plasma so that the impurity in the chamber is implanted in the substrate. Also, a second high frequency electric power is applied to the table. Detected are a condition of the plasma in the chamber and a voltage or current in the table. A controller controls at least one of the first and second high frequency electric power sources according to the detected condition of the plasma and/or the detected voltage or current, thereby controlling an implantation concentration of the impurity to be implanted.
    • 一种用于杂质注入的方法,其中将基板放置在设置在其中将被引入真空的室内的台上,并且还提供注入杂质。 将第一高频电力施加到等离子体发生元件,从而产生等离子体,使得腔室中的杂质注入基板。 此外,第二高频电力被施加到桌子上。 检测到的是室内等离子体的状态,以及表中的电压或电流。 控制器根据检测到的等离子体的状态和/或检测到的电压或电流来控制第一和第二高频电源中的至少一个,从而控制待植入的杂质的注入浓度。
    • 46. 发明申请
    • Method and apparatus for plasma processing
    • 等离子体处理方法和装置
    • US20050145340A1
    • 2005-07-07
    • US11067628
    • 2005-02-28
    • Tomohiro OkumuraIchiro Nakayama
    • Tomohiro OkumuraIchiro Nakayama
    • H01J37/32H01L21/306
    • H01J37/321
    • A plasma processing method includes controlling a pressure of an interior of a vacuum chamber to a specified pressure by exhausting the interior of the vacuum chamber while supplying gas into the interior of vacuum chamber. While the pressure of the interior of the vacuum chamber is being controlled, high-frequency power is supplied to one end of a first conductor which is opened at another end, and which is configured as a vortex. Also, grounding one end of a second conductor which is opened at another end and which is configured as a vortex. Finally, electromagnetic waves from the first conductor and the second conductor radiate into the vacuum chamber, generating plasma in the vacuum chamber and processing a substrate placed on the electrode within the vacuum chamber.
    • 等离子体处理方法包括通过在将真空室内的气体供给到真空室内部的同时排出真空室的内部来将真空室的内部压力控制到规定的压力。 在控制真空室内部的压力的同时,将高频功率供给到在另一端开放的第一导体的一端,并被配置为涡流。 另外,将第二导体的一端接地,该第二导体在另一端开放,并被构造为涡流。 最后,来自第一导体和第二导体的电磁波辐射到真空室中,在真空室中产生等离子体并处理放置在真空室内的电极上的衬底。