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    • 43. 发明申请
    • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
    • 制造半导体器件的方法
    • US20120135577A1
    • 2012-05-31
    • US13304936
    • 2011-11-28
    • Doo-Young LEEKi Il KimMyeong-Cheol KimDo-Hyoung KimDo-Hsing Lee
    • Doo-Young LEEKi Il KimMyeong-Cheol KimDo-Hyoung KimDo-Hsing Lee
    • H01L21/336H01L21/28
    • H01L29/78H01L21/76829H01L21/76832H01L21/76895H01L21/76897H01L29/66545
    • A method of manufacturing a semiconductor device, including the second sacrificial layer receiving a gate structure include a metal and a spacer on a sidewall of the gate structure therethrough being formed on a substrate. The second sacrificial layer is removed. A second etch stop layer and an insulating interlayer are sequentially formed on the gate structure, the spacer and the substrate. An opening passing through the insulating interlayer is formed to expose a portion of the gate structure, a portion of the spacer and a portion of the second etch stop layer on a portion of the substrate. The second etch stop layer being exposed through the opening is removed. The contact being electrically connected to the gate structure and the substrate and filling the opening is formed. The semiconductor device having the metal gate electrode and the shared contact has a desired leakage current characteristic and resistivity characteristics.
    • 包括接收栅极结构的第二牺牲层的半导体器件的制造方法包括在基板上形成的栅极结构的侧壁上的金属和间隔物。 去除第二牺牲层。 在栅极结构,间隔物和衬底上依次形成第二蚀刻停止层和绝缘中间层。 形成通过绝缘中间层的开口以暴露栅极结构的一部分,间隔物的一部分和第二蚀刻停止层的一部分在衬底的一部分上。 去除通过开口露出的第二蚀刻停止层。 形成与栅极结构和基板电连接并填充开口的触点。 具有金属栅电极和共用触点的半导体器件具有期望的漏电流特性和电阻率特性。
    • 45. 发明授权
    • Method for making cleaning pad
    • 制造清洁垫的方法
    • US5441333A
    • 1995-08-15
    • US192963
    • 1994-02-07
    • Ki Il Kim
    • Ki Il Kim
    • A47L13/07A47L17/08B29C65/02B29C65/74B32B5/26A46B3/00B32B1/10B32B31/00
    • B29C66/436A47L13/07A47L17/08B29C65/18B29C66/727B29C66/83221B32B5/26B29C65/745B29C66/71Y10T156/1084Y10T29/49787
    • A flexible, shape conforming pad for use in cleaning, smoothing or finishing. The pad has an abrasive cover and an absorbent core. The edges of the core are anchored to the edges of the cover by compressing and heat sealing the core's edges between the cover's edges. The cover is fabricated from an abrasive material or a combination of different materials. When a combination of the materials is used, the different materials cover separate areas of the pa to provide different surfaces. The fabrication of the cleaning pad is automated, and a plurality of the cleaning pads are fabricated at the same time by a plurality of sealing and cutting devices which simultaneously compress and heat seal spaced strips of the uncut cover and core blank and then the compressed strips are cut to form plural cleaning pads. In the fabrication method using two different materials, all four edges of the cleaning pad are heat sealed.
    • 用于清洁,平滑或精加工的柔性,形状一致的垫。 垫具有磨料盖和吸收芯。 通过在盖的边缘之间压缩和热密封芯的边缘,将芯的边缘锚固到盖的边缘。 该盖由研磨材料或不同材料的组合制成。 当使用材料的组合时,不同的材料覆盖pa的分开的区域以提供不同的表面。 清洁垫的制造是自动化的,并且通过多个密封和切割装置同时制造多个清洁垫,其同时压缩和热密封未切割盖和芯坯的间隔条,然后压缩条 被切割成多个清洁垫。 在使用两种不同材料的制造方法中,清洁垫的所有四个边缘都被热密封。