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    • 46. 发明申请
    • Methods for making plated through holes usable as interconnection wire or probe attachments
    • 电镀通孔可用作互连线或探头附件的方法
    • US20050108876A1
    • 2005-05-26
    • US10723269
    • 2003-11-26
    • Gaetan MathieuIgor KhandrosCarl Reynolds
    • Gaetan MathieuIgor KhandrosCarl Reynolds
    • G01R1/067G01R1/073G01R3/00H05K3/30H05K3/42H05K3/00H05K13/00
    • H05K3/42G01R1/06711G01R1/07307G01R3/00H05K3/308H05K2201/09836H05K2203/0338Y10T29/49117Y10T29/49139Y10T29/49147Y10T29/49149Y10T29/49156Y10T29/49162Y10T29/49165Y10T29/49169Y10T29/49194
    • Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside. In a third embodiment, a layer of masking material is initially deposited on a substrate and etched to form holes which are filled with a sacrificial fill material, the masking material is then removed, the fill material plated, grinding is performed to remove some plating to expose the fill material, and the fill material is then etched away leaving plated attachment wells. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires.
    • 提供了用于制造用于插入和连接连接器探针的电镀通孔的方法。 在第一种方法中,通过将弯曲的可蚀刻线接合到第一衬底上形成弯曲的电镀通孔,用不可蚀刻的导电材料镀覆电线,用电介质材料包住电镀线以形成第二衬底, 衬底以暴露可蚀刻线,并蚀刻电线以留下镀通孔。 在第二种方法中,首先将涂覆有第一可蚀刻层的线接合到衬底上,然后将第二不可蚀刻镀层施加在第一层上,并且第一层被蚀刻掉,从而通过设置在内部的布线的孔通过电镀。 在第三实施例中,掩模材料层最初沉积在衬底上并被蚀刻以形成填充有牺牲填充材料的孔,然后去除掩模材料,电镀填充材料,进行研磨以除去一些电镀 露出填充材料,然后将填充材料蚀刻掉,留下电镀的连接孔。 探针可以附着到电镀通孔或连接孔,以产生弹性弹簧触点,以形成晶片探针卡组件。 通过将涂覆有电镀材料的扭转牺牲线支撑在基板中,并且随后蚀刻掉线来形成扭曲管镀通孔结构。
    • 47. 发明授权
    • Interconnect assemblies and methods
    • 互连组件和方法
    • US06713374B2
    • 2004-03-30
    • US09752640
    • 2000-12-29
    • Benjamin N. EldridgeGaetan Mathieu
    • Benjamin N. EldridgeGaetan Mathieu
    • H01L2144
    • H01L23/4822H01L24/01H01L2924/01005H01L2924/01006H01L2924/01029H01L2924/12042H01L2924/14H01L2924/00
    • An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion connected to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Various other assemblies and methods are also described below in conjunction with the following figures.
    • 互连组件和用于制造和使用组件的方法。 本发明的一个方面的示例性实施例包括接触元件,其包括适于粘附到基底的基部和连接到基部并从基部延伸的梁部。 梁部分被设计成具有几何形状,当偏转(例如,其形状为三角形)时,几何形状基本上优化横梁部分上的应力,并且适于独立。 本发明的另一方面的示例性实施例涉及形成接触元件的方法。 该方法包括形成基部以粘附到电气组件的基板并形成连接到基部的梁部分。 梁部分从基部延伸并且被设计成具有几何形状,当几何形状偏转时基本上均匀地分布横梁部分的应力,并适于独立。 应当理解,在本发明的某些实施例中,多个接触元件一起用于产生互连组件。 下面结合以下附图描述各种其它组件和方法。