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    • 42. 发明授权
    • Method of manufacturing a semiconductor device
    • US06599785B2
    • 2003-07-29
    • US10078414
    • 2002-02-21
    • Takashi HamadaYasuyuki Arai
    • Takashi HamadaYasuyuki Arai
    • H01L2100
    • H01L27/124G02F1/13454H01L27/1214H01L27/127H01L29/42384
    • TFT structures optimal for driving conditions of a pixel portion and driving circuits are obtained using a small number of photo masks. First through third semiconductor films are formed on a first insulating film. First shape first, second, and third electrodes are formed on the first through third semiconductor films. The first shape first, second, third electrodes are used as masks in first doping treatment to form first concentration impurity regions of one conductivity type in the first through third semiconductor films. Second shape first, second, and third electrodes are formed from the first shape first, second, and third electrodes. A second concentration impurity region of the one conductivity type which overlaps the second shape second electrode is formed in the second semiconductor film in second doping treatment. Also formed in the second doping treatment are third concentration impurity regions of the one conductivity type which are placed in the first and second semiconductor films. Fourth and Fifth concentration impurity regions having the other conductivity type that is opposite to the one conductivity type are formed in the third semiconductor film in third doping treatment.
    • 43. 发明授权
    • Message receiving apparatus and message transmitting and receiving method
    • 消息接收装置和消息发送和接收方法
    • US6092228A
    • 2000-07-18
    • US782165
    • 1997-01-14
    • Noriko TanakaHiroshi UranakaTakashi Hamada
    • Noriko TanakaHiroshi UranakaTakashi Hamada
    • H04W88/02H04W88/18G06F11/00
    • H04W88/185H04W88/022
    • A signal 101 from a transmitting station includes: an address 102 specific to a message receiving apparatus; a specific message 103 that is an advance notice indicating receipt of a large-volume message; and a message main body 105. The message receiving apparatus includes: a receiving section 11 that outputs a data string by demodulating the signal 101; a decoder 13 that subjects the data string to an error correcting process, converts the corrected data string into a message, and makes an address collation; an analyzer 14 that analyzes the message and outputs a control signal to a total control section 16 if the analyzed message is a specific message; a buffer 15 that stores a message main body; and the total control section 16 that stops a peripheral device section 17 in accordance with signals obtained from the decoder and the analyzer and controls display by sending a message in the buffer 15 to the peripheral device section 17.
    • 来自发送站的信号101包括:特定于消息接收装置的地址102; 作为指示接收大容量消息的提前通知的特定消息103; 和消息主体105.消息接收装置包括:接收部分11,通过解调信号101来输出数据串; 对数据串进行纠错处理的解码器13将校正后的数据串变换为消息,进行地址整理; 如果分析的消息是特定消息,则分析器14分析消息并将控制信号输出到总控制部分16; 存储消息主体的缓冲器15; 以及总控制部分16,其根据从解码器和分析器获得的信号停止外围设备部分17,并通过在缓冲器15中向外围设备部分17发送消息来控制显示。
    • 48. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20120007094A1
    • 2012-01-12
    • US13226803
    • 2011-09-07
    • Takashi HAMADAYasuyuki ARAI
    • Takashi HAMADAYasuyuki ARAI
    • H01L33/08
    • H01L27/124G02F1/13454H01L27/1214H01L27/127H01L29/42384
    • A semiconductor device includes a thin film transistor. The thin film transistor includes a semiconductor film over a substrate, in which the semiconductor film includes a pair of first regions, a pair of second regions interposed between the pair of first regions, and a channel formation region interposed between the pair of second regions. A concentration of an impurity in the pair of second regions is smaller than a concentration of the impurity in the pair of first regions. The thin film transistor includes an insulating film, in which a portion of the insulating film is provided over the semiconductor film. The thin film transistor includes a conductive film over the portion, and the conductive film includes a taper shape.
    • 半导体器件包括薄膜晶体管。 薄膜晶体管包括在基板上的半导体膜,其中半导体膜包括一对第一区域,插入在该对第一区域之间的一对第二区域和插入在该对第二区域之间的沟道形成区域。 一对第二区域中的杂质浓度小于该对第一区域中的杂质浓度。 薄膜晶体管包括绝缘膜,其中绝缘膜的一部分设置在半导体膜上。 薄膜晶体管在该部分上包括导电膜,并且导电膜包括锥形。