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41. 发明专利

JP2013033038A Sensor system for differential pressure measurement 有权
标题翻译：用于差压测量的传感器系统
公开(公告)号：JP2013033038A
公开(公告)日：2013-02-14
申请号：JP2012163272
申请日：2012-07-24
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： ERIK EDUARD KROMMENHOEK , FRANK GERALD DANIEL MORSINK , ARNOUT GERBRAND VAN DEN BOS , DAVID J DIPAOLA
IPC分类号： G01L13/00 , G01L23/24
CPC分类号： G01L19/14
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor system for an exhaust conduit of a combustion engine, which can be manufactured easily and has high environmental resistance.SOLUTION: A sensor system comprises an electronics module assembly 5 and a housing assembly for housing the electronics module assembly 5. The electronics module assembly 5 comprises: a sensing element carrier element 8 with a sensing element 10; an electronics module carrier element 7 carrying electronic components, in which electrical connections 7a are provided between the electronics module carrier element 7 and the sensing element carrier element 8; and a main carrier element 6 for supporting the sensing element carrier element 8 and the electronics module carrier element 7.
摘要翻译：要解决的问题：提供一种可以容易地制造并且具有高耐环境性的内燃机的排气管道的压力传感器系统。传感器系统包括电子模块组件5和用于容纳电子模块组件5的壳体组件。电子模块组件5包括：具有传感元件10的感测元件载体元件8; 携带电子部件的电子模块载体元件7，其中电连接7a设置在电子模块载体元件7和感测元件载体元件8之间; 以及用于支撑感测元件载体元件8和电子模块载体元件7的主载体元件6.版权所有（C）2013，JPO＆INPIT

42. 发明专利

JP2013019895A Force sensor assembly and method for assembling force sensor assembly 有权
标题翻译：力传感器总成和装配力传感器总成的方法
公开(公告)号：JP2013019895A
公开(公告)日：2013-01-31
申请号：JP2012148157
申请日：2012-07-02
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： ALEX HUIZINGA , ROBERT SWAYZE , MARTIN PAPERS , BENNY BERKEL
IPC分类号： G01L1/22
CPC分类号： G01L1/2231 , B60T17/22 , G01L5/22 , G01L5/28
摘要： PROBLEM TO BE SOLVED: To provide a force sensor assembly which can be manufactured in an easy, reliable and cost-effective manner, and also provide a method for manufacturing the force sensor assembly.SOLUTION: The force sensor assembly has axis of measurement along an axial direction of the force sensor assembly, and comprises: a force ring 2 provided with at least two sensing elements 3; a printed circuit board 4 having electronic components 5 thereon; a covering plate 6 for holding the printed circuit board 4 onto the force ring 2; and a sensor cap 7 covering the printed circuit board 4 and the covering plate 6 and attached to the force ring 2. The manufacture is easily accomplished using stacking, fixing and welding.
摘要翻译：要解决的问题：提供能够以简单，可靠和成本有效的方式制造的力传感器组件，并且还提供用于制造力传感器组件的方法。解决方案：力传感器组件沿着力传感器组件的轴向具有测量轴线，并且包括：设置有至少两个感测元件3的力环2; 其上具有电子部件5的印刷电路板4; 用于将印刷电路板4保持在力环2上的覆盖板6; 以及覆盖印刷电路板4和覆盖板6并附接到力环2的传感器盖7.可以使用堆叠，固定和焊接容易地实现制造。版权所有（C）2013，JPO＆INPIT

43. 发明专利

JP2012088307A Pressure measuring plug for combustion engine 有权
标题翻译：用于燃油发动机的压力测量插头
公开(公告)号：JP2012088307A
公开(公告)日：2012-05-10
申请号：JP2011218942
申请日：2011-10-03
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： MARK HERALD JOHAN BOLGARS , GROENHUIJZEN SERGE , ZWOLLO CRISTOBAL RUIZ , JAN WILLEM SLOCHESS
IPC分类号： G01L23/22 , G01L23/18
摘要： PROBLEM TO BE SOLVED: To provide a piezo-resistive pressure-measuring plug for a combustion engine for measuring a pressure.SOLUTION: The pressure-measuring plug comprises a plug body (2) and a sensing structure (4). The plug body comprises a threaded plug body part (2a) comprising an external thread for screwing the plug body into a cylinder of the combustion engine, a sealing plug body part (2b) forming a tip of the plug and configured for providing a seal between the plug body and the combustion engine. The plug body further comprises a sensing body part (2c) positioned between the threaded plug body part and the sealing plug body part. The sensing body part is made from one piece and comprises a cylindrical body part (2c1); a moving part (2c2) and the sensing structure. The sensing structure forms a connection between the cylindrical body part and the moving part and allows the moving part to move relatively to the cylindrical body part along a cylinder axis (6) of the cylindrical body part.
摘要翻译：要解决的问题：提供一种用于测量压力的内燃机的压阻式压力测量塞。解决方案：压力测量插头包括插头主体（2）和传感结构（4）。塞体包括螺纹塞体部分（2a），其包括用于将塞体旋入内燃机的气缸的外螺纹，密封塞主体部分（2b），其形成塞头部，塞体和内燃机。插头体还包括位于螺栓塞本体部分和密封塞主体部分之间的感测体部分（2c）。感测体部分由一体制成并包括圆柱体部分（2c1）; 移动部分（2c2）和感测结构。感测结构形成圆柱体部分和运动部分之间的连接，并且允许运动部件沿着圆柱形主体部分的气缸轴线（6）相对于圆柱体部分移动。版权所有（C）2012，JPO＆INPIT

44. 发明专利

JP2009294207A Pressure sensor apparatus 有权
标题翻译：压力传感器装置
公开(公告)号：JP2009294207A
公开(公告)日：2009-12-17
申请号：JP2009130002
申请日：2009-05-29
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： DIPAOLA DAVID J , SILVERIA JEFFREY P
IPC分类号： G01L19/14
CPC分类号： G01L19/003 , G01L19/0084 , G01L19/146 , G01L19/148
摘要： PROBLEM TO BE SOLVED: To provide an accurate pressure sensor reduced in the sizes of the height and diameter.
SOLUTION: A high pressure and small-sized pressure sensor 10 has a cup-shaped housing 12 having an open end closed by a metal substrate 14. A raised stress isolation pedestal portion 14d is formed on the substrate that receives a stress isolation glass pedestal element 18 and in turn a silicon pressure sense element 22, all having closely matched CTEs to minimize temperature inducing stresses. A fluid passageway is formed through the substrate and glass pedestal and an O-ring 15 is placed around the passage on the lower side of the substrate. A flexible circuit having a slit tail formed with two lobes for receiving respectively in the housing and on the substrate allows easy access of a solder iron during assembly. Mounting flanges extend from the substrate to facilitate mounting of the sensor and minimize transfer of mounting stresses to the sense element.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供精确的压力传感器，减小高度和直径的尺寸。解决方案：高压和小型压力传感器10具有杯形壳体12，其具有由金属基底14封闭的开口端。凸起的应力隔离基座部分14d形成在接收应力隔离的基底上玻璃基座元件18和硅压力感测元件22，其全部具有紧密匹配的CTE以最小化温度诱导应力。通过基板和玻璃基座形成流体通道，并且在基板的下侧上的通道周围放置O形环15。具有形成有两个凸角的狭缝尾部的柔性电路分别容纳在壳体和基板上，允许在组装期间容易地访问焊铁。安装凸缘从基板延伸以便于传感器的安装，并将安装应力的传递最小化到感测元件。版权所有（C）2010，JPO＆INPIT

45. 发明专利

JP2009140629A Socket 有权
标题翻译：插座
公开(公告)号：JP2009140629A
公开(公告)日：2009-06-25
申请号：JP2007313167
申请日：2007-12-04
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： TAKAHASHI HIDEYUKI , IKETANI KIYOKAZU
IPC分类号： H01R33/76
CPC分类号： H01R12/7076 , H01R12/7082
摘要： PROBLEM TO BE SOLVED: To provide a socket capable of protecting an upper surface of a semiconductor device from being scratched due to contact by using a latch plate.
SOLUTION: The socket 10 comprises a base member 20, a cover member 30 capable of reciprocatively moving in the direction approaching and separating against the base member 20, a plurality of contacts 40, an adapter 50 capable of moving in the direction approaching and separating against the base member and preparing a mounting surface of a semiconductor package, a latch member 60 rotatably moving by working together with a reciprocating movement of the cover member 30, and the latch plate 70 connected to the latch member 60. The latch plate 70 prevents the tip of the latch member 60 from directly bringing into contact with a BGA, and vertically pushes down the BGA mounted on the adapter 50.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够保护半导体器件的上表面的插座由于通过使用闩锁板的接触而被划伤。解决方案：插座10包括基座构件20，能够在接近和分离基座构件20的方向上往复移动的盖构件30，多个触点40，能够接近的方向移动的适配器50 并且与基座部件分离并制备半导体封装的安装表面，通过与盖构件30的往复运动一起工作而可旋转地移动的闩锁构件60以及连接到闩锁构件60的闩锁板70。 70防止闩锁构件60的尖端直接与BGA接触，并垂直地向下推动安装在适配器50上的BGA。（C）2009年，JPO和INPIT

46. 发明专利

JP2008171749A Socket for semiconductor device 有权
标题翻译：半导体器件插座
公开(公告)号：JP2008171749A
公开(公告)日：2008-07-24
申请号：JP2007005535
申请日：2007-01-15
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： TAKAHASHI HIDEYUKI , IKETANI KIYOKAZU
IPC分类号： H01R33/76 , H01R13/641
摘要： PROBLEM TO BE SOLVED: To provide a socket improved in visibility of a label and marking or the like on the surface of a semiconductor device installed.
SOLUTION: The socket 100 is installed with a semiconductor device 150 of which on one face a plurality of terminals are formed, and comprises a plurality of contacts, a base member 110 which supports the plurality of contacts so that the plurality of contacts may correspond to the terminals of the semiconductor device, and a cover member 120 which is installed on the base member 110 and covers the surface opposed to the one face of the semiconductor device 150 installed over the base member 110. At least a part of the cover member 120 includes a transparent member and a marking area 152 on the surface of the semiconductor device 150 is transmitted through the transparent member.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在安装的半导体器件的表面上提高标签和标记等的可见性的插座。解决方案：插座100安装有半导体器件150，其半导体器件150的一个面上形成有多个端子，并且包括多个触点，基座构件110，其支撑多个触点，使得多个触点可以对应于半导体器件的端子，以及盖构件120，其被安装在基座构件110上并且覆盖与安装在基座构件110上的半导体器件150的与一个面相对的表面。至少一部分盖构件120包括透明构件，并且半导体器件150的表面上的标记区域152透射通过透明构件。版权所有（C）2008，JPO＆INPIT

47. 发明专利

JP2007305586A Thermal reaction electric switch 审中-公开
标题翻译：热反应电开关
公开(公告)号：JP2007305586A
公开(公告)日：2007-11-22
申请号：JP2007125890
申请日：2007-05-10
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： PISUK MICHELLE , LEARY BRIAN , SUBRAMANYAM SAVITHRI , CROWE KEITH E , MASURKAR SAMEER
IPC分类号： H01H37/54 , H01H37/14
CPC分类号： H01H81/02 , H01H37/20 , H01H37/5418 , H01H2011/0075
摘要： PROBLEM TO BE SOLVED: To provide a compact motor protector of large current capacity.
SOLUTION: The motor protector has a generally cup-shaped metallic housing 12 formed by a top wall 12a and a side wall 12b extending downward from perimeter of the top wall, of which free end is welded to a header 14. The side and top walls have a rounded junction and a calibration rill 12e is formed in the top wall from one end of the housing and through the rounded junction. A thermostatic disc 16 has an area to be recessed and deformed in a ring-like tray shape at a center part of the disc. A first end part of the disc is mounted at an inner face of a flat bottom wall and a calibration ridge 12h is adjusted for the area to be deformed. A movable electrical contact 20 is mounted at another end of the disc and moves into and out of engagement with a stationary electrical contact 34 that is in turn mounted on a heater 26.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供大电流容量的紧凑型电机保护器。解决方案：电动机保护器具有由顶壁12a和从顶壁的周边向下延伸的侧壁12b形成的大致杯状的金属壳体12，其自由端被焊接到集管14上。侧面并且顶壁具有圆形的连接点，并且校准轨道12e由壳体的一端并通过圆形连接部形成在顶壁中。恒温盘16具有在盘的中心部分呈凹状变形为环状托盘形状的区域。盘的第一端部安装在平坦的底壁的内表面，并且校准脊12h被调节用于要变形的区域。可移动电触点20安装在盘的另一端，并移动进入和脱离与固定电触点34的接合，固定电触点34又安装在加热器26上。版权所有（C）2008，JPO＆INPIT

48. 发明专利

JP2007147616A Sensor device for measuring pressure and temperature of fluid 有权
标题翻译：用于测量流体压力和温度的传感器装置
公开(公告)号：JP2007147616A
公开(公告)日：2007-06-14
申请号：JP2006313873
申请日：2006-11-21
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： GENNISSEN PAULUS THOMAS JOHANN , BORGERS MARC GERARD JOHAN , ARIE-JAN KOELLING , CRIS RUIZ ZWOLLO , ROGER MARCEL APPELO , KLEISSEN WERNER J PETER
IPC分类号： G01L9/00 , B60H1/32 , F24F11/02
CPC分类号： G01K13/02 , F25B2309/061 , F25B2700/19 , G01K2201/02 , G01L9/0051 , G01L19/003 , G01L19/0092 , G01L19/14
摘要： PROBLEM TO BE SOLVED: To provide a device used in a high temperature range, sealed completely, and capable of detecting combiningly a temperature and pressure. SOLUTION: The present invention discloses the sensor device 1 for measuring the pressure and the temperature of a fluid. The sensor device 1 has a temperature sensitive electric element 3 and a pressure sensitive electric element 6, and the temperature sensitive electric element 3 and the pressure sensitive electric element 6 are coupled respectively to one-sides of metallic membrane structure 4, 16. The metallic membrane structure is arranged to transmit the temperature of the fluid in the other side of the membrane structure 4, 16 to the temperature sensitive electric element 3, and to transmit the pressure of the fluid to the pressure sensitive electric element 6. A combination of a pressure sensor and a temperature sensor is provided by this manner, and is applied for an air conditioner for a vehicle utilizing CO 2 as a refrigerant. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供在高温范围内使用的装置，完全密封，并且能够组合地检测温度和压力。解决方案：本发明公开了一种用于测量流体的压力和温度的传感器装置1。传感器装置1具有感温电感元件3和压敏电元件6，感温电元件3和压敏电元件6分别与金属膜结构体4,6的一侧相连。金属膜结构被布置成将膜结构4,16的另一侧的流体的温度传递到感温电气元件3，并将流体的压力传递到压敏电元件6。通过这种方式提供压力传感器和温度传感器，并将其应用于利用CO 2 作为制冷剂的车辆用空调机。版权所有（C）2007，JPO＆INPIT

49. 发明专利

TWI282193B 固定電子裝置之插槽 SOCKET FOR MOUNTING AN ELECTRONIC DEVICE 失效
简体标题：固定电子设备之插槽 SOCKET FOR MOUNTING AN ELECTRONIC DEVICE
公开(公告)号：TWI282193B
公开(公告)日：2007-06-01
申请号：TW091136218
申请日：2002-12-16
申请人：森薩塔科技公司 SENSATA TECHNOLOGIES, INC.
发明人：佐野英樹 HIDEKI SANO , 池谷清和 KIYOKAZU IKEYA
IPC分类号： H01R
CPC分类号： H01R13/2485 , H01R12/88
摘要：一插槽(10)具有一底座元件(20)，一遮蓋元件(30)安裝成能朝向及遠離底座元件(20)交替動作，複數個接觸件(40)各具有一端點固定到該底座元件(20)，一接觸調節元件(50)其調節該接觸件之可移動端點(42,92)的位置，以及具有一放置表面的轉接器(60)，該轉接器係安裝成可朝向及遠離該接觸調節元件(50)動作。當將轉接器(60)自該接觸調節元件移離時，該接觸件之可移動端點並沒有突出超過該放置表面，而且當轉接器(60)朝向接觸調節元件(50)而移動時，接觸件的可移動端點則自轉接器(60)的各貫穿孔(65)突出，以囓合放置在轉接器(60)上之BGA裝置(11)的銲球。該遮蓋元件係連接到該底座元件，而具有BGA裝置擠壓用尖端(72)的閂扣元件(70)則可隨著遮蓋之移動而轉動。該閂扣元件具有一第一支點(75)以用於第一段運動，以及不同之第二支軸(71)以用於第二段運動。
简体摘要：一插槽(10)具有一底座组件(20)，一遮盖组件(30)安装成能朝向及远离底座组件(20)交替动作，复数个接触件(40)各具有一端点固定到该底座组件(20)，一接触调节组件(50)其调节该接触件之可移动端点(42,92)的位置，以及具有一放置表面的转接器(60)，该转接器系安装成可朝向及远离该接触调节组件(50)动作。当将转接器(60)自该接触调节组件移离时，该接触件之可移动端点并没有突出超过该放置表面，而且当转接器(60)朝向接触调节组件(50)而移动时，接触件的可移动端点则自转接器(60)的各贯穿孔(65)突出，以啮合放置在转接器(60)上之BGA设备(11)的焊球。该遮盖组件系连接到该底座组件，而具有BGA设备挤压用尖端(72)的闩扣组件(70)则可随着遮盖之移动而转动。该闩扣组件具有一第一支点(75)以用于第一段运动，以及不同之第二支轴(71)以用于第二段运动。

50. 发明专利

TW200922011A 插頭轉接器裝置 SOCKET ADAPTOR APPARATUS 审中-公开
简体标题：插头转接器设备 SOCKET ADAPTOR APPARATUS
公开(公告)号：TW200922011A
公开(公告)日：2009-05-16
申请号：TW097124460
申请日：2008-06-30
申请人：森薩塔科技公司 SENSATA TECHNOLOGIES, INC.
发明人：高橋秀幸 TAKAHASHI, HIDEYUKI , 池谷清和 IKEYA, KIYOKAZU
IPC分类号： H01R
CPC分类号： H01R13/112 , G01R1/0483 , H01R12/57 , H01R13/111 , H01R13/2421 , H05K7/1084
摘要：一個以電氣絕緣材料製成的插座轉接器10,包含一個轉接器主體12,其上有複數個貫孔14,每個貫孔包含一個上開孔及一個下開孔。在某些較佳實施例中,每個貫孔14中放置了一支探針60及一個螺旋彈簧62。每支探針60的上端形成一個電氣連接夾具部分68,用以夾住從前述上開孔插入個別貫孔的接點。螺旋彈簧62安裝在每支探針上以將個別探針壓向特定位置,使探針下端形成的針尖得以從下開孔伸出。
简体摘要：一个以电气绝缘材料制成的插座转接器10,包含一个转接器主体12,其上有复数个贯孔14,每个贯孔包含一个上开孔及一个下开孔。在某些较佳实施例中,每个贯孔14中放置了一支探针60及一个螺旋弹簧62。每支探针60的上端形成一个电气连接夹具部分68,用以夹住从前述上开孔插入个别贯孔的接点。螺旋弹簧62安装在每支探针上以将个别探针压向特定位置,使探针下端形成的针尖得以从下开孔伸出。

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