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1. 发明专利

JP2008218117A Socket 有权
标题翻译：插座
公开(公告)号：JP2008218117A
公开(公告)日：2008-09-18
申请号：JP2007052182
申请日：2007-03-02
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： TAKAHASHI HIDEYUKI , IKETANI KIYOKAZU
IPC分类号： H01R33/76 , H01R24/00
摘要： PROBLEM TO BE SOLVED: To provide a high user-friendly low-cost socket reducing the number of components. SOLUTION: The socket comprises a plurality of contact pins 110, a base 130 holding the plurality of contact pins 110, and a cover 150 capable of horizontally moving over the base 130. The contact pin 110 is equipped with a pair of contacts 112 capable of opening and closing by elastic deformation and an extending part extending approximately perpendicularly from the pair of contacts 112. The extending part 114 is held on the base 130 and the pair of contacts 112 is aligned in a recessed area 134 of the main surface 132. When the cover 150 is in the insertion position, a BGA package 200 is mounted on the main surface 132 of the base through the window 160 of the cover 150. When the cover 150 moves to the clamping position, the cover 150 pushes the BGA package and the solder ball 220 is clamped by the pair of contacts 112. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供用户友好的低成本插座，减少组件数量。解决方案：插座包括多个接触针110，保持多个接触针110的基座130和能够在基座130上水平移动的盖150.接触销110配备有一对接点 112，其能够通过弹性变形来打开和关闭，以及从该对触头112大致垂直延伸的延伸部分。延伸部分114保持在基部130上，并且该对触头112对准在主表面的凹陷区域134中当盖150处于插入位置时，BGA封装200通过盖150的窗口160安装在基座的主表面132上。当盖150移动到夹紧位置时，盖150推动 BGA封装和焊球220由一对触点112夹紧。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2009128211A Probe pin 审中-公开
标题翻译： PROBE PIN码
公开(公告)号：JP2009128211A
公开(公告)日：2009-06-11
申请号：JP2007304153
申请日：2007-11-26
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： IKETANI KIYOKAZU
IPC分类号： G01R1/067 , G01R1/073 , G01R31/26 , H01L21/66
CPC分类号： G01R1/06738 , G01R1/06722
摘要： PROBLEM TO BE SOLVED: To provide a probe pin of low cost having a wiping function. SOLUTION: The probe pin 100 comprises an upper plunger 200 and lower plunger 300 formed of a metal plate material, and a coil spring 400. The upper plunger 200 is provided with an opening 210 extending from one end in the longitudinal direction by a certain length and a pair of contact sections 220a and 220b elastically deformable by it. The lower plunger 300 is provided with a contact enlarging section 320 at its one end and an opening 310 extending from the contact enlarging section 320 in the longitudinal direction by a certain length. The upper and lower plungers are arranged so that they cross each other orthogonally, the contact enlarging section 320 is arranged in the opening 210, and an extending section 230 of the upper plunger 200 is arranged in the opening 310. When the upper plunger 200 moves in the direction close to the lower plunger 300, the contact enlarging section 320 enlarges the pair of contact sections 220a and 220, and allows wiping to a contact object. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有擦拭功能的低成本的探针。解决方案：探针100包括由金属板材料形成的上柱塞200和下柱塞300以及螺旋弹簧400.上柱塞200设置有开口210，该开口210从纵向方向上的一端延伸一定的长度和一对可由其弹性变形的接触部分220a和220b。下柱塞300在其一端设置有接触放大部分320，并且在纵向方向上从接触放大部分320延伸一定长度的开口310。上柱塞和下柱塞布置成使它们正交交叉，接触放大部分320布置在开口210中，并且上柱塞200的延伸部分230布置在开口310中。当上柱塞200移动在靠近下柱塞300的方向上，接触放大部分320放大一对接触部分220a和220，并允许擦拭接触物体。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009140629A Socket 有权
标题翻译：插座
公开(公告)号：JP2009140629A
公开(公告)日：2009-06-25
申请号：JP2007313167
申请日：2007-12-04
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： TAKAHASHI HIDEYUKI , IKETANI KIYOKAZU
IPC分类号： H01R33/76
CPC分类号： H01R12/7076 , H01R12/7082
摘要： PROBLEM TO BE SOLVED: To provide a socket capable of protecting an upper surface of a semiconductor device from being scratched due to contact by using a latch plate.
SOLUTION: The socket 10 comprises a base member 20, a cover member 30 capable of reciprocatively moving in the direction approaching and separating against the base member 20, a plurality of contacts 40, an adapter 50 capable of moving in the direction approaching and separating against the base member and preparing a mounting surface of a semiconductor package, a latch member 60 rotatably moving by working together with a reciprocating movement of the cover member 30, and the latch plate 70 connected to the latch member 60. The latch plate 70 prevents the tip of the latch member 60 from directly bringing into contact with a BGA, and vertically pushes down the BGA mounted on the adapter 50.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够保护半导体器件的上表面的插座由于通过使用闩锁板的接触而被划伤。解决方案：插座10包括基座构件20，能够在接近和分离基座构件20的方向上往复移动的盖构件30，多个触点40，能够接近的方向移动的适配器50 并且与基座部件分离并制备半导体封装的安装表面，通过与盖构件30的往复运动一起工作而可旋转地移动的闩锁构件60以及连接到闩锁构件60的闩锁板70。 70防止闩锁构件60的尖端直接与BGA接触，并垂直地向下推动安装在适配器50上的BGA。（C）2009年，JPO和INPIT

4. 发明专利

JP2008171749A Socket for semiconductor device 有权
标题翻译：半导体器件插座
公开(公告)号：JP2008171749A
公开(公告)日：2008-07-24
申请号：JP2007005535
申请日：2007-01-15
申请人： Sensata Technologies Inc , センサータテクノロジーズインコーポレーテッド
发明人： TAKAHASHI HIDEYUKI , IKETANI KIYOKAZU
IPC分类号： H01R33/76 , H01R13/641
摘要： PROBLEM TO BE SOLVED: To provide a socket improved in visibility of a label and marking or the like on the surface of a semiconductor device installed.
SOLUTION: The socket 100 is installed with a semiconductor device 150 of which on one face a plurality of terminals are formed, and comprises a plurality of contacts, a base member 110 which supports the plurality of contacts so that the plurality of contacts may correspond to the terminals of the semiconductor device, and a cover member 120 which is installed on the base member 110 and covers the surface opposed to the one face of the semiconductor device 150 installed over the base member 110. At least a part of the cover member 120 includes a transparent member and a marking area 152 on the surface of the semiconductor device 150 is transmitted through the transparent member.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在安装的半导体器件的表面上提高标签和标记等的可见性的插座。解决方案：插座100安装有半导体器件150，其半导体器件150的一个面上形成有多个端子，并且包括多个触点，基座构件110，其支撑多个触点，使得多个触点可以对应于半导体器件的端子，以及盖构件120，其被安装在基座构件110上并且覆盖与安装在基座构件110上的半导体器件150的与一个面相对的表面。至少一部分盖构件120包括透明构件，并且半导体器件150的表面上的标记区域152透射通过透明构件。版权所有（C）2008，JPO＆INPIT

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