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    • 1. 发明专利
    • Pressure sensor apparatus
    • 压力传感器装置
    • JP2009294207A
    • 2009-12-17
    • JP2009130002
    • 2009-05-29
    • Sensata Technologies Incセンサータ テクノロジーズ インコーポレーテッド
    • DIPAOLA DAVID JSILVERIA JEFFREY P
    • G01L19/14
    • G01L19/003G01L19/0084G01L19/146G01L19/148
    • PROBLEM TO BE SOLVED: To provide an accurate pressure sensor reduced in the sizes of the height and diameter.
      SOLUTION: A high pressure and small-sized pressure sensor 10 has a cup-shaped housing 12 having an open end closed by a metal substrate 14. A raised stress isolation pedestal portion 14d is formed on the substrate that receives a stress isolation glass pedestal element 18 and in turn a silicon pressure sense element 22, all having closely matched CTEs to minimize temperature inducing stresses. A fluid passageway is formed through the substrate and glass pedestal and an O-ring 15 is placed around the passage on the lower side of the substrate. A flexible circuit having a slit tail formed with two lobes for receiving respectively in the housing and on the substrate allows easy access of a solder iron during assembly. Mounting flanges extend from the substrate to facilitate mounting of the sensor and minimize transfer of mounting stresses to the sense element.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供精确的压力传感器,减小高度和直径的尺寸。 解决方案:高压和小型压力传感器10具有杯形壳体12,其具有由金属基底14封闭的开口端。凸起的应力隔离基座部分14d形成在接收应力隔离的基底上 玻璃基座元件18和硅压力感测元件22,其全部具有紧密匹配的CTE以最小化温度诱导应力。 通过基板和玻璃基座形成流体通道,并且在基板的下侧上的通道周围放置O形环15。 具有形成有两个凸角的狭缝尾部的柔性电路分别容纳在壳体和基板上,允许在组装期间容易地访问焊铁。 安装凸缘从基板延伸以便于传感器的安装,并将安装应力的传递最小化到感测元件。 版权所有(C)2010,JPO&INPIT