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41. 发明授权

US08503160B2 Laminate type ceramic electronic component and manufacturing method therefor 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US08503160B2
公开(公告)日：2013-08-06
申请号：US13208416
申请日：2011-08-12
申请人： Masahito Saruban , Makoto Ogawa , Akihiro Motoki , Takehisa Sasabayashi , Takayuki Kayatani
发明人： Masahito Saruban , Makoto Ogawa , Akihiro Motoki , Takehisa Sasabayashi , Takayuki Kayatani
IPC分类号： H01G4/228 , H01G7/00
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度。为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积组件主体的端面。然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

42. 发明授权

US08319594B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08319594B2
公开(公告)日：2012-11-27
申请号：US13354369
申请日：2012-01-20
申请人： Koji Sato , Yukio Sanada , Makoto Ogawa , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Makoto Ogawa , Yasuhiro Nishisaka
IPC分类号： H01F5/00
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1≦t/d≦0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.
摘要翻译：陶瓷电子部件包括陶瓷体，第一外部电极和第二外部电极。第一外部电极和第二外部电极被设置在陶瓷体的朝向安装面侧的主面上，以便在它们之间以预定的间隙区域彼此面对。外部电极各自包括基层和覆盖基层的Cu镀层。在第一外部电极和第二外部电极中的每一个中，满足表达式0.1＆nlE; t / d＆nlE; 0.5，其中t是在间隙区域侧的基底层的端部处的Cu镀层的厚度，d是从间隙区域侧的基底层的端部到间隙区域侧的Cu镀层的端部的距离。

43. 发明授权

US08315036B2 Ceramic electronic component and method for manufacturing the same 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US08315036B2
公开(公告)日：2012-11-20
申请号：US12405399
申请日：2009-03-17
申请人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.
摘要翻译：陶瓷电子部件包括陶瓷体和设置在陶瓷体的表面的多个外部电极。外部电极包括含有各自涂覆有金属膜的玻璃颗粒的镀层。镀层通过电镀金属和金属涂覆的玻璃颗粒的共沉积形成。

44. 发明申请

US20120236461A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20120236461A1
公开(公告)日：2012-09-20
申请号：US13419545
申请日：2012-03-14
申请人： Yoji YAMAMOTO , Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Yoji YAMAMOTO , Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/008 , H01C7/13 , H01L41/047 , H01F5/00
CPC分类号： H01C7/008 , H01C1/14 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译：陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。

45. 发明授权

US08254081B2 Laminated ceramic electronic component and manufacturing method thereof 有权
标题翻译：层压陶瓷电子部件及其制造方法
公开(公告)号：US08254081B2
公开(公告)日：2012-08-28
申请号：US12617879
申请日：2009-11-13
申请人： Seiichi Nishihara , Shuji Matsumoto , Akihiro Motoki , Makoto Ogawa
发明人： Seiichi Nishihara , Shuji Matsumoto , Akihiro Motoki , Makoto Ogawa
IPC分类号： H01G4/00
CPC分类号： H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.
摘要翻译：在层叠陶瓷电子部件中，通过在部件主体的外表面上直接进行电镀处理，在其上形成外部电极，试图提高形成外部电极的镀膜之间的粘合强度和组件主体。将包含Ti的钎料施加到其上形成有组分主体的外部电极的表面的至少一部分，并且通过烘烤该钎焊材料，形成含有Ti的金属层。此外，外部电极通过电镀工艺形成，以便至少涂覆金属层，然后进行加热处理，以使金属层和形成外部电极的镀膜之间产生反扩散。

46. 发明申请

US20120169180A1 LAMINATE TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型电子元件及其制造方法
公开(公告)号：US20120169180A1
公开(公告)日：2012-07-05
申请号：US13337445
申请日：2011-12-27
申请人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
发明人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
IPC分类号： H01L41/00 , H01F5/00 , B05D3/02 , H01C7/10 , B05D5/12 , H01G4/12 , H01C7/13
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30
摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
摘要翻译：在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。

47. 发明授权

US08194391B2 Multilayer ceramic electronic component and manufacturing method thereof 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08194391B2
公开(公告)日：2012-06-05
申请号：US12340570
申请日：2008-12-19
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
IPC分类号： H01G4/20 , H01G4/06 , B05D5/12
CPC分类号： H01G4/12 , H01G4/005 , H01G4/232
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译：提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

48. 发明授权

US08149566B2 Laminated electronic component and manufacturing method therefor 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08149566B2
公开(公告)日：2012-04-03
申请号：US12781058
申请日：2010-05-17
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
IPC分类号： H01G4/008
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.
摘要翻译：层叠电子部件的制造方法包括以下步骤：制备具有层叠结构的部件主体，所述部件主体包括形成在其中的多个内部电极，所述内部电极部分地露出在所述内部电极的外表面上并且在所述部件主体的外表面上形成外部端子电极，使得所述外部端子电极与所述内部电极电连接。形成外部端子电极的步骤包括以下步骤：在组件主体的内部电极的暴露的表面上形成第一镀层，至少在第一镀层的表面上以及在第一镀层的表面上施加防水剂在第一镀层的端边缘所在的部件主体的外表面，然后在其上施加有防水剂的第一镀层上形成第二镀层。

49. 发明授权

US08139342B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08139342B2
公开(公告)日：2012-03-20
申请号：US12466393
申请日：2009-05-15
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
IPC分类号： H01G4/228
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

50. 发明申请

US20120039015A1 LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型陶瓷电子元件及其制造方法
公开(公告)号：US20120039015A1
公开(公告)日：2012-02-16
申请号：US13208416
申请日：2011-08-12
申请人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
发明人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
IPC分类号： H01G4/30 , H01G7/00
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度。为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积组件主体的端面。然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

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