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    • 41. 发明申请
    • FINFET INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
    • FINFET集成电路及其制造方法
    • US20120292672A1
    • 2012-11-22
    • US13111741
    • 2011-05-19
    • Jin CHO
    • Jin CHO
    • H01L29/772H01L21/336
    • H01L21/823431H01L29/66795H01L29/785H01L2924/0002H01L2924/00
    • FINFET ICs and methods for their fabrication are provided. In accordance with one embodiment a FINFET IC is fabricated by forming in a substrate a region doped with an impurity of a first doping type. The substrate region is etched to form a recess defining a fin having a height and sidewalls and the recess adjacent the fin is filled with an insulator having a thickness less than the height. Spacers are formed on the sidewalls and a portion of the insulator is etched to expose a portion of the sidewalls. The exposed portion of the sidewalls is doped with an impurity of the first doping type, the exposed sidewalls are oxidized, and the sidewall spacers are removed. A gate insulator and gate electrode are formed overlying the fin, and end portions of the fin are doped with an impurity of a second doping type to form source and drain regions.
    • 提供FINFET IC及其制造方法。 根据一个实施例,通过在衬底中形成掺杂有第一掺杂类型的杂质的区域来制造FINFET IC。 蚀刻衬底区域以形成限定具有高度和侧壁的翅片的凹部,并且与翅片相邻的凹部填充有厚度小于该高度的绝缘体。 隔板形成在侧壁上,并且绝缘体的一部分被蚀刻以暴露侧壁的一部分。 侧壁的暴露部分掺杂有第一掺杂类型的杂质,暴露的侧壁被氧化,并且去除侧壁间隔物。 栅极绝缘体和栅电极形成在鳍的上方,并且鳍的端部掺杂有第二掺杂类型的杂质以形成源极和漏极区。
    • 48. 发明申请
    • HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE
    • 电源转换模块的散热装置
    • US20120103589A1
    • 2012-05-03
    • US13037803
    • 2011-03-01
    • Young Ho SohnKyu Bum HanYoung Jin ChoSeog Moon Choi
    • Young Ho SohnKyu Bum HanYoung Jin ChoSeog Moon Choi
    • F28F7/00
    • H05K7/209H05K7/20409
    • Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.
    • 这里公开了一种用于电力转换模块的散热装置。 该装置包括壳体,高散热散热器和电路板。 壳体包括散热翅片单元,其散热片布置在彼此间隔预定间隔的位置处。 壳体在其中具有安装空间。 高散热散热器安装在外壳的安装空间中。 电路板耦合到壳体的下表面。 因此,可以减小散热装置的重量和尺寸。 此外,散热片和具有散热片的壳体同时散热,从而提高散热效率。 此外,在最佳设计中,高散热散热器位于与产生高热量的部分相对应的位置,从而可以使散热效率最大化。