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1. 发明申请

US20120103589A1 HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE 有权
标题翻译：电源转换模块的散热装置
公开(公告)号：US20120103589A1
公开(公告)日：2012-05-03
申请号：US13037803
申请日：2011-03-01
申请人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
发明人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
IPC分类号： F28F7/00
CPC分类号： H05K7/209 , H05K7/20409
摘要： Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.
摘要翻译：这里公开了一种用于电力转换模块的散热装置。该装置包括壳体，高散热散热器和电路板。壳体包括散热翅片单元，其散热片布置在彼此间隔预定间隔的位置处。壳体在其中具有安装空间。高散热散热器安装在外壳的安装空间中。电路板耦合到壳体的下表面。因此，可以减小散热装置的重量和尺寸。此外，散热片和具有散热片的壳体同时散热，从而提高散热效率。此外，在最佳设计中，高散热散热器位于与产生高热量的部分相对应的位置，从而可以使散热效率最大化。

2. 发明授权

US08630090B2 Heat dissipation device for power conversion module 有权
标题翻译：电源转换模块散热装置
公开(公告)号：US08630090B2
公开(公告)日：2014-01-14
申请号：US13037803
申请日：2011-03-01
申请人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
发明人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
IPC分类号： H05K7/20 , H05K5/00 , G06F1/20
CPC分类号： H05K7/209 , H05K7/20409
摘要： Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.
摘要翻译：这里公开了一种用于电力转换模块的散热装置。该装置包括壳体，高散热散热器和电路板。壳体包括散热翅片单元，其散热片布置在彼此间隔预定间隔的位置处。壳体在其中具有安装空间。高散热散热器安装在外壳的安装空间中。电路板耦合到壳体的下表面。因此，可以减小散热装置的重量和尺寸。此外，散热片和具有散热片的壳体同时散热，从而提高散热效率。此外，在最佳设计中，高散热散热器位于与产生高热量的部分相对应的位置，从而可以使散热效率最大化。

3. 发明申请

US20110088928A1 HEAT DISSIPATING SUBSTRATE 审中-公开
标题翻译：热消散基板
公开(公告)号：US20110088928A1
公开(公告)日：2011-04-21
申请号：US12631640
申请日：2009-12-04
申请人： Chang Hyun LIM , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Young Ho Sohn
发明人： Chang Hyun LIM , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Young Ho Sohn
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0262 , H05K1/0263 , H05K1/053 , H05K3/44 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/09345 , H05K2201/09509 , H05K2201/09554 , H05K2203/0315
摘要： Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer.
摘要翻译：公开了一种散热基板，其包括金属板，形成在金属板的表面上的绝缘膜，形成在绝缘膜上的电路图案，以及形成为穿过金属板的至少一部分的第一通孔使得金属板和电路图形彼此电连接，并且还表现出优异的散热效果，并且由于不需要另外提供接地层和功率层，能够使电路板的构造简单。

4. 发明申请

US20110042699A1 Substrate for light emitting diode package and light emitting diode package having the same 审中-公开
标题翻译：用于发光二极管封装的衬底和具有该发光二极管封装的发光二极管封装
公开(公告)号：US20110042699A1
公开(公告)日：2011-02-24
申请号：US12654431
申请日：2009-12-18
申请人： Sung Keun Park , Seog Moon Choi , Young Ho Sohn , Tae Hyun Kim , Young Ki Lee
发明人： Sung Keun Park , Seog Moon Choi , Young Ho Sohn , Tae Hyun Kim , Young Ki Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/97 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/4848 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014 , H01L2924/00 , H01L2224/48465
摘要： A substrate for a light emitting diode (LED) package, and an LED package having the same are disclosed. The substrate for an LED package includes: a metal plate; an insulation oxide layer formed on a portion of the surface of the metal plate; a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode mounting area; and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern. In the substrate for an LED package, because regions of the insulation oxide layer other than regions for insulating conductive patterns are removed, heat generated from the light emitting diode can be effectively released. In addition, degradation of reflexibility and luminance of the LED due to the insulation oxide layer can be prevented.
摘要翻译：公开了一种用于发光二极管（LED）封装的衬底和具有该衬底的LED封装。用于LED封装的衬底包括：金属板; 绝缘氧化物层，形成在所述金属板的所述表面的一部分上; 形成在所述绝缘氧化物层的一个区域并提供发光二极管安装区域的第一导电图案; 以及形成在所述绝缘氧化物层的另一区域处的第二导电图案，使得其与所述第一导电图案分离。在LED封装用基板中，除去绝缘性导电图案以外的绝缘氧化物层的区域，能够有效地释放从发光二极管产生的热量。此外，可以防止由于绝缘氧化物层导致的LED的反射性和亮度的劣化。

5. 发明申请

US20100294543A1 HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：散热基板及其制造方法
公开(公告)号：US20100294543A1
公开(公告)日：2010-11-25
申请号：US12539527
申请日：2009-08-11
申请人： Young Ho Sohn , Seog Moon Choi , Sung Keun Park , Young Ki Lee , Bum Sik Jang , Ji Hyun Park
发明人： Young Ho Sohn , Seog Moon Choi , Sung Keun Park , Young Ki Lee , Bum Sik Jang , Ji Hyun Park
IPC分类号： H05K1/00 , B05D5/12
CPC分类号： H05K3/4623 , H05K1/056 , H05K3/429 , H05K3/445 , H05K3/4641 , H05K2201/09536 , H05K2201/0959 , H05K2201/096
摘要： Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.
摘要翻译：本发明公开了一种散热基板，其结构是将两个分别包含发热功能的金属芯片的两层芯基板彼此并联并相互并联，从而实现更好的辐射性能，制造相同。

6. 发明授权

US09153514B2 Power module package 有权
标题翻译：电源模块封装
公开(公告)号：US09153514B2
公开(公告)日：2015-10-06
申请号：US13610680
申请日：2012-09-11
申请人： Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
发明人： Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
IPC分类号： H01L29/72 , H01L23/31 , H01L23/373 , H01L23/433 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 第二基板，与第一基板的一个表面接触; 第三基板，其接触所述第一基板的另一表面的一侧; 与所述第一基板的另一表面的另一侧接触的第一引线框架; 以及电连接到第三基板的第二引线框架。

7. 发明申请

US20140001611A1 SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装
公开(公告)号：US20140001611A1
公开(公告)日：2014-01-02
申请号：US13613797
申请日：2012-09-13
申请人： Eun Jung Jo , Jae Hyun Lim , Tae Hyun Kim , Young Ho Sohn
发明人： Eun Jung Jo , Jae Hyun Lim , Tae Hyun Kim , Young Ho Sohn
IPC分类号： H01L23/495
CPC分类号： H01L23/49531 , H01L23/49537 , H01L23/49575 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014 , H01L2224/49111
摘要： There is provided a semiconductor package capable of significantly reducing a size of a power semiconductor package including a power semiconductor device and a control device. The semiconductor package includes a lead frame including a first frame and a second frame; at least one first electronic device mounted on the first frame; a substrate engaged with the second frame and having one surface on which a wiring pattern is formed; and at least one second electronic device mounted on the substrate and electrically connected to the wiring pattern, a portion of the wiring pattern electrically connected to the at least one second electronic device being formed to have a line width smaller than an internal lead of the lead frame.
摘要翻译：提供了能够显着地减小包括功率半导体器件和控制装置的功率半导体封装的尺寸的半导体封装。所述半导体封装包括引线框架，所述引线框架包括第一框架和第二框架; 安装在第一框架上的至少一个第一电子装置; 基板，与所述第二框架接合并且具有形成有布线图案的一个表面; 以及安装在所述基板上并电连接到所述布线图案的至少一个第二电子设备，所述布线图案的电连接到所述至少一个第二电子设备的部分形成为具有小于所述引线的内部引线的线宽帧。

8. 发明申请

US20130343002A1 HEAT DISSIPATION SYSTEM FOR POWER MODULE 有权
标题翻译：电源模块散热系统
公开(公告)号：US20130343002A1
公开(公告)日：2013-12-26
申请号：US13609958
申请日：2012-09-11
申请人： Kwang Soo Kim , Do Jae Yoo , Young Ho Sohn , Bum Seok Suh , In Wha Jeong
发明人： Kwang Soo Kim , Do Jae Yoo , Young Ho Sohn , Bum Seok Suh , In Wha Jeong
IPC分类号： H05K7/20 , F28D15/00 , F28D1/04
CPC分类号： F28F3/12 , F28D2021/0028 , F28F13/06 , H01L2924/00 , H01L2924/0002 , H05K7/20927
摘要： Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.
摘要翻译：本文公开了一种用于功率模块的散热系统，包括：第一冷却介质流动部分和允许冷却介质分别在第一和第二方向上流动的第二冷却介质流动部分。

9. 发明授权

US08629538B2 Power module package 失效
标题翻译：电源模块封装
公开(公告)号：US08629538B2
公开(公告)日：2014-01-14
申请号：US13316072
申请日：2011-12-09
申请人： Young Ki Lee , Young Ho Sohn , Kwang Soo Kim , Chang Hyun Lim
发明人： Young Ki Lee , Young Ho Sohn , Kwang Soo Kim , Chang Hyun Lim
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L23/49531 , H01L23/49537 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/29187 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one side of one surface of the first substrate; and a first lead frame contacting the other side of one surface of the first substrate. The power module package further includes: a first metal layer formed on one side of one surface of the first substrate; a first bonding layer formed on the first metal layer and contacting a lower surface of the second substrate; a second metal layer formed on the other side of one surface of the first substrate; and a second bonding layer formed on the second metal layer and contacting a lower surface of the first lead frame.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 第二基板，其接触所述第一基板的一个表面的一侧; 以及与第一基板的一个表面的另一侧接触的第一引线框架。功率模块封装还包括：形成在第一衬底的一个表面的一侧上的第一金属层; 第一接合层，形成在所述第一金属层上并与所述第二基板的下表面接触; 形成在所述第一基板的一个表面的另一侧上的第二金属层; 以及形成在所述第二金属层上并与所述第一引线框架的下表面接触的第二接合层。

10. 发明申请

US20130343001A1 HEAT DISSIPATION SYSTEM FOR POWER MODULE 有权
标题翻译：电源模块散热系统
公开(公告)号：US20130343001A1
公开(公告)日：2013-12-26
申请号：US13588734
申请日：2012-08-17
申请人： Young Hoon Kwak , Jong Man Kim , Young Ho Sohn
发明人： Young Hoon Kwak , Jong Man Kim , Young Ho Sohn
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
摘要翻译：本发明公开了一种用于功率模块的散热系统，该散热系统包括：彼此相对隔开的第一和第二散热板，形成冷却介质流动通道; 第一和第二流入管线延伸到第一和第二散热板的冷却介质流动通道，以将流过其中的不同流量或不同通量的冷却介质转移到冷却介质流动通道; 以及分别与第一和第二流入管线连接的第一和第二入口，以允许冷却介质流入其中。

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