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41. 发明申请

US20080121902A1 Small footprint high power light emitting package with plurality of light emitting diode chips 审中-公开
标题翻译：具有多个发光二极管芯片的小尺寸大功率发光封装
公开(公告)号：US20080121902A1
公开(公告)日：2008-05-29
申请号：US11517053
申请日：2006-09-07
申请人： Michael Sackrison , Xiang Gao , Srinath K. Aanegola , Hari S. Venugopalan
发明人： Michael Sackrison , Xiang Gao , Srinath K. Aanegola , Hari S. Venugopalan
IPC分类号： H01L33/00
CPC分类号： H01L25/0756 , H01L25/0753 , H01L33/0079 , H01L2924/0002 , H01L2924/00
摘要： A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222).
摘要翻译：发光包装包括限定支撑表面（14）的支撑件（12,112,212）。第一发光二极管芯片（20,120,220）固定到支撑表面并且被配置为发射具有第一光谱分布的光。第二发光二极管芯片（22,122,123,222）固定到第一发光二极管芯片。第二发光二极管芯片被配置为发射具有与第一光谱分布不同的第二光谱分布的光。可选地，第三发光二极管芯片（223）设置在第二发光二极管芯片（222）上。

42. 发明申请

US20070087250A1 Alloy for fuel cell interconnect 审中-公开
标题翻译：燃料电池互联合金
公开(公告)号：US20070087250A1
公开(公告)日：2007-04-19
申请号：US11249852
申请日：2005-10-13
申请人： Daniel Lewis , Melvin Jackson , Canan Hardwicke , Anthony Tohmpson , Sheela Ramasesha , Hari S. , Aravind Chinchure , Kaushik Vaidya , Amitabh Verma
发明人： Daniel Lewis , Melvin Jackson , Canan Hardwicke , Anthony Tohmpson , Sheela Ramasesha , Hari S. , Aravind Chinchure , Kaushik Vaidya , Amitabh Verma
IPC分类号： H01M8/02 , C22C38/22
CPC分类号： H01M8/021 , C22C38/22
摘要： An alloy for an interconnect for a fuel cell is provided. The alloy comprises iron at least about 60 weight percent, chromium in the range of about 15 to about 30 weight percent and tungsten in the range of about 3 to about 4.5 weight percent. The alloy also includes at least one element selected from the group consisting of aluminum, yttrium, zirconium, lanthanum, manganese, molybdenum, nickel, vanadium, tantalum, and titanium.
摘要翻译：提供了一种用于燃料电池的互连的合金。该合金包含铁至少约60重量％，铬在约15至约30重量％范围内，钨在约3至约4.5重量％的范围内。该合金还包括选自铝，钇，锆，镧，锰，钼，镍，钒，钽和钛中的至少一种元素。

43. 发明授权

US07141828B2 Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact 有权
公开(公告)号：US07141828B2
公开(公告)日：2006-11-28
申请号：US10249163
申请日：2003-03-19
申请人： Hari S. Venugopalan
发明人： Hari S. Venugopalan
IPC分类号： H01L33/00
CPC分类号： H01L33/40 , H01L33/32 , H01L2224/14 , H01L2224/16225
摘要： A p-type contact (30) is disclosed for flip chip bonding and electrically contacting a p-type group III-nitride layer (28) of a group III-nitride flip chip light emitting diode die (10) with a bonding pad (60). A first palladium layer (42) is disposed on the p-type group III-nitride layer (28). The first palladium layer (42) is diffused through a native oxide of the p-type group III-nitride layer (28) to make electrical contact with the p-type group III-nitride layer (28). A reflective silver layer (44) is disposed on the first palladium layer (42). A second palladium layer (46) is disposed on the silver layer (44). A bonding stack (48) including at least two layers (50, 52, 54) is disposed on the second palladium layer (46). The bonding stack (48) is adapted for flip chip bonding the p-type layer (28) to the bonding pad (60).

44. 发明授权

US09131899B2 Efficient handling of misaligned loads and stores 有权
标题翻译：高效处理不对齐的负载和商店
公开(公告)号：US09131899B2
公开(公告)日：2015-09-15
申请号：US13177192
申请日：2011-07-06
申请人： Hari S. Kannan , Pradeep Kanapathipillai , Greg M. Hess
发明人： Hari S. Kannan , Pradeep Kanapathipillai , Greg M. Hess
IPC分类号： G06F12/00 , A61B5/00 , A61B5/053 , A61N1/05 , A61N1/362 , G06F12/08
CPC分类号： A61B5/686 , A61B5/0538 , A61B5/4836 , A61B5/7275 , A61N1/05 , A61N1/362 , G06F12/0802 , G06F12/0862 , G06F12/0877
摘要： A system and method for efficiently handling misaligned memory accesses within a processor. A processor comprises a load-store unit (LSU) with a banked data cache (d-cache) and a banked store queue. The processor generates a first address corresponding to a memory access instruction identifying a first cache line. The processor determines the memory access is misaligned which crosses over a cache line boundary. The processor generates a second address identifying a second cache line logically adjacent to the first cache line. If the instruction is a load instruction, the LSU simultaneously accesses the d-cache and store queue with the first and the second addresses. If there are two hits, the data from the two cache lines are simultaneously read out. If the access is a store instruction, the LSU separates associated write data into two subsets and simultaneously stores these subsets in separate cache lines in separate banks of the store queue.
摘要翻译：一种用于有效地处理处理器内的未对准存储器访问的系统和方法。处理器包括具有分组数据高速缓存（d-cache）和分组存储队列的加载存储单元（LSU）。处理器产生对应于识别第一高速缓存行的存储器访问指令的第一地址。处理器确定在高速缓存线边界上跨越的存储器访问未对准。处理器生成标识逻辑上与第一高速缓存线相邻的第二高速缓存线的第二地址。如果指令是加载指令，则LSU同时访问d-cache并存储具有第一和第二地址的队列。如果有两个命中，则同时读出来自两条缓存行的数据。如果访问是存储指令，则LSU将相关联的写入数据分成两个子集，并且将这些子集同时存储在存储队列的单独的存储区中的单独的高速缓存行中。

45. 发明申请

US20130013862A1 EFFICIENT HANDLING OF MISALIGNED LOADS AND STORES 有权
标题翻译：有效处理缺陷货物和仓库
公开(公告)号：US20130013862A1
公开(公告)日：2013-01-10
申请号：US13177192
申请日：2011-07-06
申请人： Hari S. Kannan , Pradeep Kanapathipillai , Greg M. Hess
发明人： Hari S. Kannan , Pradeep Kanapathipillai , Greg M. Hess
IPC分类号： G06F12/08
CPC分类号： A61B5/686 , A61B5/0538 , A61B5/4836 , A61B5/7275 , A61N1/05 , A61N1/362 , G06F12/0802 , G06F12/0862 , G06F12/0877
摘要： A system and method for efficiently handling misaligned memory accesses within a processor. A processor comprises a load-store unit (LSU) with a banked data cache (d-cache) and a banked store queue. The processor generates a first address corresponding to a memory access instruction identifying a first cache line. The processor determines the memory access is misaligned which crosses over a cache line boundary. The processor generates a second address identifying a second cache line logically adjacent to the first cache line. If the instruction is a load instruction, the LSU simultaneously accesses the d-cache and store queue with the first and the second addresses. If there are two hits, the data from the two cache lines are simultaneously read out. If the access is a store instruction, the LSU separates associated write data into two subsets and simultaneously stores these subsets in separate cache lines in separate banks of the store queue.
摘要翻译：一种用于有效地处理处理器内的未对准存储器访问的系统和方法。处理器包括具有分组数据高速缓存（d-cache）和分组存储队列的加载存储单元（LSU）。处理器产生对应于识别第一高速缓存行的存储器访问指令的第一地址。处理器确定在高速缓存线边界上跨越的存储器访问未对准。处理器生成标识逻辑上与第一高速缓存线相邻的第二高速缓存线的第二地址。如果指令是加载指令，则LSU同时访问d-cache并存储具有第一和第二地址的队列。如果有两个命中，则同时读出来自两条缓存行的数据。如果访问是存储指令，则LSU将相关联的写入数据分成两个子集，并且将这些子集同时存储在存储队列的单独的存储区中的单独的高速缓存行中。

46. 发明授权

US08104043B2 System and method for dynamic cooperative distributed execution of computer tasks without a centralized controller 有权
标题翻译：没有集中控制器的计算机任务的动态协同分布式执行的系统和方法
公开(公告)号：US08104043B2
公开(公告)日：2012-01-24
申请号：US10720893
申请日：2003-11-24
申请人： Sivaprasad Padisetty , Shankar Manian , Hari S. Narayan
发明人： Sivaprasad Padisetty , Shankar Manian , Hari S. Narayan
IPC分类号： G06F9/46
CPC分类号： G06F9/5038 , H04L67/10
摘要： A system and method is provided for cooperative execution of distributed tasks by networked computers without the use of a centralized controller to coordinate the task execution. Each computer has an execution agent that cooperates with the execution agents of the other computers to carry out the execution of a given sequence of tasks. The execution instructions for the task sequence are provided to a first computer in the selected set of computers for task execution. The first computer processes the instructions and forwards them to its peer computers so that each of them knows the tasks it is to perform in connection with the tasks of the other computers. The computers then executes the tasks assigned to them and use peer-to-peer communications to provide status update to their peer computers to synchronize and coordinate the task execution.
摘要翻译：提供了一种系统和方法，用于通过网络计算机协调执行分布式任务，而不使用集中控制器来协调任务执行。每个计算机具有与其他计算机的执行代理协作以执行给定的任务序列的执行代理。将任务序列的执行指令提供给用于任务执行的所选择的计算机组中的第一计算机。第一台计算机处理指令并将其转发给对等计算机，以便每个计算机都知道与其他计算机的任务相关的任务。然后，计算机执行分配给它们的任务，并使用对等通信来向其对等计算机提供状态更新以同步和协调任务执行。

47. 发明授权

US07843074B2 Underfill for light emitting device 有权
标题翻译：发光装置的底部填充物
公开(公告)号：US07843074B2
公开(公告)日：2010-11-30
申请号：US11519402
申请日：2006-09-12
申请人： Xiang Gao , Michael Sackrison , Hari S. Venugopalan
发明人： Xiang Gao , Michael Sackrison , Hari S. Venugopalan
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L33/62 , H01L24/73 , H01L33/44 , H01L2224/16 , H01L2224/48091 , H01L2224/48463 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/12036 , H01L2924/12041 , H01S5/02272 , H01L2924/00 , H01L2224/0401
摘要： A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.
摘要翻译：发光芯片设置在支撑表面上。多个接合凸块设置在发光芯片和支撑表面之间的间隙中。多个接合凸块提供至少一个电功率输入路径到发光芯片。包含底部填充材料的底部填充剂设置在发光芯片和支撑表面之间的间隙中，使得底部填充剂基本上填充间隙，但是不形成在发光芯片的侧壁上延伸到间隙外侧的圆角。底部填充物被配置为提供（i）发光芯片的机械支撑和（ii）从发光芯片到支撑表面的热传导路径中的至少一个。

48. 发明授权

US07484363B2 Wind energy harnessing apparatuses, systems, methods, and improvements 有权
标题翻译：风能利用装置，系统，方法和改进
公开(公告)号：US07484363B2
公开(公告)日：2009-02-03
申请号：US11584409
申请日：2006-10-19
申请人： Michael T. Reidy , Hari S. Iyer , Jarmo Monttinen
发明人： Michael T. Reidy , Hari S. Iyer , Jarmo Monttinen
IPC分类号： F03B13/10 , H02K7/18
CPC分类号： F03D9/257 , F03D1/04 , F03D3/02 , F03D3/0427 , F03D9/00 , F03D9/007 , F03D9/34 , F03D13/20 , F05B2240/133 , F05B2240/213 , F05B2240/96 , F05B2250/25 , H02S10/12 , Y02E10/725 , Y02P80/158
摘要： Improvements to wind farms and wind generators for harnessing wind energy or generating electricity from wind. Secondary wind turbines are provided at particular locations within a wind farm to generate additional electricity, in some embodiments, using a common electrical power collection system. Enclosures or venturis may surround wind turbines to facilitate mounting close to the ground. Venturis may accelerate wind speed through the turbine and may have a particular shape, may be made of particular materials arranged in particular ways, or both. In different embodiments, wind turbines may be axial-flow horizontal-axis turbines, or may be Savonius turbines, as examples. And in some embodiments, wind turbines may be combined with other power production equipment, such as solar power equipment, for instance.
摘要翻译：改善风电场和风力发电机，以利用风能或发电。次级风力涡轮机设置在风力发电场内的特定位置以产生额外的电力，在一些实施例中，使用公共电力收集系统。外壳或Venturis可围绕风力涡轮机，以便于靠近地面安装。 Venturis可以加速通过涡轮机的风速并且可以具有特定的形状，可以由以特定方式布置的特定材料或两者形成。在不同的实施例中，风力涡轮机可以是轴流水平轴流涡轮机，或者可以是Savonius涡轮机，例如。并且在一些实施例中，风力涡轮机可以与例如太阳能发电设备的其它动力生产设备组合。

49. 发明授权

US07125734B2 Increased light extraction from a nitride LED 有权
标题翻译：增加从氮化物LED的光提取
公开(公告)号：US07125734B2
公开(公告)日：2006-10-24
申请号：US11075974
申请日：2005-03-09
申请人： Michael J. Sackrison , Hari S. Venugopalan , Xiang Gao
发明人： Michael J. Sackrison , Hari S. Venugopalan , Xiang Gao
IPC分类号： H01L21/00
CPC分类号： H01L33/22 , H01L33/0079 , H01L33/62 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/16 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is removed. The entire submount is immersed in the etchant solution, exposed to the light for a prespecified period of time, removed from the solution, dried and diced into a plurality of LEDs. The LEDs are immediately packaged without any further processing.
摘要翻译：在制造倒装芯片发光二极管装置的方法中，副载荷晶片装有多个发光二极管管芯。每个器件芯片倒装芯片连接到基座。在倒装芯片接合之后，去除生长衬底。将整个底座浸入蚀刻剂溶液中，暴露于预定时间段的光，从溶液中除去，干燥并切成多个LED。 LED立即封装，无需进一步处理。

50. 发明授权

US06545580B2 Electromagnetic field generator and method of operation 失效
标题翻译：电磁场发生器及其运行方法
公开(公告)号：US06545580B2
公开(公告)日：2003-04-08
申请号：US09150274
申请日：1998-09-09
申请人： Hari S. Hegde , Mihai S. Risca , Alan V. Hayes , Abraham J. Navy , Roger P. Fremgen
发明人： Hari S. Hegde , Mihai S. Risca , Alan V. Hayes , Abraham J. Navy , Roger P. Fremgen
IPC分类号： C23C1400
CPC分类号： H01J37/32623 , H01J37/3178 , H01J37/3266
摘要： An electromagnetic field generator and method of operation for ion beam deposition of magnetic thin-film materials is presented. A combination of open frame electromagnetic field generator elements provides precise control of magnetic field directionality. This control enables deposition of oriented magnetic films with minimal directionality error. The magnetic field direction may be oriented to enable the deposition of alternating layers of directionally oriented magnetic films. An open frame element reduces the weight of the electromagnetic field generator while truncated corners reduce diagonal clearance that may be required in a vacuum chamber. An open frame design also enables the electromagnetic field generator to surround and thus remain clear of the active deposition area; the electromagnetic field generator can thus be shielded from accumulation of sputtered material. Shielding from accumulation of sputter material reduces maintenance requirements.
摘要翻译：提出了一种用于磁性薄膜材料的离子束沉积的电磁场发生器和操作方法。开放式电磁场发生器元件的组合提供了磁场方向性的精确控制。该控制使得能够以最小的方向性误差沉积取向的磁性膜。磁场方向可以被定向成能够沉积定向取向的膜的交替层。开放式框架元件减小了电磁场发生器的重量，而截顶角减小了真空室中可能需要的对角线间隙。开放式框架设计还使得电磁场发生器能够围绕并因此保持远离有效沉积区域; 因此电磁场发生器可以被屏蔽以免溅射材料的积聚。防止溅射材料积聚减少维护要求。

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