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31. 发明申请

WO2005069705A1 金属パターン及びその製造方法审中-公开
标题翻译：金属图案及其制造方法
公开(公告)号：WO2005069705A1
公开(公告)日：2005-07-28
申请号：PCT/JP2005/000267
申请日：2005-01-13
申请人：松下電器産業株式会社 , 中川徹
发明人：中川徹
IPC分类号： H05K3/06
CPC分类号： C25D5/022 , C23F1/02 , C23F1/14 , C23F1/18 , C23F1/30 , C23F1/40 , H01L21/0332 , H01L21/0337 , H01L21/32139 , H01L51/0019 , H01L51/0022 , H05K3/061 , H05K2201/015 , H05K2201/0239 , H05K2203/013 , H05K2203/0582 , H05K2203/0585 , H05K2203/122
摘要：　本発明の金属パターンは、基板の表面に形成され、エッチングされた金属パターン(13')であって、金属パターン(13')の金属膜表面にはフッ化アルキル鎖（ＣＦ 3 （ＣＦ 2 ） n −：ｎは自然数）を含む吸着された単分子膜が形成され、前記単分子膜を構成する分子間にメルカプト基（−ＳＨ）又はジスルフィド基（−ＳＳ−）を有する分子が浸入してマスキング膜(18)が形成されている。こ金属パターンは、フッ化アルキル鎖（ＣＦ 3 （ＣＦ 2 ） n −：ｎは自然数）を含む単分子膜を金属膜表面に形成し、前記単分子膜の表面に、メルカプト基（−ＳＨ）又はジスルフィド基（−ＳＳ−）を有する分子が溶解した溶液を塗布して、前記単分子膜を構成する分子間にメルカプト基（−ＳＨ）又はジスルフィド基（−ＳＳ−）を有する分子を浸入させてマスキング膜を形成し、エッチング液を前記金属膜表面に曝して前記マスキング膜の無い金属領域をエッチングして得る。
摘要翻译：通过在基板表面上形成而蚀刻的金属图案（13'），该金属图案（13'）具有通过吸附含有氟化烷基链（CF 3（CF 2）n - n）的单分子膜形成的掩蔽膜（18）（-SH）或二硫代（-SS））的分子渗透到金属膜表面上，并将其分子渗透到构成单分子膜的分子之间的间隙中。该金属图案通过在金属膜表面上形成含有氟化烷基链（CF 3（CF 2）n - n为自然数）的单分子膜来制造）用其中溶解有巯基（-SH）或二硫代（-SS-）的分子的溶液涂覆单分子膜的表面，使得具有巯基（-SH）或二硫代（-SS-）的分子渗入第构成单分子膜的分子，从而形成掩模膜; 并将金属膜表面暴露于蚀刻溶液，从而浪费没有掩蔽膜的金属区域。

32. 发明申请

WO00005938A2 LASER IMAGING OF PRINTED CIRCUIT PATTERNS WITHOUT USING PHOTOTOOLS 审中-公开
标题翻译：打印电路图的激光成像，不使用光学胶片
公开(公告)号：WO00005938A2
公开(公告)日：2000-02-10
申请号：PCT/US1998/015596
申请日：1998-07-31
IPC分类号： C23F1/02 , G03F1/00 , H05K3/00 , H05K3/06
CPC分类号： H05K3/062 , C23F1/02 , H05K3/0032 , H05K3/064 , H05K2201/0175 , H05K2203/0315 , H05K2203/0361 , H05K2203/0585 , H05K2203/072 , H05K2203/107
摘要： The present invention provides an improved process for laser imaging printed circuit boards, by depositing a thin metallic or metal-bearing layer between the copper cladding of the copper clad laminate, and the laser imageable organic, polymeric resist. The thin metallic layer acts as an auxiliary etch resist in conjunction with the laser-imaged pattern.
摘要翻译：本发明提供了一种用于激光成像印刷电路板的改进方法，其通过在覆铜层压板的铜包层和可激光成像的有机聚合物抗蚀剂之间沉积薄的金属或金属承载层。薄金属层与激光成像图案一起用作辅助蚀刻抗蚀剂。

33. 发明公开

EP1112672A1 LOW-IMPEDANCE HIGH-DENSITY DEPOSITED-ON-LAMINATE STRUCTURES HAVING REDUCED STRESS 审中-公开
标题翻译：在具有低阻抗，高密度和低电压层压ABGESCHIEDENR结构
公开(公告)号：EP1112672A1
公开(公告)日：2001-07-04
申请号：EP99938904.2
申请日：1999-07-30
申请人： Kulicke & Soffa Holdings, Inc.
发明人： STRANDBERG, Jan, I. , CHAZAN, David, J. , SKINNER, Michael, P.
IPC分类号： H05K1/03
CPC分类号： H05K1/0271 , H01L21/481 , H01L21/4857 , H01L23/5383 , H01L23/5385 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/3011 , H05K3/0023 , H05K3/0032 , H05K3/4602 , H05K3/4644 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2201/068 , H05K2201/09236 , H05K2201/093 , H05K2201/09536 , H05K2201/0959 , H05K2201/09781 , H05K2201/098 , H05K2201/09881 , H05K2203/0353 , H05K2203/0585 , H05K2203/0759 , H05K2203/1476 , H01L2224/05624 , H01L2924/00014 , H01L2224/05644 , H01L2224/05647
摘要： Low-impedance high-density deposited-on-laminate (DONL) structures having reduced stress features reducing metallization present on the laminate printed circuit board. In this manner, reduced is the force per unit area exerted on the dielectric material disposed adjacent to the laminate material that is typically present during thermal cycling of the structure.

34. 发明公开

EP0875928A3 Metallization in semiconductor devices 失效
标题翻译：金属化半导体器件
公开(公告)号：EP0875928A3
公开(公告)日：1998-12-30
申请号：EP98104745.9
申请日：1998-03-17
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Tobben, Dirk , Spuler, Bruno , Gutsche, Martin , Weigand, Peter
IPC分类号： H01L21/768 , H01L21/321
CPC分类号： H05K3/061 , H01L21/32139 , H01L21/76838 , H05K1/0284 , H05K2201/09018 , H05K2203/0585
摘要： A method for forming a plurality of electrically conductive wires on a substrate. The method includes forming a relatively non-planar metal layer over a surface of the substrate. A self-planarizing material is deposited over the metal layer. The self-planarizing material forms a planarization layer over the surface of the metal layer. The planarization layer has a surface relatively planar compared to the relatively non-planar metal layer. A photoresist layer is deposited over the surface of the planarization layer. The photoresist layer is patterned with a plurality of grooves to form a mask with such grooves exposing underling portions of the planarization layer. The photoresist mask is used as a mask to etch grooves in the exposed portions of the planarization layer and thereby form a second mask. The second mask exposes underling portions of the relatively non-planar metal layer. The second mask is used to etch grooves in the relatively non-planar conductive metal layer and thereby form the plurality of electrically conductive wires in the metal layer. The wires are separated from each other by the grooves formed in the relatively non-planar metal layer. The planarization layer is formed by a spinning-on an organic polymer, for example an organic polymer having silicon, or a flowable oxide, or a hydrogensilsequioxane, or divinyl-siloxane-benzocyclobutene. The metal layer is etched using reactive ion etching. The planarization layer is removed using a wet chemical etch.

35. 发明公开

EP0410274A2 Method of forming fine patterns 失效
标题翻译：维尔法赫恩·赫尔斯滕
公开(公告)号：EP0410274A2
公开(公告)日：1991-01-30
申请号：EP90113687.9
申请日：1990-07-17
申请人： DAI NIPPON INSATSU KABUSHIKI KAISHA
发明人： Takeuchi, Satoshi, c/o DAI NIPPON INSATSU K.K.
IPC分类号： H05K3/06 , C23F1/02
CPC分类号： B41M1/00 , B41M3/00 , C23F1/02 , C25D5/022 , H05K3/0082 , H05K3/061 , H05K3/064 , H05K2203/0117 , H05K2203/0537 , H05K2203/0551 , H05K2203/0585 , H05K2203/0726 , H05K2203/135
摘要： A fine pattern is formed by the following steps. A prescribed mask pattern of an electrically insulative material (3, 5, 8) is formed on an electroconductive surface of a base plate (2) of a printing plate (1), so that the part, other than the mask pattern, of the printing plate becomes an electroconductive printing pattern part . Then, the printing plate (1) is electrolized and the electrodeposition substance (14) is deposited on the electroconductive printing pattern part of the printing plate (1). Then, the deposited substance (14) is transferred onto the surface of a printing object (20) such as a plate of glass or plastic, for forming a pattern thereon. Thereafter, the surface of the printing object (20) is etched with the electrodeposited substance (14) thus transferred as an erosion resistant material.
摘要翻译：通过以下步骤形成精细图案。在印版（1）的基板（2）的导电表面上形成电绝缘材料（3,5,8）的规定的掩模图案，使得除了掩模图案之外的部分印版成为导电印刷图案部分。然后，在含有电沉积物质的电解质（11）中进行电解，该电解质（11）作为成分，印刷板作为一个电极（1）和相对的电极（12）都浸没在电解质（11）中，使得电沉积物质（14）沉积在印版（1）的导电印刷图案部分上。此后，将印版（1）从电解质（11）中取出，洗涤并干燥。然后，将沉积物质（14）转印到诸如玻璃或塑料的印刷对象（20）的表面上，以在其上形成图案。此后，用作为耐腐蚀材料转印的电沉积物质（14）蚀刻印刷对象（20）的表面。将电沉积物质（14）从印版（1）转印到印刷对象（20）的表面上，随后蚀刻印刷物体表面，能够准确地再现印刷对象上的精细图案。

36. 发明授权

EP0127689B1 Verfahren zum Herstellen von gedruckten Schaltungen mit in das Isolierstoffsubstrat eingebetteten metallischen Leiterzugstrukturen 失效
标题翻译：使用埋在隔离基板中的金属导体图案制造印刷电路的工艺
公开(公告)号：EP0127689B1
公开(公告)日：1987-08-26
申请号：EP83104956.4
申请日：1983-05-19
申请人： IBM DEUTSCHLAND GMBH , International Business Machines Corporation
发明人： Greschner, Johann, Dr. Dipl.-Phys. , Schwerdt, Friedrich , Trumpp, Hans Joachim, Dr. Dipl.-Phys.
IPC分类号： H05K3/10
CPC分类号： H05K3/0041 , H05K3/048 , H05K3/107 , H05K3/108 , H05K3/16 , H05K3/244 , H05K3/426 , H05K2201/0347 , H05K2201/0376 , H05K2201/09036 , H05K2203/0554 , H05K2203/0585 , H05K2203/072 , H05K2203/095

37. 发明公开

EP0200237A2 Process to obtain thin film lines 失效
标题翻译： Verfahren zum Erhalten vonDünnschichtlinien。
公开(公告)号：EP0200237A2
公开(公告)日：1986-11-05
申请号：EP86200415.7
申请日：1986-03-17
申请人： SIEMENS TELECOMUNICAZIONI S.P.A.
发明人： Ferraris, Giampiero , Tersalvi, Antonio
IPC分类号： H01L21/48
CPC分类号： G03F7/0233 , H01L21/4846 , H05K1/0306 , H05K3/0041 , H05K3/108 , H05K3/388 , H05K2203/0554 , H05K2203/0577 , H05K2203/0585 , H05K2203/095 , H05K2203/1476
摘要： It is described a process to obtain thin film lines by photolithography of thick resist (3) and subsequent selective galvanic growth of gold which enables to obtain very thin lines (8) (2-10 micron) with high definition, that is with nearly vertical walls (9) and with a tolerance in the width of about 1 micron. Such results have been achieved by using polyimide as thick resist (3), by particular cure cycles of the same polyimide and by a particular dry etching of the polyimide layer (3) to obtain seats (6) in which afterwards the lines (8) become grown.
摘要翻译：描述了通过厚光刻胶的光刻法和随后的金选择性电镀生长获得薄膜线的工艺，其能够以高清晰度获得非常细的线（2-10微米），即具有几乎垂直的壁并具有公差宽度约1微米。通过使用聚酰亚胺作为厚抗蚀剂，通过相同聚酰亚胺的特定固化循环和通过聚酰亚胺层的特定干法蚀刻来获得其后线生长的座位，已经实现了这些结果。

38. 发明公开

KR1020030094350A 기판에 금속을 무전해 석출하고 패터닝하는 방법 失效
标题翻译：空值
公开(公告)号：KR1020030094350A
公开(公告)日：2003-12-11
申请号：KR1020037013492
申请日：2002-04-04
申请人： 인터내셔널 비지네스 머신즈 코포레이션
发明人： 델라마르체엠마누엘 , 플레이크존씨 , 가이슬러마티어스 , 그레이엄윌리엄에스 , 매그너슨로이에이취 , 미셀브루노 , 슈미트하인쯔
IPC分类号： H05K3/06
CPC分类号： B82Y30/00 , C23C18/1605 , C23C18/1607 , C23C18/1893 , C23F1/02 , C23F1/34 , H01L21/4846 , H05K3/0079 , H05K3/061 , H05K3/181 , H05K3/389 , H05K2203/0108 , H05K2203/0537 , H05K2203/0585 , H05K2203/1168
摘要： 본 발명에 따라, 기판에 패터닝된 금속층을 만드는 방법이 제공되는데, 소정 금속의 블랭킷 금속 필름을 기판에 무전해 석출하고, 이어서 마이크로컨택트 프린팅에 의해 상기 금속층을 패터닝하는 것을 포함한다. 상기 적층된 금속은 엣칭 마스크로서 작용하도록 마이크로컨택트 프린팅될 수 있는 다른 금속으로 오버플레이팅될 수 있다.
摘要翻译：提供了一种用于在基板上制造图案化金属层的方法，其包括将金属的覆盖金属膜无电沉积到基板上的步骤，随后通过微接触印刷对所述金属层进行图案化。沉积的金属可以用另一种金属进行过电镀，其可以被微接触印制以用作蚀刻掩模。

39. 发明授权

US09622353B2 Imaging on substrates with alkaline strippable UV blocking compositions and aqueous soluble UV transparent films 有权
公开(公告)号：US09622353B2
公开(公告)日：2017-04-11
申请号：US14853364
申请日：2015-09-14
申请人： Rohm and Haas Electronic Materials LLC
发明人： Krishna Balantrapu , Brian D. Amos , Stephen McCammon
IPC分类号： G03F7/12 , H05K3/00 , G03F7/09 , G03F7/20 , G03F7/42 , G03F7/32 , G03F7/035 , G03F7/038 , G03F7/11 , H05K3/28 , H05K3/34
CPC分类号： H05K3/0079 , G03F7/035 , G03F7/038 , G03F7/09 , G03F7/091 , G03F7/11 , G03F7/20 , G03F7/2018 , G03F7/322 , G03F7/425 , H05K3/0076 , H05K3/0082 , H05K3/28 , H05K3/3452 , H05K2203/013 , H05K2203/0551 , H05K2203/0585
摘要： Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline strippable UV blocking composition is selectively applied to the surface of the UV transparent film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.

40. 发明申请

US20100243601A1 Multilayer wiring board and manufacturing method thereof 失效
标题翻译：多层布线板及其制造方法
公开(公告)号：US20100243601A1
公开(公告)日：2010-09-30
申请号：US12659893
申请日：2010-03-24
申请人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
发明人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
IPC分类号： C23F1/00 , H01B13/00
CPC分类号： H05K3/427 , H05K3/002 , H05K3/0035 , H05K3/0038 , H05K3/0041 , H05K3/0044 , H05K3/061 , H05K3/064 , H05K3/382 , H05K3/389 , H05K3/421 , H05K3/4652 , H05K2201/0347 , H05K2201/0355 , H05K2201/0358 , H05K2201/0394 , H05K2203/025 , H05K2203/0353 , H05K2203/054 , H05K2203/0585 , H05K2203/0733
摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.
摘要翻译：提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案。将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用作为掩模的图案化层，对底漆树脂层21进行图案化。使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

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