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31. 发明授权

US11664781B2 Methods and devices for microelectromechanical resonators 有权
公开(公告)号：US11664781B2
公开(公告)日：2023-05-30
申请号：US16948328
申请日：2020-09-14
申请人： Stathera IP Holdings Inc.
发明人： Vamsy Chodavarapu , George Xereas
IPC分类号： H03H9/10 , H03H9/24 , H03H9/05 , B81C1/00 , H03H3/007 , B81B7/00 , G01L9/12 , G01L9/00
CPC分类号： H03H9/1057 , B81B7/007 , B81C1/00182 , B81C1/00269 , B81C1/00301 , G01L9/0042 , G01L9/0073 , G01L9/12 , H03H3/0072 , H03H3/0073 , H03H9/0561 , H03H9/2405 , H03H9/2426 , H03H9/2431 , H03H9/2436 , B81B2203/0307 , H03H9/2452 , H03H9/2463 , H03H9/2473 , H03H9/2478 , H03H2009/2442
摘要： MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

32. 发明申请

US20160006414A1 METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS 审中-公开
标题翻译：微电子谐振器的方法和装置
公开(公告)号：US20160006414A1
公开(公告)日：2016-01-07
申请号：US14790220
申请日：2015-07-02
申请人： The Royal Institution for the Advancement of Learning / McGill University
发明人： Vamsy Chodavarapu , George Xereas
IPC分类号： H03H9/24 , B81C1/00
CPC分类号： B81C1/00182 , B81B7/007 , B81B2203/0307 , B81C1/00269 , B81C1/00301 , G01L9/0042 , G01L9/0073 , G01L9/12 , H03H3/0072 , H03H3/0073 , H03H9/0561 , H03H9/1057 , H03H9/2405 , H03H9/2426 , H03H9/2431 , H03H9/2436 , H03H9/2452 , H03H9/2463 , H03H9/2473 , H03H9/2478 , H03H2009/2442
摘要： MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.
摘要翻译：基于MEMS的传感器，特别是电容传感器，潜在地可以解决用户的关键考虑因素，包括精度，重复性，长期稳定性，校准容易性，对化学和物理污染物的抵抗力，尺寸，包装和成本效益。因此，利用允许谐振器元件可制造性和集成在MEMS传感器内的空腔中的MEMS工艺将是有利的，该传感器处于低压，允许实施高质量因子谐振器和绝对压力传感器。本发明的实施例提供可以直接在硅CMOS电子器件上方实现的电容传感器和MEMS元件。

33. 发明申请

US20110018648A1 Resonator Electrode Shields 有权
标题翻译：谐振器电极屏蔽
公开(公告)号：US20110018648A1
公开(公告)日：2011-01-27
申请号：US12897361
申请日：2010-10-04
申请人： David Raymond Redersen , Aaron Partridge , Thor Juneau
发明人： David Raymond Redersen , Aaron Partridge , Thor Juneau
IPC分类号： H03B5/30
CPC分类号： H03H9/2457 , H03H9/02259 , H03H9/2426 , H03H9/2436 , H03H9/2473 , H03H9/2478 , H03H2009/02496 , H03H2009/2442
摘要： One embodiment of the present invention sets forth a MEMS resonator system that reduces interference signals arising from undesired capacitive coupling between different system elements. The system includes a MEMS resonator, two or more resonator electrodes, and at least one resonator electrode shield. The resonator electrode shield ensures that the resonator electrodes interact with either one or more shunting nodes or the active elements of the MEMS resonator by preventing or reducing, among other things, capacitive coupling between the resonator electrodes and the support and auxiliary elements of the MEMS resonator structure. By reducing the deleterious effects of interfering signals using one or more resonator electrode shields, a simpler, lower interference, and more efficient system relative to prior art approaches is presented.
摘要翻译：本发明的一个实施例提出了一种MEMS谐振器系统，其减少由不同系统元件之间的不期望的电容耦合引起的干扰信号。该系统包括MEMS谐振器，两个或更多个谐振器电极和至少一个谐振器电极屏蔽。谐振器电极屏蔽通过防止或减少谐振器电极与MEMS谐振器的支撑和辅助元件之间的电容耦合，确保谐振器电极与一个或多个分流节点或MEMS谐振器的有源元件相互作用结构体。通过使用一个或多个谐振器电极屏蔽减少干扰信号的有害影响，提出了相对于现有技术方法的更简单，更低干扰和更有效的系统。

34. 发明授权

US07427905B2 Temperature controlled MEMS resonator and method for controlling resonator frequency 有权
标题翻译：温度控制MEMS谐振器和谐振器频率控制方法
公开(公告)号：US07427905B2
公开(公告)日：2008-09-23
申请号：US11895502
申请日：2007-08-23
申请人： Markus Lutz , Aaron Partridge
发明人： Markus Lutz , Aaron Partridge
IPC分类号： H03H9/02 , H03H9/46 , H03H3/013
CPC分类号： H03H9/2463 , H01L2224/48091 , H01L2224/48227 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H03H9/02338 , H03H9/02401 , H03H9/02448 , H03H9/2426 , H03H9/2473 , H03H9/2478 , H03H2009/02496 , H03H2009/02511 , H03H2009/02527 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical resonators having mechanical structures that include integrated heating and/or temperature sensing elements. In another aspect, the present invention is directed to fabricate, manufacture, provide and/or control microelectromechanical resonators having mechanical structures that are encapsulated using thin film or wafer level encapsulation techniques in a chamber, and including heating and/or temperature sensing elements disposed in the chamber, on the chamber and/or integrated within the mechanical structures. Other aspects of the inventions will be apparent from the detailed description and claims herein.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及一种温度补偿微机电谐振器，以及制造，制造，提供和/或控制具有包括集成的加热和/或温度感测元件的机械结构的微机电谐振器。在另一方面，本发明涉及制造，制造，提供和/或控制具有机械结构的微机电谐振器，其机械结构使用薄膜或晶片级封装技术在腔室中进行封装，并且包括设置在腔室中的加热和/或温度感测元件室，在室上和/或整合在机械结构内。本发明的其它方面将从本文的详细描述和权利要求中变得显而易见。

35. 发明专利

JP2011510577A Micro-mechanical resonator 有权
公开(公告)号：JP2011510577A
公开(公告)日：2011-03-31
申请号：JP2010543534
申请日：2009-01-23
申请人：ヴィーテイアイテクノロジーズオーワイ
发明人：カーヤカリ，ヴィレ
IPC分类号： H03H9/24 , B81B3/00
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299
摘要：本発明は、微小機械式共振器の設計に関し、より正確には、微小電気機械システム（ＭＥＭＳ）共振器の設計に関する。本発明は、ばね要素（３）、（２３〜２４）、（２７〜３０）の幅が、電極フィンガ（５〜９）、（２５〜２６）、（３１〜３４）の幅よりも広く、寸法製造変動公式に対する共振周波数変化の感度がゼロに近づくように幅が特に寸法設定されている微小電気機械システム（ＭＥＭＳ）共振器の改良された設計構造を提供する。改良された構造は、製造変動に対して周波数頑強性があり、特に小さいソリューションにおいて優れた性能を有している信頼性のある周波数参照を実現している。
【選択図】図４

36. 发明专利

JP5662160B2 微小機械式共振器有权
标题翻译：微机械谐振器
公开(公告)号：JP5662160B2
公开(公告)日：2015-01-28
申请号：JP2010543534
申请日：2009-01-23
申请人：ムラタエレクトロニクスオサケユキチュア , ムラタエレクトロニクスオサケユキチュア
发明人：カーヤカリ，ヴィレ
IPC分类号： H03H9/24 , B81B3/00
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299

37. 发明公开

EP2372909A3 Resonator element, resonator, oscillator, and electronic device 审中-公开
标题翻译：谐振器，谐振器，振荡器和电子装置
公开(公告)号：EP2372909A3
公开(公告)日：2014-11-26
申请号：EP11158240.9
申请日：2011-03-15
申请人： Seiko Epson Corporation
发明人： Yamada, Akinori
IPC分类号： H03H9/21 , H03H9/24 , H03H9/215 , H03H3/04 , H03H9/05 , H03H9/10 , H03B5/32 , H01L41/09
CPC分类号： H03H9/21 , H03H9/0547 , H03H9/1014 , H03H9/215 , H03H9/2457 , H03H9/2478 , H03H2003/0492
摘要： A resonator element which has a small size, a low frequency, and a high Q value is provided. The resonator element includes a base portion (21) in which a pair of notches (31) is formed, a pair of vibrating arms (22) which is extended in parallel from one end side of a first portion (21a) of the base portion (21). Each vibrating arm includes a general portion (23) which is a major vibrating portion and a weight portion (29) which is formed at a tip end side of the vibrating arm on the opposite side of a root of the vibrating arm (22) attached to the base portion (21) and which has a larger width than the general portion. The vibrating arm (22) is provided with a bottomed elongated groove (26a,26b) which has an opening along at least one principal surface of both principal surfaces of each vibrating arm (22) and a weight portion (25) which is formed at the tip end side of the vibrating arm (22) on the opposite side of the root of the vibrating arm (22) attached to the base portion (21) and which has a larger width than the width of the vibrating arm (22) on the root side attached to the base portion (21). The weight portion (29) is formed so that the proportion of the length of the weight portion (29) to the length from the root attached to the base portion (21) to the tip end side in a longitudinal direction of the vibrating arm (22) is within a range of 35% to 41%.

38. 发明公开

EP2245738A4 A MICROMECHANICAL RESONATOR 有权转让
标题翻译：微机械谐振器
公开(公告)号：EP2245738A4
公开(公告)日：2014-03-12
申请号：EP09703126
申请日：2009-01-23
申请人： MURATA ELECTRONICS OY
发明人： KAAJAKARI VILLE
IPC分类号： H03H9/02 , B81B3/00 , H03H3/007 , H03H9/24
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299

39. 发明公开

EP2372909A2 Resonator element, resonator, oscillator, and electronic device 审中-公开
标题翻译： Resonatorelement，Resonator，Oszillator und elektronische Vorrichtung
公开(公告)号：EP2372909A2
公开(公告)日：2011-10-05
申请号：EP11158240.9
申请日：2011-03-15
申请人： Seiko Epson Corporation
发明人： Yamada, Akinori
IPC分类号： H03H9/21 , H03H9/24 , H03H9/05 , H03H9/10 , H03B5/32
CPC分类号： H03H9/21 , H03H9/0547 , H03H9/1014 , H03H9/215 , H03H9/2457 , H03H9/2478 , H03H2003/0492
摘要： A resonator element which has a small size, a low frequency, and a high Q value is provided. The resonator element includes a base portion (21) in which a pair of notches (31) is formed, a pair of vibrating arms (22) which is extended in parallel from one end side of a first portion (21a) of the base portion (21). Each vibrating arm includes a general portion (23) which is a major vibrating portion and a weight portion (29) which is formed at a tip end side of the vibrating arm on the opposite side of a root of the vibrating arm (22) attached to the base portion (21) and which has a larger width than the general portion. The vibrating arm (22) is provided with a bottomed elongated groove (26a,26b) which has an opening along at least one principal surface of both principal surfaces of each vibrating arm (22) and a weight portion (25) which is formed at the tip end side of the vibrating arm (22) on the opposite side of the root of the vibrating arm (22) attached to the base portion (21) and which has a larger width than the width of the vibrating arm (22) on the root side attached to the base portion (21). The weight portion (29) is formed so that the proportion of the length of the weight portion (29) to the length from the root attached to the base portion (21) to the tip end side in a longitudinal direction of the vibrating arm (22) is within a range of 35% to 41%.
摘要翻译：提供了具有小尺寸，低频和高Q值的谐振元件。谐振器元件包括形成有一对凹口（31）的基部（21），一对振动臂（22），其从基部的第一部分（21a）的一端侧平行延伸，（21）。每个振动臂包括作为主振动部分的一般部分（23）和形成在振动臂的根部的相对侧上的振动臂的尖端侧的重物部分（29），所述根部附接到基部（21）并且具有比一般部分宽的宽度。振动臂（22）设置有有底的细长槽（26a，26b），其具有沿着每个振动臂（22）的两个主表面的至少一个主表面的开口和一个配重部分（25）所述振动臂（22）的所述振动臂（22）的根部的相对侧的前端侧安装在所述基部（21）上并且具有比所述振动臂（22）的宽度大的宽度根侧附接到基部（21）。所述配重部（29）形成为使所述配重部（29）的长度与从所述基部（21）附近的根部到所述振动臂的长度方向的前端侧的长度 22）在35％至41％的范围内。

40. 发明授权

KR101694133B1 마이크로기계식 공진기 有权
标题翻译：微机电谐振器
公开(公告)号：KR101694133B1
公开(公告)日：2017-01-09
申请号：KR1020107018410
申请日：2009-01-23
申请人： 무라타 일렉트로닉스 오와이
发明人： 카자카리빌
IPC分类号： H03H9/02 , B81B3/00 , H03H9/24
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299
摘要： 본발명은마이크로기계식공진기의설계에관한것이며, 보다구체적으로는마이크로전자기계시스템(MEMS) 공진기의설계에관한것이다. 본발명은스프링요소들(3), (23-24), (27-30)의폭은상기전극핑거들(5-9), (25-26), (31-34)의폭보다크고, 상기폭들은구체적으로제작상치수변동에대한공진주파수변화의감도가제로에근접하도록치수화되는마이크로전자기계(MEMS) 공진기에대한개선된설계구조를제공한다. 개선된구조는제작상변동에대해주파수내성이있으며특히소형솔루션에서양호한성능과함께확실한주파수참조를가능하게한다.
摘要翻译：本发明涉及微机械谐振器的设计，更确切地说，涉及微机电系统（MEMS）谐振器的设计。本发明提供了一种用于微机电系统（MEMS）谐振器的改进的设计结构，其中弹簧元件（3），（23-24），（27-30）的宽度大于电极指（5- （25-26），（31-34），所述宽度具体尺寸设定成使谐振频率相对于尺寸制造变化d（＆Dgr;ω0/ω0）/dδ变化的灵敏度接近零。改进的结构对于制造变化是稳定的，并且具有良好性能的可靠的频率参考，特别是在小尺寸解决方案中。

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