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31. 发明公开

EP3067929A2 SEMICONDUCTOR PACKAGE ASSEMBLY 审中-公开
标题翻译： HALBLEITERGEHÄUSEANORDNUNG
公开(公告)号：EP3067929A2
公开(公告)日：2016-09-14
申请号：EP16157770.5
申请日：2016-02-29
申请人： MediaTek, Inc
发明人： LIN, Tzu-Hung , HSIAO, Ching-Wen , PENG, I-Hsuan
IPC分类号： H01L25/16
CPC分类号： H01L25/0657 , H01L21/568 , H01L23/5385 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/32 , H01L24/73 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/16265 , H01L2224/32265 , H01L2224/73204 , H01L2224/73209 , H01L2224/92133 , H01L2225/06513 , H01L2225/06558 , H01L2225/06586 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/014
摘要： The invention provides a semiconductor package assembly. The semiconductor package assembly includes a semiconductor die (300). A first molding compound (360) covers a back surface of the semiconductor die. A redistribution layer (RDL) structure (350a) is disposed on a front surface of the semiconductor die. The semiconductor die is coupled to the RDL structure. A second molding compound (320) is disposed on the front surface of the semiconductor die and embedded in the RDL structure. A passive device (330) is disposed on the second molding compound and coupled to the semiconductor die.
摘要翻译：本发明提供一种半导体封装组件。半导体封装组件包括半导体管芯（300）。第一模塑料（360）覆盖半导体管芯的背面。再分配层（RDL）结构（350a）设置在半导体管芯的前表面上。半导体管芯耦合到RDL结构。第二模塑料（320）设置在半导体管芯的前表面并嵌入RDL结构中。无源器件（330）设置在第二模塑料上并与半导体管芯耦合。

32. 发明公开

EP1711963A2 INTEGRATING PASSIVE COMPONENTS ON SPACER IN STACKED DIES 审中-公开
标题翻译： INTEGRIEREN PASSIVER KOMPONENTEN AUF EINER ABSTANDSSCHICHT IN GESTAPELTEN CHIPS
公开(公告)号：EP1711963A2
公开(公告)日：2006-10-18
申请号：EP04815143.5
申请日：2004-12-20
申请人： INTEL CORPORATION
发明人： KANG, Jung , RADHAKRISHNAN, Kaladhar , CHICKAMENAHALLI, Shamala
IPC分类号： H01L23/00
CPC分类号： H01L25/0657 , H01L23/522 , H01L23/66 , H01L24/48 , H01L25/16 , H01L2224/04042 , H01L2224/16265 , H01L2224/32225 , H01L2224/32265 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2225/06506 , H01L2225/06527 , H01L2225/06575 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247 , H01L2924/00
摘要： An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.
摘要翻译：本发明的一个实施例是一种在模具组件中集成无源部件的技术。电容器，电感器或电阻器集成在堆叠模具中的上模和下模之间的间隔件上。导体连接到电容器，电感器或电阻器，以将电容器，电感器或电阻器连接到上模具和下模具中的至少一个。

33. 发明专利

JP2014029944A Switching element unit 审中-公开
标题翻译：开关元件单元
公开(公告)号：JP2014029944A
公开(公告)日：2014-02-13
申请号：JP2012170193
申请日：2012-07-31
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TOYA HIROHISA
IPC分类号： H01L25/18 , H01G4/40 , H01L25/07 , H02M7/48
CPC分类号： H03K17/687 , H01G4/40 , H01L25/07 , H01L25/18 , H01L2224/32265 , H01L2224/40137 , H01L2224/40227 , H01L2224/40265 , H01L2224/73263 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , Y02T10/7022 , H01L2924/00 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To achieve a switching element unit capable of providing a smoothing capacitor while achieving downsizing of the entire unit.SOLUTION: A smoothing capacitor 50 is a ceramic capacitor in which a dielectric portion 53 is made from a ceramic material and includes an element arrangement surface S1 that is integrally formed with the dielectric portion 53 on its outer surface. On the element arrangement surface S1, a positive-side connection electrode P1 electrically connected to a positive terminal 51 of the smoothing capacitor 50 and a negative-side connection electrode P2 electrically connected to a negative terminal 52 of the smoothing capacitor 50 are formed. A switching element 10 and a diode element constituting a series element unit are arranged on the element arrangement surface S1, a positive-side terminal portion 31 of the series element unit and the positive-side connection electrode P1 are electrically connected, and a negative-side terminal portion 32 of the series element unit and the negative-side connection electrode P2 are electrically connected.
摘要翻译：要解决的问题：实现能够提供平滑电容器同时实现整个单元的小型化的开关元件单元。解决方案：平滑电容器50是陶瓷电容器，其中电介质部分53由陶瓷材料制成，并且包括元件布置表面S1，其在其外表面上与电介质部分53一体形成。在元件配置面S1上，形成与平滑电容器50的正极端子51电连接的正极连接用电极P1和与平滑电容器50的负极端子52电连接的负极连接用电极P2。构成串联元件单元的开关元件10和二极管元件布置在元件布置表面S1上，串联元件单元和正侧连接电极P1的正极端子部31电连接，串联元件单元的侧端子部分32和负侧连接电极P2电连接。

34. 发明申请

WO2014021112A1 スイッチング素子ユニット审中-公开
标题翻译：开关元件单元
公开(公告)号：WO2014021112A1
公开(公告)日：2014-02-06
申请号：PCT/JP2013/069492
申请日：2013-07-18
申请人：アイシン・エィ・ダブリュ株式会社
发明人：戸谷浩久
IPC分类号： H01L25/07 , H01G4/40 , H01L25/18 , H02M7/48
CPC分类号： H03K17/687 , H01G4/40 , H01L25/07 , H01L25/18 , H01L2224/32265 , H01L2224/40137 , H01L2224/40227 , H01L2224/40265 , H01L2224/73263 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , Y02T10/7022 , H01L2924/00 , H01L2224/37099
摘要：　ユニット全体の小型化を図りつつ、平滑コンデンサを備えることが可能なスイッチング素子ユニットを実現する。　平滑コンデンサ５０は、誘電体部分５３がセラミック材料で形成されたセラミックコンデンサであり、その外面には、誘電体部分５３と一体的に形成された素子配置面Ｓ１が含まれている。素子配置面Ｓ１に、平滑コンデンサ５０の正極端子５１に電気的に接続される正極側接続電極Ｐ１と、平滑コンデンサ５０の負極端子５２に電気的に接続される負極側接続電極Ｐ２とが形成されている。直列素子ユニットを構成するスイッチング素子１０とダイオード素子とが素子配置面Ｓ１に配置されていると共に、当該直列素子ユニットの正極側端子部３１と正極側接続電極Ｐ１とが電気的に接続され、当該直列素子ユニットの負極側端子部３２と負極側接続電極Ｐ２とが電気的に接続されている。
摘要翻译：为了实现能够包括平滑电容器的开关元件单元，同时作为整体的尺寸减小。平滑电容器（50）是具有由陶瓷材料形成的电介质部（53）的陶瓷电容器。平滑电容器（50）的外表面包括与电介质部分（53）整体形成的元件布置表面（S1）。与平滑电容器（50）的正极端子（51）电连接的正极侧连接电极（P1）和与负极端子电连接的负极侧连接电极（P2）平滑电容器（50）的电极（52）形成在元件配置面（S1）上。构成串联元件单元的开关元件（10）和二极管元件设置在元件配置面（S1）上，串联元件单元的正极侧端子部（31）和正极侧连接电极（P1）彼此电连接，而串联元件单元和负极侧连接电极（P2）的负极侧端子部分（32）彼此电连接。

35. 发明申请

WO2005064673A2 INTEGRATING PASSIVE COMPONENTS ON SPACER IN STACKED DIES 审中-公开
标题翻译：在堆叠模具中集成被动组件
公开(公告)号：WO2005064673A2
公开(公告)日：2005-07-14
申请号：PCT/US2004043027
申请日：2004-12-20
申请人： INTEL CORP , KANG JUNG , RADHAKRISHNAN KALADHAR , CHICKAMENAHALLI SHAMALA
发明人： KANG JUNG , RADHAKRISHNAN KALADHAR , CHICKAMENAHALLI SHAMALA
IPC分类号： H01L23/522 , H01L23/66 , H01L25/065 , H01L25/16 , H01L23/00
CPC分类号： H01L25/0657 , H01L23/522 , H01L23/66 , H01L24/48 , H01L25/16 , H01L2224/04042 , H01L2224/16265 , H01L2224/32225 , H01L2224/32265 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2225/06506 , H01L2225/06527 , H01L2225/06575 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247 , H01L2924/00
摘要： An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.
摘要翻译：本发明的一个实施例是一种将无源元件集成在管芯组件中的技术。电容器，电感器或电阻器集成在堆叠裸片中上下模之间的隔板上。导体连接到电容器，电感器或电阻器，以将电容器，电感器或电阻器连接到至少一个上模和下模。

36. 发明公开

EP3067929A3 SEMICONDUCTOR PACKAGE ASSEMBLY 审中-公开
标题翻译：半导体封装组件
公开(公告)号：EP3067929A3
公开(公告)日：2016-11-23
申请号：EP16157770.5
申请日：2016-02-29
申请人： MediaTek, Inc
发明人： LIN, Tzu-Hung , HSIAO, Ching-Wen , PENG, I-Hsuan
IPC分类号： H01L25/16
CPC分类号： H01L25/0657 , H01L21/568 , H01L23/5385 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/32 , H01L24/73 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/16265 , H01L2224/32265 , H01L2224/73204 , H01L2224/73209 , H01L2224/92133 , H01L2225/06513 , H01L2225/06558 , H01L2225/06586 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/014
摘要： The invention provides a semiconductor package assembly. The semiconductor package assembly includes a semiconductor die (300). A first molding compound (360) covers a back surface of the semiconductor die. A redistribution layer (RDL) structure (350a) is disposed on a front surface of the semiconductor die. The semiconductor die is coupled to the RDL structure. A second molding compound (320) is disposed on the front surface of the semiconductor die and embedded in the RDL structure. A passive device (330) is disposed on the second molding compound and coupled to the semiconductor die.
摘要翻译：本发明提供了一种半导体封装组件。该半导体封装组件包括半导体管芯（300）。第一模塑料（360）覆盖半导体管芯的后表面。再分布层（RDL）结构（350a）设置在半导体管芯的前表面上。半导体管芯耦合到RDL结构。第二模塑料（320）设置在半导体管芯的前表面上并嵌入RDL结构中。无源器件（330）设置在第二模塑料上并耦合到半导体管芯。

37. 发明公开

EP2339619A3 Microwave integrated circuit provided with damping device for microphonic noise suppression. 有权
标题翻译： Mirkrowellen集成电路与减振装置以防止颤噪干扰
公开(公告)号：EP2339619A3
公开(公告)日：2012-12-05
申请号：EP10191826.6
申请日：2010-11-19
申请人： SIAE Microelettronica S.p.A.
发明人： Favre, Gaetano , Pini, Alberto
IPC分类号： H01L23/373 , H01L23/498
CPC分类号： H01L23/498 , H01L23/055 , H01L23/3737 , H01L23/562 , H01L23/66 , H01L24/48 , H01L2223/6644 , H01L2223/6683 , H01L2224/32265 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Electronic circuit comprising at least one oscillator of the monolithic microwave integrated (MMIC) type operating at frequencies not less than 4 GHz and at least one base printed circuit (30), where a damping device (20) consisting of a substrate (20) made of resilient and electrically and thermally conductive material is arranged between the integrated circuit (10) and the base printed circuit (30).

38. 发明公开

EP2339619A2 Microwave integrated circuit provided with damping device for microphonic noise suppression. 有权
标题翻译： Mikrowellen-Integrierte Schaltung mitDämpfungseinrichtunggegen mikrophonischeStörungen
公开(公告)号：EP2339619A2
公开(公告)日：2011-06-29
申请号：EP10191826.6
申请日：2010-11-19
申请人： SIAE Microelettronica S.p.A.
发明人： Favre, Gaetano , Pini, Alberto
IPC分类号： H01L23/373 , H01L23/498
CPC分类号： H01L23/498 , H01L23/055 , H01L23/3737 , H01L23/562 , H01L23/66 , H01L24/48 , H01L2223/6644 , H01L2223/6683 , H01L2224/32265 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Electronic circuit comprising at least one oscillator of the monolithic microwave integrated (MMIC) type operating at frequencies not less than 4 GHz and at least one base printed circuit (30), where a damping device (20) consisting of a substrate (20) made of resilient and electrically and thermally conductive material is arranged between the integrated circuit (10) and the base printed circuit (30).
摘要翻译：电子电路包括以不小于4GHz的频率工作的单片微波集成（MMIC）型的至少一个振荡器和至少一个基本印刷电路（30），其中由衬底（20）组成的阻尼装置（20）弹性和导电和导热材料布置在集成电路（10）和基底印刷电路（30）之间。

39. 发明公开

KR1020070110444A 반도체 장치 및 이를 갖는 전자 장치 有权
标题翻译：具有该半导体器件和电子器件的半导体器件
公开(公告)号：KR1020070110444A
公开(公告)日：2007-11-16
申请号：KR1020077023654
申请日：2006-03-09
申请人： 가부시키가이샤 한도오따이 에네루기 켄큐쇼
发明人： 수주키유키에 , 아라이야수유키 , 야마자키순페이
IPC分类号： G06K19/00 , H01L27/12 , H01L29/78 , H01L29/786
CPC分类号： H01L24/32 , H01L21/6836 , H01L21/84 , H01L23/64 , H01L23/66 , H01L24/29 , H01L24/83 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L27/105 , H01L27/1052 , H01L27/1214 , H01L27/1266 , H01L2221/68327 , H01L2221/6835 , H01L2221/68377 , H01L2221/68381 , H01L2223/6677 , H01L2224/03002 , H01L2224/03009 , H01L2224/06181 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/2912 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/2939 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29464 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/32501 , H01L2224/33181 , H01L2224/83005 , H01L2224/83007 , H01L2224/83851 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06565 , H01L2924/07811 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/142 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01Q23/00 , H01L27/0688 , H01L27/12 , H01L2924/00 , H01L2224/03 , H01L2924/0665 , H01L2924/00014 , H01L2924/014 , H01L2224/83
摘要： It is an object of the present invention to provide a wireless chip of which mechanical strength can be increased. Moreover, it is an object of the present invention to provide a wireless chip which can prevent an electric wave from being blocked. The invention is a wireless chip in which a layer having a thin film transistor is fixed to an antenna by an anisotropic conductive adhesive or a conductive layer, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer. The dielectric layer is sandwiched between the first conductive layer and the second conductive layer. The first conductive layer serves as a radiating electrode and the second conductive layer serves as a ground contact body.
摘要翻译：本发明的目的是提供一种可以增加其机械强度的无线芯片。此外，本发明的目的是提供一种能够防止电波被阻挡的无线芯片。本发明是一种无线芯片，其中具有薄膜晶体管的层通过各向异性导电粘合剂或导电层固定到天线，并且薄膜晶体管连接到天线。天线具有电介质层，第一导电层和第二导电层。电介质层夹在第一导电层和第二导电层之间。第一导电层用作辐射电极，第二导电层用作接地体。

40. 发明专利

JP4986628B2 Method for integrating a plurality of passive elements in contact with the spacer in the stacked die 有权
公开(公告)号：JP4986628B2
公开(公告)日：2012-07-25
申请号：JP2006545591
申请日：2004-12-20
申请人：インテル・コーポレーション
发明人：カン、ユング , チッカメナハリー、シャマラ , ラダハクリシュナン、カラドハー
IPC分类号： H01G4/33 , H01G2/06 , H01G4/40 , H01L23/522 , H01L23/66 , H01L25/065 , H01L25/16
CPC分类号： H01L25/0657 , H01L23/522 , H01L23/66 , H01L24/48 , H01L25/16 , H01L2224/04042 , H01L2224/16265 , H01L2224/32225 , H01L2224/32265 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2225/06506 , H01L2225/06527 , H01L2225/06575 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247 , H01L2924/00
摘要： An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.

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