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31. 发明授权

US07923826B2 Semiconductor device mounted on heat sink having protruded periphery 有权
标题翻译：安装在具有突出周边的散热器上的半导体器件
公开(公告)号：US07923826B2
公开(公告)日：2011-04-12
申请号：US12481078
申请日：2009-06-09
申请人： Noriyuki Takahashi , Mamoru Shishido
发明人： Noriyuki Takahashi , Mamoru Shishido
IPC分类号： H01L23/495 , H01L23/10 , H01L23/34 , H01L23/28
CPC分类号： H01L23/4334 , H01L21/561 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/05554 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.
摘要翻译：半导体芯片安装在布线板的通孔内的散热片上，半导体芯片的电极和布线基板的连接端子通过接合线连接，形成密封树脂以覆盖半导体芯片和接合线和焊球形成在布线板的下表面上，从而构成半导体器件。散热器比布线板厚。散热器具有从散热片的侧面突出到外侧的突出部，突出部位于通孔外侧的布线基板的上表面，突出部的下表面与上部接线板表面。当制造半导体器件时，从布线板的上表面侧插入散热片。

32. 发明授权

US07816185B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07816185B2
公开(公告)日：2010-10-19
申请号：US12534183
申请日：2009-08-03
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L23/485
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译：一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个托盘，并且分别从托盘传送半导体器件。由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

33. 发明申请

US20100248255A1 NOVEL PEPTIDES 审中-公开
标题翻译：新款PEPTIDES
公开(公告)号：US20100248255A1
公开(公告)日：2010-09-30
申请号：US11997144
申请日：2006-07-28
申请人： Motoo Yamasaki , Noriyuki Takahashi , Naoto Minamino , Kazuki Sasaki , Toshifumi Takao , Yoshinori Satomi
发明人： Motoo Yamasaki , Noriyuki Takahashi , Naoto Minamino , Kazuki Sasaki , Toshifumi Takao , Yoshinori Satomi
IPC分类号： G01N33/53 , C07K14/00 , C07K7/08 , C07H21/04 , C07K16/00 , C12N15/63 , C12N5/00 , C12P21/06 , C12Q1/02
CPC分类号： C07K14/475 , A61K38/00 , C07K16/22 , G01N2800/325
摘要： The present invention provides novel peptides with circulation-modulating activity. These peptides are useful as circulation-modulating agents and vasopressors because of their circulation-modulating activity, and can be used for treating diseases of the circulatory system such as myocardial infarction, ischemic heart disease, cerebral infarction, or the like.
摘要翻译：本发明提供具有循环调节活性的新型肽。这些肽由于其循环调节活性而可用作循环调节剂和血管加压剂，并且可用于治疗循环系统的疾病，例如心肌梗塞，缺血性心脏病，脑梗死等。

34. 发明授权

US07718008B2 Method for cleaning photo mask 有权
标题翻译：清洁光罩的方法
公开(公告)号：US07718008B2
公开(公告)日：2010-05-18
申请号：US11839655
申请日：2007-08-16
申请人： Shu Shimada , Noriyuki Takahashi , Hiroko Tanaka , Hiroyuki Ishii , Yusuke Shoji , Masashi Ohtsuki
发明人： Shu Shimada , Noriyuki Takahashi , Hiroko Tanaka , Hiroyuki Ishii , Yusuke Shoji , Masashi Ohtsuki
IPC分类号： B08B7/00 , G01N21/00
CPC分类号： G03F7/70925 , G03F1/64 , G03F1/82
摘要： The present invention provides a method for cleaning a photo mask without the need for removal of the pellicle mounted on the photo mask, without the large scale equipment for washing with a solution, with a small number of steps for cleaning and inspection, and without the increase of the production cost. The method for cleaning a photo mask with a pellicle mounted, in which the pellicle frame has a gas introducing hole and a gas discharging hole, comprises: a step of introducing a gaseous substituting substance from the gas introducing hole in a pellicle inner space surrounded by the photo mask and the pellicle, substituting foreign substances on the photo mask, and discharging the foreign substances from the gas discharging hole; and a step of irradiating an ultraviolet ray to the photo mask, while an air or a nitrogen gas or a rare gas is introduced from the gas introducing hole, for degrading the substituted substituting substance so as to be gaseous, and discharging the same from the gas discharging hole.
摘要翻译：本发明提供了一种清洁光掩模的方法，而不需要除去安装在光掩模上的防护薄膜组件，而不需要用溶液洗涤的大规模设备，具有少量用于清洁和检查的步骤，并且没有增加生产成本。用防护薄膜组件清洁光罩的方法，其中防护薄膜组件框架具有气体导入孔和气体排出孔，包括：将气体取代物质从气体导入孔引入防护薄膜组件内部空间的步骤，光掩模和防护薄膜组件，在光掩模上代替异物，并从排气孔排出异物; 以及从气体导入孔导入空气或氮气或稀有气体而将紫外线照射到光掩模的步骤，使取代的取代物质降解成气态，并将其从气体排放孔。

35. 发明授权

US07625779B2 Method of manufacturing a semiconductor device including a semiconductor chip having an inclined surface 有权
标题翻译：包括具有倾斜表面的半导体芯片的半导体器件的制造方法
公开(公告)号：US07625779B2
公开(公告)日：2009-12-01
申请号：US11003348
申请日：2004-12-06
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L21/78 , G01R1/0483 , G01R31/2863 , G01R31/2886 , H01L23/3114 , H01L23/3171 , H01L23/585 , H01L29/0657 , H01L2224/0401 , H01L2224/05569 , H01L2224/05572 , H01L2224/13022 , H01L2224/16 , H01L2924/00014 , H01L2924/0002 , H01L2924/01079 , H01L2924/10253 , H01L2924/00 , H01L2224/05552
摘要： Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.
摘要翻译：要防止半导体芯片的碎裂。半导体器件包括具有主表面的半导体芯片，在主表面上形成的多个焊盘，在主表面上形成的改变布线以改变多个焊盘的布置的重排布线，以及形成在多个焊盘上的保护膜和绝缘膜主表面和多个焊料凸块，每个焊料凸块连接到重排布线并且与多个焊盘不同的布置。形成在半导体芯片的主表面的周边上的与主表面倾斜连续的斜切面的存在防止了切屑。

36. 发明授权

US07384820B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07384820B2
公开(公告)日：2008-06-10
申请号：US11360512
申请日：2006-02-24
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译：一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个托盘，并且分别从托盘传送半导体器件。由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

37. 发明授权

US06928455B2 Method of and apparatus for controlling access to the internet in a computer system and computer readable medium storing a computer program 有权
标题翻译：用于在计算机系统中控制对因特网的访问的方法和装置以及存储计算机程序的计算机可读介质
公开(公告)号：US06928455B2
公开(公告)日：2005-08-09
申请号：US10255642
申请日：2002-09-27
申请人： Toshio Dougu , Noriyuki Takahashi
发明人： Toshio Dougu , Noriyuki Takahashi
IPC分类号： G06F13/00 , G06F17/30 , H04L29/06
CPC分类号： H04L63/0236 , G06F17/30867 , H04L63/10 , H04L63/20 , Y10S707/99932 , Y10S707/99933 , Y10S707/99945 , Y10S707/99948
摘要： The present invention provides a method of and apparatus for controlling internet browsing and computer readable medium storing a computer program carrying out the method of the present invention. The present invention provides a database storing worthwhile keywords. When a worthwhile keyword is included in contents or information from the Internet, a user is allowed to browse such contents or information even if a forbidden keyword is included.
摘要翻译：本发明提供一种用于控制因特网浏览的方法和装置以及存储执行本发明的方法的计算机程序的计算机可读介质。本发明提供一种存储有价值关键词的数据库。当来自互联网的内容或信息中包含有价值的关键字时，即使包含禁止的关键字，也允许用户浏览这些内容或信息。

38. 发明授权

US06723583B2 Method of manufacturing a semiconductor device using a mold 有权
标题翻译：使用模具制造半导体器件的方法
公开(公告)号：US06723583B2
公开(公告)日：2004-04-20
申请号：US10453606
申请日：2003-06-04
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

39. 发明授权

US6074575A Thin film electro-luminescence device 失效
标题翻译：薄膜电致发光器件
公开(公告)号：US6074575A
公开(公告)日：2000-06-13
申请号：US47100
申请日：1998-03-24
申请人： Akiko Sugioka , Noriyuki Takahashi , Isamu Yashima , Makoto Higuchi , Akiyoshi Mikami , Kousuke Terada , Katsuhiro Okada
发明人： Akiko Sugioka , Noriyuki Takahashi , Isamu Yashima , Makoto Higuchi , Akiyoshi Mikami , Kousuke Terada , Katsuhiro Okada
IPC分类号： C09K11/77 , H05B33/14 , H01J1/63
CPC分类号： H05B33/14 , C09K11/7703 , C09K11/7706 , C09K11/7718 , C09K11/7721 , C09K11/7734
摘要： A thin film electro-luminescence composition comprising an alkaline earth metal thiogallate represented by the following compositional formula: ##EQU1## wherein M.sup.1 is Sr or Ba; RE is a lanthanoid element; a and b are integers which are different from each other; and wherein x is 0.001 to 0.1 with the proviso that ##EQU2## is excluded or comprising an alkaline earth metal thioaluminate represented by the following compositional formula: ##EQU3## wherein M.sup.2 is Ca, Sr or Ba; RE is a lanthanoid element; c and d are integers which may be different from each other; and wherein y is 0.001 to 0.1,and a thin film electro-luminescence device comprising said thin film electro-luminescence composition as a luminescence layer.
摘要翻译：一种薄膜电致发光组合物，其包含由以下组成式表示的碱土金属硫代镓酸盐：其中M1是Sr或Ba; RE是镧系元素; a和b是彼此不同的整数; 并且其中x为0.001至0.1，条件是排除或包含由以下组成式表示的硫酸铝碱土金属：其中M2为Ca，Sr或Ba; RE是镧系元素; c和d是可以彼此不同的整数; 并且其中y为0.001至0.1，以及包含所述薄膜电致发光组合物作为发光层的薄膜电致发光器件。

40. 发明授权

US5144555A Method and apparatus for supporting of making formatted document 失效
标题翻译：支持制作格式文件的方法和装置
公开(公告)号：US5144555A
公开(公告)日：1992-09-01
申请号：US613166
申请日：1990-11-13
申请人： Masato Takadachi , Mihoko Iwasaki , Hiroyuki Maezawa , Yoshimitsu Shindo , Ryoji Eguchi , Hirokazu Mimura , Noriyuki Takahashi , Tetsuo Tanaka
发明人： Masato Takadachi , Mihoko Iwasaki , Hiroyuki Maezawa , Yoshimitsu Shindo , Ryoji Eguchi , Hirokazu Mimura , Noriyuki Takahashi , Tetsuo Tanaka
IPC分类号： G06F17/24 , G06F17/30
CPC分类号： G06F17/243 , G06F17/30011
摘要： A support method of and apparatus for making/editing a formatted document including a plurality types of formatted documents having a mutual relation therebetween. An input device inputs beforehand a relation between document forms before a formatted document is made, the inputted relation is stored in a storage device, and a relation between formatted documents is automatically generated by referring to the relation stored in the storage device.

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