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31. 发明授权

US06262513B1 Electronic component and method of production thereof 失效
标题翻译：电子部件及其制造方法
公开(公告)号：US06262513B1
公开(公告)日：2001-07-17
申请号：US08973858
申请日：1997-12-30
申请人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
发明人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
IPC分类号： H01L4108
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
摘要翻译：一种用于制造电子装置的电子装置和制造方法，该电子装置包括：具有主表面的表面声波装置3具有换能器部分4和电连接到换能器部分的布线图案5; 印刷电路板1，其布线图案2至少形成在其一个主表面上; 多个导电凸块6，其电连接两个相互相对的布线图案，并在表面声波装置3和印刷电路板1之间形成空间部分10; 树脂部11通过加热/熔化和硬化与装置的其他主表面紧密接触并涂覆装置3并与印刷电路板1一起密封装置3，其中通过采用高度触变性和粘性热固性树脂与常规树脂相比，可以提供具有简单结构的电子器件，并且可以简化用于制造电子器件的制造工艺。

32. 发明授权

US5740904A Switch assembly with internal electronic components 失效
标题翻译：具有内部电子部件的开关总成
公开(公告)号：US5740904A
公开(公告)日：1998-04-21
申请号：US711945
申请日：1996-09-04
申请人： Kenichi Ishizuka , Osamu Furukawa
发明人： Kenichi Ishizuka , Osamu Furukawa
IPC分类号： B60R16/02 , H01H9/02 , H01H9/04 , H01H23/06 , H01H23/14 , H01H1/64
CPC分类号： H01H23/14 , H01H9/0271 , H01H2021/225
摘要： A switch assembly with internal electronic components that enables easy assembly and is dustproof, and that can be oriented relative to the main board of a power window control switch or other devices with a lesser degree of limitation and has a wide variety of applications. A plurality of electronic components are mounted to one side of a plate 1. A plurality of switch electrodes 3 are formed in the other side of the plate 1. A switch case 6 is resiliently fit over the base plate 1. The switch case 6 includes an elongated aperture 61 within which a lever 41 of a switch operating mechanism 4 is loosely fit, pawls 62 adapted for resilient engagement with the base plate 1, projections 63 and a base 64. The switch operating mechanism 4 holds a movable contact 5. The switch case 6 defines a space 65 adjacent to the switch operating mechanism 4 and the movable contact 5. The switch electrodes 3 are sealably contained within the space 65 when the switch case 6 is resiliently fit over the base plate 1. The lever 41 includes a plurality of combined projections and recesses 41a to 41f arranged in a direction transverse to the direction in which the switch operating mechanism 4 is moved.
摘要翻译：具有内部电子部件的开关组件，其能够容易地组装和防尘，并且可以相对于电动窗口控制开关或其他具有较小限制的装置的主板定向并具有各种各样的应用。多个电子部件安装在板1的一侧。多个开关电极3形成在板1的另一侧。开关盒6弹性地配合在基板1上。开关壳6包括开关操作机构4的杆41松动地配合在其中的细长孔61，适于与基板1，突起63和基座64弹性接合的卡爪62.开关操作机构4保持可动触点5。开关壳体6限定与开关操作机构4和可动触点5相邻的空间65.当开关壳体6弹性配合在基板1上时，开关电极3可密封地容纳在空间65内。杠杆41包括沿与开关操作机构4移动的方向横切的方向配置有多个组合的突起和凹部41a至41f。

33. 发明授权

US4395810A Method for coating a sodium piping in a fast breeder reactor 失效
标题翻译：在快速增殖反应器中涂覆钠管道的方法
公开(公告)号：US4395810A
公开(公告)日：1983-08-02
申请号：US64385
申请日：1979-08-08
申请人： Yasuyuki Tsuzawa , Osamu Furukawa , Keibun Harada , Yoichi Uehara
发明人： Yasuyuki Tsuzawa , Osamu Furukawa , Keibun Harada , Yoichi Uehara
IPC分类号： G21C9/00 , B21D39/00 , B23P19/04
CPC分类号： G21C9/002 , Y02E30/34 , Y10T29/49391 , Y10T29/49893
摘要： A method for covering sodium conveying piping in a fast breeder reactor which makes use of metallic sodium as a coolant material is described herein, which method consists of the steps of preparing a covering material by mixing a raw material having sodium resistance and silicate or phosphate under a wet condition and after press-shaping said mixture drying the shaped mixture, and covering the sodium conveying piping with said covering material, whereby dispersion of leaked metallic sodium from the piping can be prevented.
摘要翻译：本文描述了一种利用金属钠作为冷却剂材料的快速增殖反应器中的钠输送管道的方法，该方法包括以下步骤：通过将具有耐钠性的原料和硅酸盐或磷酸盐混合制成覆盖材料湿润状态，并且在压制成型后将所述混合物干燥，并用所述覆盖材料覆盖所述钠输送管道，从而可以防止从管道泄漏的金属钠的分散。

34. 发明申请

US20100094598A1 THREE-DIMENSIONAL DATA GENERATION DEVICE, METHOD AND PROGRAM THEREOF 失效
标题翻译：三维数据生成设备，其方法和程序
公开(公告)号：US20100094598A1
公开(公告)日：2010-04-15
申请号：US12575203
申请日：2009-10-07
申请人： Yuuki OKADA , Shingo Fujii , Hiroki Yabu , Osamu Furukawa
发明人： Yuuki OKADA , Shingo Fujii , Hiroki Yabu , Osamu Furukawa
IPC分类号： G06F17/50
CPC分类号： G06F17/5004 , G06F17/509 , G06F2217/34 , G06F2217/36 , G06T17/10
摘要： Three-dimensional data can be easily and automatically generated using existing non-three-dimensional data in the form of isometric drawings or the like, without resorting to three-dimensional arrangement adjustment CAD. In three-dimensional data generation unit 120, data edition unit 122, generates a spreadsheet data that includes information relating to a plurality of node points on a continuous arrangement route of target components by interactive process with a user, and stores the data in storage unit 130. Three-dimensional data conversion unit 123, on the basis of spreadsheet data, arranges the node points in a three-dimensional space, connects node points having a predetermined relationship using line segments, and imparts cross-sectional shapes to the connected line segments, to carry out thereby conversion into target component arrangement three-dimensional data. Three-dimensional data management unit 124 stores the obtained target component arrangement three-dimensional data in storage unit 130, in a format readable by three-dimensional CAD or three-dimensional review system, and outputs the data in response to an output instruction from interface unit 110.
摘要翻译：使用现有的等距图形等的形式的非三维数据，可以容易且自动地生成三维数据，而不依赖于三维排列调整CAD。在三维数据生成单元120中，数据编辑单元122通过与用户的交互处理，在目标组件的连续排列路线上生成包括与多个节点相关的信息的电子表格数据，并将该数据存储在存储单元三维数据转换单元123基于电子表格数据将节点排列在三维空间中，使用线段连接具有预定关系的节点，并将连接的线段赋予横截面形状，从而将其转换为目标分量排列三维数据。三维数据管理单元124以三维CAD或三维查看系统可读取的格式将获得的目标分量排列三维数据存储在存储单元130中，并且响应于来自界面的输出指令输出数据单元110。

35. 发明申请

US20070085935A1 Trigger signal generator 审中-公开
标题翻译：触发信号发生器
公开(公告)号：US20070085935A1
公开(公告)日：2007-04-19
申请号：US11581409
申请日：2006-10-17
申请人： Osamu Furukawa
发明人： Osamu Furukawa
IPC分类号： H04N5/50
CPC分类号： G01R13/0254
摘要： A trigger signal generator for outputting a trigger signal having a lower frequency than that of an input signal, the trigger signal generator including: a frequency divider circuit for dividing a frequency of the input signal; and a synchronizing circuit including a synchronizer for synchronizing the frequency-divided signal with the input signal.
摘要翻译：一种触发信号发生器，用于输出具有比输入信号低的频率的触发信号，所述触发信号发生器包括：分频器电路，用于分频输入信号的频率; 以及包括用于使分频信号与输入信号同步的同步器的同步电路。

36. 发明申请

US20070019768A1 Sampling device and sampling method 审中-公开
标题翻译：取样装置及采样方法
公开(公告)号：US20070019768A1
公开(公告)日：2007-01-25
申请号：US11486141
申请日：2006-07-14
申请人： Osamu Furukawa , Shinichi Nakano , Takashi Yoshida
发明人： Osamu Furukawa , Shinichi Nakano , Takashi Yoshida
IPC分类号： H04L7/00
CPC分类号： G01R13/0272 , G01R31/31709 , H04L7/033
摘要： A sampling device for repetitive sampling a measured signal includes a measured signal sampling circuit for sampling the measured signal, a reference signal generating circuit for generating a reference signal having a predetermined frequency, a sampling circuit for sampling the reference signal generated by the reference signal generating circuit, and a frequency converting circuit for generating a strobe signal from a clock signal being synchronized with the measured signal, the strobe signal causing the sampling circuit and the measured signal sampling circuit to execute sampling.
摘要翻译：用于对测量信号进行重复采样的采样装置包括用于对测量信号进行采样的测量信号采样电路，用于产生具有预定频率的参考信号的参考信号产生电路，用于对由参考信号产生产生的参考信号进行采样的采样电路电路，以及频率转换电路，用于从与所测量的信号同步的时钟信号产生选通信号，所述选通信号使所述采样电路和所测量的信号采样电路执行采样。

37. 发明授权

US07102462B2 Surface acoustic wave device 有权
公开(公告)号：US07102462B2
公开(公告)日：2006-09-05
申请号：US11024769
申请日：2004-12-30
申请人： Noriaki Taniguchi , Osamu Furukawa , Toshihiko Murata , Osamu Kawachi
发明人： Noriaki Taniguchi , Osamu Furukawa , Toshihiko Murata , Osamu Kawachi
IPC分类号： H03H9/25 , H01L41/083
CPC分类号： H01F17/0006 , H01F5/003 , H01F27/29 , H01F2017/0046 , H01L23/5227 , H01L2924/0002 , H03H9/0576 , H03H9/725 , H03H2001/0078 , H01L2924/00
摘要： The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

38. 发明授权

US07021595B2 Slide rail 失效
标题翻译：滑轨
公开(公告)号：US07021595B2
公开(公告)日：2006-04-04
申请号：US10723262
申请日：2003-11-25
申请人： Osamu Furukawa , Yuuichi Ayuha , Toshiharu Endou
发明人： Osamu Furukawa , Yuuichi Ayuha , Toshiharu Endou
IPC分类号： F16M13/00
CPC分类号： F16C29/04 , B60N2/0702 , B60N2/245
摘要： A slide rail has a pair of inside rails in which V-grooves having a V shape in cross section are formed in a lengthwise direction in outside faces of the pair of inside rails which have inside faces provided so as to face each other. V-grooves are formed in inside faces of a pair of outside rails provided outside of both the inside rails, and the outside rails are moved relative to the inside rails by spherical bodies provided between both the V-grooves. A stay has ends which are supported on the inside faces of both the inside rails substantially opposing the V-grooves of the inside rails, and the stay is provided with a regulation mechanism for adjusting and maintaining a distance between both the inside rails.
摘要翻译：滑轨具有一对内侧轨道，其中具有V形横截面的V形槽沿着一对内侧轨道的外侧表面沿长度方向形成，内侧面设置成彼此相对。 V形槽形成在设置在两个内侧轨道的外侧的一对外侧轨道的内表面中，并且外侧轨道通过设置在两个V形槽之间的球形体相对于内侧轨道移动。支架具有支承在与内侧轨道的V形槽相对的两个内侧轨道的内侧面上的端部，并且该支架设置有用于调节和保持两个内侧轨道之间的距离的调节机构。

39. 发明申请

US20060022767A1 Surface acoustic wave device 有权
标题翻译：表面声波装置
公开(公告)号：US20060022767A1
公开(公告)日：2006-02-02
申请号：US11024769
申请日：2004-12-30
申请人： Noriaki Taniguchi , Osamu Furukawa , Toshihiko Murata , Osamu Kawachi
发明人： Noriaki Taniguchi , Osamu Furukawa , Toshihiko Murata , Osamu Kawachi
IPC分类号： H03H9/72
CPC分类号： H01F17/0006 , H01F5/003 , H01F27/29 , H01F2017/0046 , H01L23/5227 , H01L2924/0002 , H03H9/0576 , H03H9/725 , H03H2001/0078 , H01L2924/00
摘要： The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.
摘要翻译：本发明允许进一步小型化和缩短声表面波器件，同时避免弹性表面波器件对螺旋电感器的电感值和性能指标（Q值）的影响。其上形成有螺旋电感器的芯片与另一声表面波器件芯片一起倒装安装在封装中。该包装有一个气密密封的盖子。导体图案形成在封装的面对螺旋电感器的表面上。此外，螺旋电感器的区域和导体图案之间的重叠为7％以下。

40. 发明授权

US06754950B2 Electronic component and method of production thereof 有权
标题翻译：电子部件及其制造方法
公开(公告)号：US06754950B2
公开(公告)日：2004-06-29
申请号：US09772859
申请日：2001-01-31
申请人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
发明人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
IPC分类号： H05K330
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
摘要翻译：一种用于制造电子装置的电子装置和制造方法，该电子装置包括：具有主表面的表面声波装置3具有换能器部分4和电连接到换能器部分的布线图案5; 印刷电路板1，其布线图案2至少形成在其一个主表面上; 多个导电凸块6，其电连接两个相互相对的布线图案，并在表面声波装置3和印刷电路板1之间形成空间部分10; 树脂部11通过加热/熔化和硬化与装置的其他主表面紧密接触并涂覆装置3并与印刷电路板1一起密封装置3，其中通过采用高度触变性和粘性热固性树脂与常规树脂相比，可以提供具有简单结构的电子器件，并且可以简化用于制造电子器件的制造工艺。

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