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    • 36. 发明授权
    • Semiconductor device embedded with pressure sensor and manufacturing method thereof
    • 嵌入压力传感器的半导体器件及其制造方法
    • US07451656B2
    • 2008-11-18
    • US11878243
    • 2007-07-23
    • Natsuki YokoyamaShuntaro MachidaYasushi Goto
    • Natsuki YokoyamaShuntaro MachidaYasushi Goto
    • G01L9/00G01L9/16
    • G01L9/0073
    • The method for promoting the size reduction, the performance improvement and the reliability improvement of a semiconductor device embedded with pressure sensor is provided. In a semiconductor device embedded with pressure sensor, a part of an uppermost wiring is used as a lower electrode of a pressure detecting unit. A part of a silicon oxide film formed on the lower electrode is a cavity. On a tungsten silicide film formed on the silicon oxide film, a silicon nitride film is formed. The silicon nitride film has a function to fill a hole or holes and suppress immersion of moisture from outside to the semiconductor device embedded with pressure sensor. A laminated film of the silicon nitride film and the tungsten silicide film forms a diaphragm of the pressure sensor.
    • 提供了一种用于促进嵌入压力传感器的半导体器件的尺寸减小,性能改进和可靠性改进的方法。 在嵌入压力传感器的半导体装置中,最上部布线的一部分用作压力检测单元的下部电极。 形成在下电极上的氧化硅膜的一部分是空腔。 在氧化硅膜上形成的硅化钨膜上形成氮化硅膜。 氮化硅膜具有填充孔或孔的功能,并且抑制水分从外部浸入到嵌入压力传感器的半导体器件中。 氮化硅膜和硅化钨膜的叠层膜形成压力传感器的膜片。
    • 40. 发明申请
    • Switch, semiconductor device, and manufacturing method thereof
    • 开关,半导体器件及其制造方法
    • US20070018761A1
    • 2007-01-25
    • US11472355
    • 2006-06-22
    • Kiyoko YamanakaYasushi Goto
    • Kiyoko YamanakaYasushi Goto
    • H01H51/22
    • H01H1/0036B81B2207/07B81C1/00246B81C2203/0136B81C2203/0735H01H59/0009
    • It is an objective to achieve a MEMS switch which can be mounted with a CMOS circuit and has a contact point with high reliability, both mechanically and electrically. An insulator having a compatibility with a CMOS process is formed at the contact surface of a cantilever beam constituting a MEMS switch and a fixed contact 2 opposite thereto. When the switch is used the cantilever beam is moved by applying a voltage to the pull-in electrode and the cantilever beam. After the cantilever beam makes contact with the fixed contact, a voltage exceeding the breakdown field strength of the insulator is applied to the insulator, resulting in dielectric breakdown occurring. By modifying the insulator once, the mechanical fatigue concentration point of the switch contact point is protected, and a contact point is achieved as well in which electrical signals are transmitted through the current path formed by the dielectric breakdown.
    • 实现可以安装有CMOS电路并具有机械和电气的高可靠性的接触点的MEMS开关的目的。 在构成MEMS开关的悬臂梁和与其相对的固定触头2的接触表面处形成具有与CMOS工艺兼容的绝缘体。 当使用开关时,通过向拉入电极和悬臂梁施加电压来移动悬臂梁。 在悬臂梁与固定触点接触之后,超过绝缘体击穿场强的电压被施加到绝缘体上,导致电介质击穿。 通过改变绝缘体一次,保护开关接触点的机械疲劳浓度点,并且实现接触点,其中电信号通过由电介质击穿形成的电流路径传输。