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31. 发明专利

JP2004327672A Semiconductor device 审中-公开
公开(公告)号：JP2004327672A
公开(公告)日：2004-11-18
申请号：JP2003119537
申请日：2003-04-24
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： AKAGAWA KOICHI , NAGASE TOSHIAKI , ONISHI HIROYUKI , ISHIKAWA JUN , SHIMOKAWA MOTOMARE
IPC分类号： H01L23/36 , H01L23/50
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To facilitate assembling work while reducing the size and cost.
SOLUTION: A substrate 2 and a main power electrode 3 are formed of one copper member where a thick part serves as the substrate 2 and a thin part serves as the main power electrode 3. A semiconductor element 5 is bonded to the upper surface of the substrate 2 and connected electrically with the main power electrode 3 through the substrate 2. A control electrode 4 is arranged closer to the main power electrode 3 side than the semiconductor element 5 on the upper surface of the substrate 2 and connected with the semiconductor element 5 by a bonding wire 9. The main power electrode 3 is parallel with the substrate 2 before being assembled and is bent, during assembling work, to the upper surface side substantially perpendicularly to the substrate 2.
COPYRIGHT: (C)2005,JPO&NCIPI

32. 发明专利

JP2004303850A Semiconductor device and its manufacturing method 审中-公开
公开(公告)号：JP2004303850A
公开(公告)日：2004-10-28
申请号：JP2003093177
申请日：2003-03-31
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , SHIMOKAWA MOTOMARE , AKAGAWA KOICHI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce a semiconductor device in size and to simplify its manufacturing processes.
SOLUTION: A semiconductor element 2 is soldered on the top surface of a base board 1. A lower electrode 3 and an upper electrode 4 are integrally formed with an electrode insert case 5 and held. The electrode insert case 5 is fixed to the base board 1 with an adhesive agent 7. The lower electrode 3 is brought into electrical contact with the base board 1 with solder 8. The upper electrode 4 is electrically connected to the semiconductor element 2 with a bonding wire 9.
COPYRIGHT: (C)2005,JPO&NCIPI

33. 发明专利

JP2004297972A Semiconductor device 审中-公开
公开(公告)号：JP2004297972A
公开(公告)日：2004-10-21
申请号：JP2003090074
申请日：2003-03-28
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , SHIMOKAWA MOTOMARE , AKAGAWA KOICHI
IPC分类号： H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device in which connection between a plurality of semiconductor modules constituting one inverter and a sheet of control board for controlling the operation thereof can be realized simply, easily and inexpensively. SOLUTION: The semiconductor device is constituted so that one end parts 14A, 15A and 16A of three flexible flat cables 14, 15 and 16 are bonded to respective control signal receiving electrodes of three 2 in 1 semiconductor modules 2, 3 and 4 constituting one inverter 1, and the other end parts 14B, 15B and 16B of the flexible flat cables 14, 15 and 16 are connected, respectively, with three connectors 18, 19 and 20 provided on a sheet of control board 17 having a circuit for controlling the operation of the semiconductor modules 2, 3 and 4. COPYRIGHT: (C)2005,JPO&NCIPI

34. 发明专利

JP2004296976A Mounting method of semiconductor power module 审中-公开
公开(公告)号：JP2004296976A
公开(公告)日：2004-10-21
申请号：JP2003090075
申请日：2003-03-28
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ISHIKAWA JUN , NAGASE TOSHIAKI , ONISHI HIROYUKI , SHIMOKAWA MOTOMARE , AKAGAWA KOICHI
IPC分类号： H01L23/40
摘要： PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor power module by which the semiconductor power module of a noninsulation type is easily mounted to a heat sink.
SOLUTION: An insulating sheet 21 is first bonded to an upper face of the heat sink 13, then a silicon-based adhesive agent 12 of thermal conductivity and an insulation property is applied to an inner peripheral face surrounded by the insulating sheet 21. The power module 11 is put on the adhesive agent 12 and is heated in an atmosphere of about 140°C to cure the adhesive agent 12, by which the power module 11 and the heat sink 13 are fixed by the adhesive agent 12 with these components kept at a certain interval.
COPYRIGHT: (C)2005,JPO&NCIPI

35. 发明专利

JP2014236570A 電力変換装置审中-公开
标题翻译：电源转换器件
公开(公告)号：JP2014236570A
公开(公告)日：2014-12-15
申请号：JP2013116097
申请日：2013-05-31
申请人：株式会社豊田自動織機 , Toyota Industries Corp
发明人： ISHIKAWA JUN
IPC分类号： H02M7/48
CPC分类号： H01L2224/72
摘要：【課題】小型化が可能な電力変換装置を提供する。【解決手段】インバータ装置1は、所定の間隔を置いて互いに対向して配置されたベース基板10及び制御基板20と、ベース基板10と制御基板20との間に配置された複数のパワー素子30と、導電性を有する圧接電極80と、を備えている。パワー素子30は、ベース基板10及び制御基板20のそれぞれに対向する一対の主面30a,30bと、主面30a,30bのそれぞれに形成された一対の電極と、を有している。圧接電極80は、弾性力を付与された状態において、パワー素子30の電極とベース基板10の配線パターン13及び/又は制御基板20の配線とに接触することにより、パワー素子30の電極とベース基板10の配線及び/又は制御基板20の配線とを電気的に接続している。【選択図】図2
摘要翻译：要解决的问题：提供小型电力转换装置。解决方案：逆变器装置1包括：以预定间隔彼此相对布置的基板10和控制板20; 布置在基板10和控制板20之间的多个功率元件30; 和导电压接触电极80.功率元件30分别具有与基板10和控制板20相对的一对主表面30a，30b和分别形成在主表面30a，30b上的一对电极。压力接触电极80弹性地与功率元件30的电极和基板10的布线图案13和/或控制板20的布线接触，以电连接功率元件30的电极和布线和/或控制板20的布线。

36. 发明专利

JP2014087205A Power conversion device 审中-公开
标题翻译：电源转换器件
公开(公告)号：JP2014087205A
公开(公告)日：2014-05-12
申请号：JP2012235774
申请日：2012-10-25
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ISHIKAWA JUN
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To enable miniaturization of a main circuit board on which a switching element and an electrode are mounted to miniaturize a physical constitution of a current conversion device.SOLUTION: An input electrode and an output electrode (a U-phase output electrode 27 and the like) are mounted on a main circuit board 21 in a state that they are electrically connected with a plurality of switching elements connected in parallel. Each of the input electrode and the output electrode comprises: a pattern connection electrode part 27a and the like fixed onto the main circuit board 21 by means of screws 31a and 31b, and placed on a conductor pattern of the main circuit board 21 to be surface-contacted with the conductor pattern; and an external wiring connection electrode part 27b and the like connected with the pattern connection electrode part at a base end, and extending in a vertical direction to the main circuit board 21. At a lower side of a recessed part 30 formed at a lower part of the external wiring connection electrode part 27b and the like and opened laterally, a fixing part 32 for fastening and fixing the pattern connection electrode part to the main circuit board 21 by means of the screw 31a is provided, and a head of the screw 31a is housed in the recessed part 30.
摘要翻译：要解决的问题：为了使安装有开关元件和电极的主电路板的小型化，使电流转换装置的物理结构小型化。解决方案：输入电极和输出电极（U相输出电极 27等）以与并联连接的多个开关元件电连接的状态安装在主电路板21上。输入电极和输出电极各自包括：通过螺钉31a和31b固定到主电路板21上的图形连接电极部分27a等，并且被放置在主电路板21的导体图案上与导体图形相连接; 以及在基端部与图形连接用电极部连接的外部配线用连接电极部27b等，并且在垂直方向上延伸到主电路基板21.在形成在下部的凹部30的下侧外部布线连接电极部27b等侧面设置有用于通过螺钉31a将图形连接电极部紧固固定到主电路基板21的固定部32，螺钉31a的头部容纳在凹部30中。

37. 发明专利

JP2009283567A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2009283567A
公开(公告)日：2009-12-03
申请号：JP2008132267
申请日：2008-05-20
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE , ONISHI HIROYUKI
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/37 , H01L2224/371 , H01L2224/40 , H01L2224/40225 , H01L2224/83801 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device with a wiring member having board thickness with necessary current capacity and terminal part bendability and reducing inductance of wiring. SOLUTION: The semiconductor device is formed of a sheet conductor, and a positive electrode wring member 27 and a negative electrode wiring member 28, which have a plurality of terminal parts 27a and 28a, are closely arranged in parallel while being electrically insulated. The terminal parts 27a and 28a have bending parts 27c and 28c, which are bent so that they form angle shapes with respect to main body parts 27A and 28A, bonding parts 27b and 28b, which extend in parallel to the main body parts 27A and 28A on a tip side and are formed to be thinner than the main body parts 27A and 28A. The bending parts 27c and 28c are formed in thin parts. The positive electrode wiring member 27 and the negative electrode wring member 28 are arranged so that surfaces without steps confront each other. The bonding parts 27b and 28b are bonded to a circuit pattern by ultrasonic bonding. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有布线构件的布线构件，所述布线构件具有具有必要电流容量的板厚度和端子部分弯曲性，并且减小布线的电感。解决方案：半导体器件由片状导体形成，并且具有多个端子部分27a和28a的正极绞合构件27和负极配线构件28在电绝缘的情况下并联紧密地布置。端子部分27a和28a具有弯曲部分27c和28c，弯曲部分27c和28c相对于主体部分27A和28A形成角度形状，平行于主体部分27A和28A延伸的接合部分27b和28b 形成为比主体部27A，28A薄。弯曲部分27c和28c形成为薄的部分。正电极配线构件27和负极电连接构件28被布置成使得没有台阶的表面彼此面对。接合部27b，28b通过超声波接合与电路图形接合。版权所有（C）2010，JPO＆INPIT

38. 发明专利

JP2007234694A Semiconductor device, and bonding method of external connection terminal of same and external electrode 有权
标题翻译：半导体器件及其外部连接端子和外部电极的接合方法
公开(公告)号：JP2007234694A
公开(公告)日：2007-09-13
申请号：JP2006051506
申请日：2006-02-28
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To suppress the occurrence of inductance, and to reduce the resistance of the bonding section between the positive and negative side external connection terminals of a semiconductor device, and an external electrode bonded to each external connection terminal.
SOLUTION: In the semiconductor device 10, the negative side external electrode 14 is bonded to the planar positive side external connection terminal 11 of which one end is connected to a semiconductor element for power, and the negative side external electrode 14 is bonded to the planar negative side external connection terminal 12. The positive side external electrode 13 and the negative side external electrode 14 are arranged in parallel while sandwiching an insulating material 15, and are bonded to the positive and negative side external connection terminals 11, 12 at one end by ultrasonic junction. In the positive and negative external connection terminals 11, 12, bonding surfaces 11a, 12a to the positive and negative external electrodes 13, 14 are formed on a plane, a surface at a side opposite to the bonding surfaces 11a, 12a is extended along the outer surface of a housing 16 while being adhered to a mold resin, and parts reaching the bonding surfaces 11a, 12a are molded by resin so that they are parallel.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了抑制电感的发生，并且降低半导体器件的正负侧外部连接端子与结合到每个外部连接端子的外部电极之间的接合部分的电阻。解决方案：在半导体器件10中，负侧外部电极14接合到其一端连接到用于功率的半导体元件的平面正侧外部连接端子11，并且负侧外部电极14被接合平面负极侧外部连接端子12.正极侧外部电极13和负极侧外部电极14平行配置，夹着绝缘材料15，并且与负极侧外部连接端子11,12接合一端通过超声波接头。在正极和负极外部连接端子11,12中，在正面和负极外部电极13,14上的接合面11a，12a形成在平面上，与接合面11a，12a相反一侧的表面沿着壳体16的外表面，同时粘附到模制树脂上，并且到达接合表面11a，12a的部分由树脂模制成它们是平行的。版权所有（C）2007，JPO＆INPIT

39. 发明专利

JP2006303086A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2006303086A
公开(公告)日：2006-11-02
申请号：JP2005120993
申请日：2005-04-19
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ISHIKAWA JUN
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/49109 , H01L2224/73265 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a small semiconductor device of which energy loss is reduced.
SOLUTION: A ceramic insulating substrate 3 comprises an insulating board 6 of ceramics, and first and second conductive members 7 and 8 arranged on the upper and lower surfaces, respectively, of the insulating board 6. Since, in the first conductive member 7, a wiring pattern 9 to which the rear surface electrode of a semiconductor element 5 is jointed is integrally formed with a first external electrode 10, the wiring pattern 9 is not required to be connected to the first external electrode 10 using wire bonding.
COPYRIGHT: (C)2007,JPO&INPIT

40. 发明专利

JP2005142189A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2005142189A
公开(公告)日：2005-06-02
申请号：JP2003374116
申请日：2003-11-04
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ISHIKAWA JUN , NAGASE TOSHIAKI , ONISHI HIROYUKI , AKAGAWA KOICHI
IPC分类号： H01L23/12 , H01L23/36 , H01L23/48 , H01L23/498 , H01L25/07 , H01L25/18
CPC分类号： H01L25/072 , H01L2224/48091 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To prevent a rise in temperature of a wiring pattern in which main current flows, and also to suppress an increase in cost of components.
SOLUTION: A copper pattern 33 is formed on an insulating circuit substrate 32, a heat spreader 34 is soldered onto the copper pattern 33, and a semiconductor chip 35 is mounted on the heat spreader 34. An external electrode 36 and the heat spreader 34 are placed so that a distance (a) between a side face 36a of the electrode 36 and a side face 34a of the spreader 34 (the horizontal distance (a) in the figure) is short. Thus, a rise in temperature of the copper pattern 33 between the side face 36a of the external electrode 36 and the side face 34a of the heat spreader 34 can be controlled.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止主电流流动的布线图案的温度上升，并且还抑制部件成本的增加。解决方案：在绝缘电路基板32上形成铜图案33，将散热器34焊接到铜图案33上，半导体芯片35安装在散热器34上。外部电极36和热放电器34放置成电极36的侧面36a与扩展器34的侧面34a（图中的水平距离（a））之间的距离（a）短。因此，可以控制外部电极36的侧面36a与散热器34的侧面34a之间的铜图案33的温度升高。版权所有（C）2005，JPO＆NCIPI

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