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    • 33. 发明申请
    • RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT
    • 用于封装光学半导体元件的树脂组合物
    • US20100029887A1
    • 2010-02-04
    • US12510491
    • 2009-07-28
    • Yoshihira HamamotoToshio ShiobaraMiyuki WakaoTsutomu Kashiwagi
    • Yoshihira HamamotoToshio ShiobaraMiyuki WakaoTsutomu Kashiwagi
    • C09D183/04C08G77/04
    • C08G59/306C08G59/3254C08L83/06
    • A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).
    • 一种包含下述成分(A),(B)和(C)的光半导体元件的树脂组合物:(A)含有2〜6个环氧基的支链硅氧烷树脂,1个以上(R 1 SiO 3/2) 两个或多个(R 2 R 3 SiO)n结构和每个分子3个以上(R 43-x R 5 x SiO 1/2)单元,其量为100重量份,其中R 1,R 2,R 3,R 4和R 5各自表示氢原子,羟基 基团或1〜20个碳原子的一价有机基团,该一价有机基团可以含有或不含有氧原子,条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团,n表示3〜20的整数,x表示1〜3的整数,(B)固化剂,其量为组分(B)中环氧基反应性基团的含量为0.4 至组分(A)中每1mol环氧基团为1.5摩尔,和(C)固化催化剂,其量范围为fr 每100重量份组分(A)和组分(B)的组合0.01-1重量份。
    • 37. 发明申请
    • PHOSPHOR-FILLED CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF
    • 磷光填充固化硅树脂组合物及其固化产品
    • US20070293623A1
    • 2007-12-20
    • US11762445
    • 2007-06-13
    • Tsutomu KASHIWAGIToshio Shiobara
    • Tsutomu KASHIWAGIToshio Shiobara
    • C08L83/04B32B27/00
    • C08L83/04C08G77/12C08G77/20C08G77/70C08K3/32C08L83/00
    • A phosphor-containing addition-curable silicone resin composition is provided. The composition is capable of forming a cured product which exhibits excellent crack resistance and shock resistance, and minimal surface tackiness. The composition includes (A) an organopolysiloxane including R1SiO1.5 units (T units), R22SiO units (D units), and R3aR4bSiO(4-a-b)/2 units (wherein, R1, R2 and R3 represent a methyl group or the like, R4 represents a vinyl group or allyl group, a represents an integer from 0 to 2, b represents 1 or 2, and a+b is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300; (B) an Si—H-containing polysiloxane including T units, D units, and R3cHdSiO(4-c-d)/2 units (wherein, c represents an integer from 0 to 2, d represents 1 or 2, and c+d is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300, in sufficient quantity that the molar ratio of Si-bonded hydrogen atoms within (B), relative to vinyl groups or allyl groups within (A), is within a range from 0.1 to 4.0; (C) a catalyst; and (D) a phosphor.
    • 提供含磷光体的可加成固化的有机硅树脂组合物。 该组合物能够形成表现出优异的抗裂性和抗冲击性和最小表面粘性的固化产物。 该组合物包括(A)包括R 1 SiO 2单元(T单元),R 2 2 O 2的有机聚硅氧烷, SiO单元(D单元)和R 3 S 4 S 4(4-ab) )/ 2单元(其中,R 1,R 2,R 3和R 3代表甲基等, SUP> 4 代表乙烯基或烯丙基,a表示0至2的整数,b表示1或2,a + b为2或3),其中D的重复次数 单位在5到300之间; (B)包含T单元,D单元和R 3 S H 2 SiO(4)的含Si-H的聚硅氧烷 -cd)/ 2个单元(其中,c表示0〜2的整数,d表示1或2,c + d为2或3),D单元的重复次数为 (B)相对于乙烯基或烯丙基之间的与Si结合的氢原子的摩尔比在(A)中的摩尔比在0.1至4.0的范围内; (C)催化剂; 和(D)荧光体。
    • 38. 发明授权
    • Radiation curing silicone rubber composition, adhesive silicone elastomer film formed from same, semiconductor device using same, and method of producing semiconductor device
    • 辐射固化硅橡胶组合物,由其形成的粘合性硅氧烷弹性体膜,使用其的半导体器件,以及半导体器件的制造方法
    • US07241823B2
    • 2007-07-10
    • US10732519
    • 2003-12-11
    • Tsutomu KashiwagiShinji MakikawaToshiyuki SutouToshio Shiobara
    • Tsutomu KashiwagiShinji MakikawaToshiyuki SutouToshio Shiobara
    • C08K5/24
    • C08L51/085C08K5/5425C08L53/00C08L83/00C08L83/06C08L2666/02C09J151/085C09J153/00C09J183/06C08L83/04
    • There are provided a radiation curing silicone rubber composition that is useful for the bonding of substrates, an adhesive silicone elastomer film formed from such a composition, a structural body in which two substrates are bonded via a cured layer formed from the composition, and a method of producing such a structural body. The composition includes: (a) an organohydrogenpolysiloxane containing at least one group selected from the group consisting of acryloyl groups and methacryloyl groups, and at least one hydrosilyl group; (b) a fluid organopolysiloxane with at least two groups which are each selected from the group consisting of acryloyl groups and methacryloyl groups, and with no hydrosilyl groups; (c) a compound selected from the group consisting of alkoxysilanes, partial hydrolysis-condensation products of alkoxysilanes, organosilane-modified isocyanurates and organosiloxane-modified isocyanurates; (d) a radiation sensitizer; and (e) a platinum group metal-based catalyst. The composition is of low elasticity, while also providing excellent heat resistance, adhesion, and workability.
    • 提供了一种可用于粘合基材的辐射固化硅橡胶组合物,由这种组合物形成的粘合性硅氧烷弹性体膜,其中两个基板通过由该组合物形成的固化层结合的结构体,以及一种方法 生产这样的结构体。 该组合物包括:(a)含有选自丙烯酰基和甲基丙烯酰基的至少一个基团的有机氢聚硅氧烷和至少一个氢化硅烷基; (b)具有至少两个基团的流体有机聚硅氧烷,其各自选自丙烯酰基和甲基丙烯酰基,且不具有氢化甲硅烷基; (c)选自烷氧基硅烷,烷氧基硅烷的部分水解缩合产物,有机硅烷改性的异氰脲酸酯和有机硅氧烷改性的异氰脲酸酯的化合物; (d)辐射敏化剂; 和(e)铂族金属基催化剂。 该组合物具有低弹性,同时还提供优异的耐热性,粘合性和可加工性。