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31. 发明授权

US08455986B2 Mosfet package 失效
标题翻译： Mosfet包装
公开(公告)号：US08455986B2
公开(公告)日：2013-06-04
申请号：US13459839
申请日：2012-04-30
申请人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
发明人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
IPC分类号： H01L23/495
CPC分类号： H01L23/49555 , H01L21/4814 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/28 , H01L23/3107 , H01L23/495 , H01L23/4952 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/83 , H01L24/84 , H01L24/97 , H01L29/7833 , H01L2224/0401 , H01L2224/04026 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16245 , H01L2224/29011 , H01L2224/29015 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/45139 , H01L2224/73253 , H01L2224/75251 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/83101 , H01L2224/83138 , H01L2224/83191 , H01L2224/83825 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H05K3/3426 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2224/29139 , H01L2924/3512 , H01L2224/48 , H01L2924/00012
摘要： A semiconductor device featuring a semiconductor chip having a first main surface and a second, opposing main surface and including a MOSFET having source and gate electrodes formed on the first main surface and a drain electrode thereof formed on the second main surface, first and second conductive members acting as lead terminals for the source and gate electrodes, respectively, are disposed over the first main surface, each of the first and second conductive members has a part overlapped with the chip in a plan view, a sealing body sealing the chip and parts of the first and second conductive members such that a part of the first conductive member is projected outwardly from a first side surface of the sealing body and parts of the first and second conductive members are projected outwardly from the opposing second side surface of the sealing body in a plan view.
摘要翻译：一种具有半导体芯片的半导体器件，具有第一主表面和第二相对的主表面，并且包括形成在第一主表面上的源极和栅电极的MOSFET，以及形成在第二主表面上的漏电极，第一和第二导电作为源电极和栅电极的引线端子的部件分别设置在第一主表面上，第一和第二导电部件中的每一个在平面图中与芯片重叠，密封体密封芯片和部件的第一和第二导电构件，使得第一导电构件的一部分从密封体的第一侧表面向外突出，并且第一和第二导电构件的部分从密封体的相对的第二侧表面向外突出在平面图中。

32. 发明授权

US08400777B2 Electronic member, electronic part and manufacturing method therefor 失效
标题翻译：电子部件，电子部件及其制造方法
公开(公告)号：US08400777B2
公开(公告)日：2013-03-19
申请号：US12696590
申请日：2010-01-29
申请人： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda
发明人： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda
IPC分类号： H05K7/10
CPC分类号： H05K3/32 , C25D11/34 , H01L23/3142 , H01L23/481 , H01L23/49582 , H01L23/49811 , H01L23/49833 , H01L23/49866 , H01L23/50 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L33/62 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05169 , H01L2224/05568 , H01L2224/05639 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/16145 , H01L2224/16225 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48105 , H01L2224/48177 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81009 , H01L2224/81193 , H01L2224/81201 , H01L2224/81395 , H01L2224/81486 , H01L2224/8184 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K1/185 , H05K3/244 , H05K2201/10636 , H05K2201/10674 , H05K2203/0315 , H05K2203/1157 , H05K2203/121 , Y02P70/611 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/053 , H01L2224/83205
摘要： When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer.
摘要翻译：当氧化银还原成银时，在氧化银内形成大量的金属银芯。然后，氧化银被以中空的方式被还原，同时保持原有的外部结构。结果，产生的银的曲率变大。利用这种微观粒子实施机制，即使氧化银不是颗粒状构造而是紧密堆叠的层状结构，也可实现粘结。在本发明中，提供了一种电子部件，其包括用于输入/输出电信号的电极或用于建立与电信号的连接的连接端子，其中电极或连接端子的最上表面是银 - 氧化层。

33. 发明申请

US20120104618A1 LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD 审中-公开
标题翻译：低温接合材料和粘接方法
公开(公告)号：US20120104618A1
公开(公告)日：2012-05-03
申请号：US13348072
申请日：2012-01-11
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： H01L23/488
CPC分类号： H05K3/321 , B22F1/0014 , B22F1/0062 , B22F3/14 , B22F2003/145 , B23K35/22 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/83 , H01L25/072 , H01L2224/29007 , H01L2224/29101 , H01L2224/2919 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K2201/0224 , H05K2201/0257 , H05K2201/0266 , Y10T428/12028 , Y10T428/12181 , Y10T428/2991 , Y10T428/8305 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012
摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
摘要翻译：一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分，基于体积基数具有至少峰值分布的部分。本公开还涉及使用接合材料的接合方法。

34. 发明申请

US20100270515A1 ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH THE SAME, AND SEMICONDUCTOR DEVICE BONDED WITH THE SAME 有权
标题翻译：电导电粘接材料，与其结合的方法以及与其结合的半导体器件
公开(公告)号：US20100270515A1
公开(公告)日：2010-10-28
申请号：US12768778
申请日：2010-04-28
申请人： Yuusuke YASUDA , Toshiaki Morita , Eiichi Ide , Teiichi Inada
发明人： Yuusuke YASUDA , Toshiaki Morita , Eiichi Ide , Teiichi Inada
IPC分类号： H01B1/02 , H01B1/12 , B23K20/00
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.
摘要翻译：本发明提供一种接合材料和在不施加压力的情况下在较低温度下能够具有较高接合强度的接合界面处的金属接合方法，与平均粒径不大的金属颗粒的接合材料相比超过100nm。一种导电性接合材料，其包含（A）银颗粒，（B）氧化银，和（C）包含不超过30个碳原子的有机材料作为必要组分的分散剂，其中（A）银粉末，（B）氧化银粉末，（C）含有不超过30个碳原子的有机材料的分散剂的含量为99.0〜100重量％。换句话说，不含树脂粘合剂。

35. 发明申请

US20080156398A1 BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE 有权
标题翻译：使用金属颗粒的粘合方法和粘合材料
公开(公告)号：US20080156398A1
公开(公告)日：2008-07-03
申请号：US11965973
申请日：2007-12-28
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： B23K35/34
CPC分类号： B23K35/34 , B23K35/3612 , H01L23/3107 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29294 , H01L2224/29387 , H01L2224/29393 , H01L2224/30181 , H01L2224/32175 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/48739 , H01L2224/48839 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8384 , H01L2224/83986 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0541 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/48 , H01L2224/83205
摘要： It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 μm and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.
摘要翻译：本发明的目的是提供一种能够在与使用平均粒径不大于100nm的金属颗粒的接合材料相比在较低温度下的接合界面处通过金属接合实现接合的接合材料和接合方法。提供了一种粘合材料，其包括金属颗粒前体，金属颗粒前体是选自金属氧化物颗粒，金属碳酸盐颗粒和金属羧酸盐颗粒中的至少一种，平均粒径为1 以及由有机物构成的还原剂，其中金属颗粒前体的含量相对于每100质量份的接合材料大于50质量份且不大于99质量份。

36. 发明授权

US07334348B2 Dryer apparatus for clothing knitted or woven fabric 失效
标题翻译：服装针织或机织布干燥机
公开(公告)号：US07334348B2
公开(公告)日：2008-02-26
申请号：US10569281
申请日：2004-08-24
申请人： Toshiaki Morita
发明人： Toshiaki Morita
IPC分类号： F26B13/00
CPC分类号： F26B21/024 , F26B3/283
摘要： A dryer apparatus for use with a woven and knitted fabric is constructed such that a first drying rack is disposed at an upper portion of the frame, and at least one second drying rack is disposed at a lower. Each of the drying racks is formed of a ventilated drying surface. A first drying device is disposed above the first drying rack, and a second drying device is disposed above the second rack. Each of the drying devices is formed of a drying irradiation surface for irradiating a heat ray and/or heated air, and is constructed to be movable for reciprocation along the drying surface of the drying rack by means of a driving device. The second drying device is arranged so as to be pivotable between a position in which the drying irradiation surface of the second drying device opposes an upper surface of the at least one second drying rack, and a position in which the drying irradiation surface of the second drying device opposes a lower surface of the first drying rack.
摘要翻译：一种用于织造和针织物的干燥设备被构造成使得第一干燥架设置在框架的上部，并且至少一个第二干燥架布置在下部。每个干燥架由通风干燥表面形成。第一干燥装置设置在第一干燥架上方，第二干燥装置设置在第二机架的上方。每个干燥装置由用于照射热射线和/或加热空气的干燥照射表面形成，并且被构造成可通过驱动装置沿着干燥架的干燥表面往复运动。第二干燥装置被布置成可在第二干燥装置的干燥照射表面与至少一个第二干燥架的上表面相对的位置和第二干燥装置的干燥照射表面之间的位置干燥装置与第一干燥架的下表面相对。

37. 发明授权

US07272959B2 Removable moving member for knitting and weft knitting machine provided with knitting member switching apparatus 失效
公开(公告)号：US07272959B2
公开(公告)日：2007-09-25
申请号：US10574971
申请日：2004-10-07
申请人： Toshiaki Morita , Takuya Miyai , Norio Kotaka
发明人： Toshiaki Morita , Takuya Miyai , Norio Kotaka
IPC分类号： D04B15/38
CPC分类号： D04B15/56 , D04B7/26 , D04B7/34 , D04B15/90
摘要： In order to switching yarns used for knitting by switching a plurality of yarn feeders, a knitting member switching apparatus is provided. The knitting member switching apparatus includes a plurality of holders provided on a side of a carriage, a stopping device provided on an end portion such as a left side end on a needle bed. The stopping device includes a plurality of stopping stands and switching mechanisms in correspondence with the holders, and is further provided with a control device for letting the carriages travel and for selecting knitting needles based on knitting data.

38. 发明申请

US20070169597A1 Method and apparatus for adjusting suction of cutting machine 审中-公开
标题翻译：调整切割机吸力的方法和装置
公开(公告)号：US20070169597A1
公开(公告)日：2007-07-26
申请号：US10587833
申请日：2005-01-26
申请人： Toshiaki Morita
发明人： Toshiaki Morita
IPC分类号： B26D1/00 , B26D7/06 , B26D5/00
CPC分类号： B26D7/018 , B26D5/00 , B26D5/005 , B26F1/3813 , Y10T83/04 , Y10T83/148 , Y10T83/207
摘要： It is an object of the invention is to provide a method and a apparatus for adjusting suction of a cutting machine capable of cutting even an elastic sheet material in an appropriate compression state by suppressing fluctuation in the degree of compression of the sheet material. A set value of a suction pressure is set such that an absolute value of the suction pressure, which is a negative pressure lower than the atmospheric pressure, becomes larger as a numerical value thereof becomes larger. For one-piece cutting as shown in FIG. 1B, the set value of the suction pressure is increased since the cutting distance of an already-cut portion is increased as cutting progresses. For stacked cutting as shown in FIG. 1A, though the set value of the suction pressure is increased before parts (1a, 1b, 1c, 1d, 1e, 1f) are cut, when the cutting is moved from the part (1f) to a part (1g), the cutting distance of the already-cut portion where air leaks is reduced since the parts (1a, 1b, 1c) are covered by a sealing sheet, and the set value of the suction pressure is lowered.
摘要翻译：发明内容本发明的目的在于提供一种能够通过抑制片材的压缩程度的波动来调整适当的压缩状态的能够切割弹性片材的切割机的吸引的方法和装置。吸入压力的设定值被设定为使得作为低于大气压的负压的吸入压力的绝对值随着其数值变大而变大。对于如图1所示的一体式切割如图1B所示，随着切割进行，已经切割部分的切割距离增加，吸入压力的设定值增加。对于如图1所示的堆叠切割如图1A所示，尽管在部分（1a，1b，1c，1d，1e，1f）被切割之前吸入压力的设定值增加，但是当切割从部分（1f）移动到部分（1g），由于部分（1a，1b，1c）被密封片覆盖，空气泄漏的已切割部分的切割距离减小，并且吸入压力的设定值为降低

39. 发明申请

US20070051139A1 Removable moving member for knitting and weft knitting machine provided with knitting member switching apparatus 失效
标题翻译：具有针织组件切换装置的针织和纬编机用移动构件
公开(公告)号：US20070051139A1
公开(公告)日：2007-03-08
申请号：US10574971
申请日：2004-10-07
申请人： Toshiaki Morita , Takuya Miyai , Norio Kotaka
发明人： Toshiaki Morita , Takuya Miyai , Norio Kotaka
IPC分类号： D04B15/00
CPC分类号： D04B15/56 , D04B7/26 , D04B7/34 , D04B15/90
摘要： In order to switching yarns used for knitting by switching a plurality of yarn feeders, a knitting member switching apparatus is provided. The knitting member switching apparatus includes a plurality of holders provided on a side of a carriage, a stopping device provided on an end portion such as a left side end on a needle bed. The stopping device includes a plurality of stopping stands and switching mechanisms in correspondence with the holders, and is further provided with a control device for letting the carriages travel and for selecting knitting needles based on knitting data.
摘要翻译：为了通过切换多个喂纱机来切换用于编织的纱线，提供了一种编织部件切换装置。针织组件切换装置包括设置在滑架侧面的多个保持器，设置在诸如针床上的左侧端部的端部上的止动装置。该止动装置包括与支架对应的多个停止支架和切换机构，并且还具有用于使托架行进的控制装置和基于编织数据选择织针的控制装置。

40. 发明授权

US07152435B2 Weft knitting machine having movable sinker 有权
标题翻译：具有可移动沉降片的纬编机
公开(公告)号：US07152435B2
公开(公告)日：2006-12-26
申请号：US10566251
申请日：2004-07-28
申请人： Minoru Sonomura , Masaki Miyamoto , Toshiaki Morita
发明人： Minoru Sonomura , Masaki Miyamoto , Toshiaki Morita
IPC分类号： D04B15/06
CPC分类号： D04B15/96 , D04B15/06 , D04B15/10 , D04B15/68 , D04B15/90
摘要： A weft knitting machine having a movable sinker capable of securing a large space at a needle bed near a knitting fabric knitting area and making a pause in the state of stopping action on the knitting fabric knitting area. A sinker operating cam mechanism (10) installed in a carriage acts on the butt (12c) of a sinker jack (12) to move the sinker jack (12) backward from a mouth part (2) so that the acting part (8c) of the movable sinker (8) can retract from the mouth part (2). The sinker jack (12) is locked to a moved back position by a locking mechanism (16). Since a wire (17) passed through a needle plate (5) is utilized to lock the sinker jack (12) in the locking mechanism (16), the locking mechanism (16) can be reduced in size. To lock the sinker jack (12) to the wire (17), the sinker jack (12) comprises a projection (12f).
摘要翻译：一种具有可移动沉降片的纬编机，其能够在针织物编织区域附近的针床处获得大的空间，并且使针织织物编织区域的停止动作停止。安装在滑架中的沉降片操作凸轮机构（10）作用在沉降片插座（12）的对接部分（12c）上，以使沉降片插座（12）从口部（2）向后移动，使得作用部分 c）可从嘴部（2）缩回。沉降片千斤顶（12）通过锁定机构（16）锁定在后移位置。由于使用穿过针板（5）的线（17）将沉降片插座（12）锁定在锁定机构（16）中，所以可以减小锁定机构（16）的尺寸。为了将沉降片插座（12）锁定到线（17），沉降片插孔（12）包括突起（12f）。

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