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31. 发明专利

DE2935314A1 未知
公开(公告)号：DE2935314A1
公开(公告)日：1980-10-16
申请号：DE2935314
申请日：1979-08-31
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , KURODA HITOSHI , SHIMIZU NOBUYOSHI , INUI TSUNEO
IPC分类号： B65D8/04 , C25D3/04 , C25D11/38 , C22C38/00 , C23F7/04 , C25D5/12 , C25D9/04 , C25D9/10

32. 发明专利

DE69938456T2 未知
公开(公告)号：DE69938456T2
公开(公告)日：2009-04-09
申请号：DE69938456
申请日：1999-07-22
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OHSAWA SHINJI
IPC分类号： H05K3/46 , H05K3/06 , H05K3/20 , H05K3/44
摘要： In the present invention, which produces a clad sheet for a multilayered printed circuit board capable of being economically manufactured and having excellent performance, a multilayered printed circuit board using thereof and a manufacturing method thereof, a multilayered printed circuit board is manufactured by forming clad sheet for a multilayered printed circuit board 34 by laminating copper foil 19, 24, 33 which are to be formed into conductor layer 10, 17, 18 and nickel plating 20, 21 which are to be etching-stopper layer and simultaneously press-bonding both, producing a base by selectively etching clad sheet for a multilayered printed circuit board 34, forming outer conductor layer 15, 16 on the surface of the base and simultaneously making patterning, and electrically connecting among conductor layer 10, 15, 16 by interposing columnar conductor 17, 18 formed by etching copper foil 19, 24, 33 and nickel plating 20, 21.

33. 发明专利

DE69938456D1 未知
公开(公告)号：DE69938456D1
公开(公告)日：2008-05-15
申请号：DE69938456
申请日：1999-07-22
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OHSAWA SHINJI
IPC分类号： H05K3/46 , H05K3/06 , H05K3/20 , H05K3/44
摘要： In the present invention, which produces a clad sheet for a multilayered printed circuit board capable of being economically manufactured and having excellent performance, a multilayered printed circuit board using thereof and a manufacturing method thereof, a multilayered printed circuit board is manufactured by forming clad sheet for a multilayered printed circuit board 34 by laminating copper foil 19, 24, 33 which are to be formed into conductor layer 10, 17, 18 and nickel plating 20, 21 which are to be etching-stopper layer and simultaneously press-bonding both, producing a base by selectively etching clad sheet for a multilayered printed circuit board 34, forming outer conductor layer 15, 16 on the surface of the base and simultaneously making patterning, and electrically connecting among conductor layer 10, 15, 16 by interposing columnar conductor 17, 18 formed by etching copper foil 19, 24, 33 and nickel plating 20, 21.

34. 发明专利

DE60120454T2 未知
公开(公告)号：DE60120454T2
公开(公告)日：2006-12-07
申请号：DE60120454
申请日：2001-10-04
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OKAMOTO HIROAKI , OHSAWA SHINJI
IPC分类号： B32B15/08 , B32B37/20 , H05K3/00 , H05K3/02 , H05K3/38
摘要： A film which has a multilayered metal and is obtained by bonding a polymer film having a thin metal layer formed on a surface thereof to a metal foil having a given thickness without using an adhesive. It has a given thickness and is adhesive-free. The film having a multilayered metal is obtained by preparing a polymer film having a thin metal layer superposed on a surface thereof, activating both the surface of the thin metal layer and a surface of a metal foil, and press-bonding the activated thin-metal layer surface to the activated metal foil surface.

35. 发明专利

DE69734444D1 未知
公开(公告)号：DE69734444D1
公开(公告)日：2005-12-01
申请号：DE69734444
申请日：1997-02-14
申请人： TOYO KOHAN CO LTD , FUKUDA METAL FOIL POWDER
发明人： TAKADA AKIYOSHI , TAKAGI AKIRA , SAIJO KINJI , YOSHIDA KAZUO , YOSHIMOTO NOBUYUKI , ISOBE YOSHIHIKO
IPC分类号： H01M2/10 , H01M2/12
摘要： A safety valve element for battery use which ruptures at a stable pressure range so as to release the inner pressure of the battery is disclosed. The safety valve element for battery use comprises a metal substrate which is provided with a perforated opening and a metal foil laminated on the metal substrate so as to close the perforated opening. A battery which is provided with such a safety valve is also disclosed. A battery case provided with such a safety valve is also disclosed. The battery and the battery case lid is produced by forming the perforated opening in the metal substrate, pressure welding the metal foil to the metal substrate and molding the clad material into a form of the battery case lid.

36. 发明专利

CA2246571C CLADDING MATERIAL CLADDING MATERIAL 未知
公开(公告)号：CA2246571C
公开(公告)日：2004-03-16
申请号：CA2246571
申请日：1997-02-14
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , YOSHIMOTO NOBUYUKI , ISOBE YOSHIHIKO
IPC分类号： B23K20/04 , H01M2/12
摘要： Clad material comprises a metal substrate which is provided with a multiplicity of perforated openings therein and a metal foil which is laminated on the metal substrate to close the perforated openings. To produce such a clad material, at least one surface of the metal substrate and corresponding one surface of the metal foil are respectively subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surfaces face each other. Alternately, only one surface of the metal substrate is subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surface of the metal substrate defines a laminating surface. It may be possible to provide a nickel plating on the metal substrate or the metal foil. The clad material can be effectively used for producing safety valve chips which rupture accurately at low pressures which fall in a stable pressure range on a mass production basis.

38. 发明专利

AU4279301A Semiconductor device and fabrication method therefor 未知
公开(公告)号：AU4279301A
公开(公告)日：2001-10-30
申请号：AU4279301
申请日：2001-03-27
申请人： TOYO KOHAN CO LTD , TADATOMO SUGA
发明人： SUGA TADATOMO , SAIJO KINJI , OHSAWA SHINJI , OKAMOTO HIROAKI , YOSHIDA KAZUO
IPC分类号： H01L23/52 , H01L21/283 , H01L21/288 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/31 , H01L23/485 , H01L21/3213
摘要： A method of efficiently and inexpensively fabricating a chip-size package having an electrode pitch expanded by forming a conductor wiring on the electrode forming surface side of a semiconductor chip, especially, a method for facilitating wiring and bump forming. A semiconductor device comprising a semi-conductor elements and conductor wirings formed on the semiconductor elements by etching wiring-forming metal foil; and a fabrication method for a semiconductor device comprising the steps of laminating wiring forming metal foil on the electrode forming surface side on the semiconductor, forming a resist wiring pattern on the metal foil, etching the metal foil, and slicing the device into individual elements.

39. 发明专利

AU5566900A Resin seal package and terminal forming board 未知
公开(公告)号：AU5566900A
公开(公告)日：2001-01-09
申请号：AU5566900
申请日：2000-06-21
申请人： TOYO KOHAN CO LTD , NOGE ELECTRIC IND CO LTD
发明人： UMEDA YASUSHI , SAIJO KINJI , OHSAWA SHINJI
IPC分类号： H01L21/48 , H01L23/31 , H01L23/12
摘要： A resin seal package (60) which comprises a metal film (15), and a sealing resin (10) cured as it is left contacted with the metal film (15), wherein the package terminal shape is such that the metal film (15) formed on the terminal surface will not come off the sealing resin (10). Further, a package is in the form of a terminal forming board (30) having a metal film (15) transferred onto the sealing resin (10), characterized in that the forming board is a multi-layer metal board (50) composed of two metal layers. Further, this package is such that the multi-layer metal board (50) is formed of layers different in the degree to which they are corroded by acid or alkali etching. And at least one layer of the terminal forming board (30) is etched more progressively in the transverse direction than the other layers and the sealing resin (10) filled in holes is so formed as to act as an anchor on the more progressively etched portion.

40. 发明专利

AU5249400A Mounting material, mounting circuit using it and printed wiring board using it 未知
公开(公告)号：AU5249400A
公开(公告)日：2001-01-02
申请号：AU5249400
申请日：2000-06-16
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OKAMOTO HIROAKI , OHSAWA SHINJI
IPC分类号： H01L23/498 , H05K3/06 , H05K3/20 , H05K3/28 , H05K3/34 , H01L21/60 , H01L23/12 , H05K3/24

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