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    • 38. 发明授权
    • Article comprising a Pb-free solder having improved mechanical properties
    • 制品包括具有改善的机械性能的无铅焊料
    • US5762866A
    • 1998-06-09
    • US502941
    • 1995-07-17
    • Sungho JinMark Thomas McCormack
    • Sungho JinMark Thomas McCormack
    • B23K35/26C22C13/00C22C13/02
    • C22C13/00B23K35/262
    • A high-strength Pb-free solder alloy, based on the Sn--Ag--Zn system, is disclosed. The Pb-free solder alloy contains, in weight percent, 0.2-0.6% Zn, 1-6% Ag, one or both 0.2-0.6% In and 0.2-0.6% Bi, and the balance Sn. The addition of Zn significantly improves the mechanical strength and creep resistance of e.g., Sn--3.5% Ag eutectic solder while maintaining substantially the same level of ductility. The increase in strength is as much as 48% over that of the Sn--3.5% Ag alloy. This strengthening from the Zn additions is attributed to a uniform solidification structure and a substantial refinement of the precipitates in the alloy. Essentially all of the added Zn resides in the more corrosion-resistant, Ag-based, intermetallic precipitates, leaving the Sn-rich matrix primarily free of Zn in solid solution.
    • 公开了一种基于Sn-Ag-Zn系统的高强度无铅焊料合金。 无铅焊料合金以重量百分比含有0.2-0.6%的Zn,1-6%的Ag,一种或两种为0.2-0.6%的In和0.2-0.6%的Bi,余量为Sn。 Zn的添加显着提高例如Sn-3.5%Ag共晶焊料的机械强度和抗蠕变性,同时保持基本上相同的延展性水平。 强度比Sn-3.5%Ag合金高出48%。 Zn添加物的这种强化归因于合金中的均匀凝固结构和沉淀物的显着改进。 基本上所有添加的Zn都位于更耐腐蚀的Ag基金属间析出物中,使富含Sn的基体在固溶体中基本上不含Zn。
    • 39. 发明授权
    • Method and apparatus for chemical-mechanical polishing of diamond
    • 钻石化学机械抛光的方法和装置
    • US5746931A
    • 1998-05-05
    • US760845
    • 1996-12-05
    • John Edwin GraebnerSungho JinWei Zhu
    • John Edwin GraebnerSungho JinWei Zhu
    • B24B37/04H01L21/00
    • B24B37/04
    • This application describes a new method for rapid thinning, planarizing and fine polishing surfaces of diamond to the submicron/nanometer level so that large area, uniform thickness diamond wafers can be obtained. The method combines both chemical (dissolution of carbon in molten metals) and mechanical (rotating or moving sample fixtures in contact with the dissolving metals) polishing to achieve flat, smooth surface finishes in a relatively short period of time, thus improving the quality and economics of the overall polishing process. Several embodiments of apparatus for performing such chemical-mechanical polishing (CMP) of diamond are described.
    • 该应用描述了一种用于将金刚石的表面快速稀释,平面化和精细抛光到亚微米/纳米级的新方法,从而可以获得大面积均匀厚度的金刚石晶片。 该方法结合了化学(溶解在金属中的碳)和机械(与溶解金属接触的旋转或移动的样品夹具)抛光,以在相对较短的时间内实现平坦,光滑的表面光洁度,从而提高了质量和经济性 的整体抛光过程。 描述了用于进行金刚石的这种化学机械抛光(CMP)的设备的几个实施例。