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    • 33. 发明授权
    • High-frequency induction heating coil
    • 高频感应加热线圈
    • US5550354A
    • 1996-08-27
    • US456102
    • 1995-05-30
    • Masanori KimuraHirotoshi Yamagishi
    • Masanori KimuraHirotoshi Yamagishi
    • C30B13/20H05B6/30H05B6/36H05B6/40
    • H05B6/362H05B6/30
    • A high-frequency induction heating coil is provided which enables a semiconductor single crystal in the process of growth to incorporate impurities uniformly therein, permits ready adjustment of the heat distributing property, and precludes the discharge of electricity across a slit. The high-frequency induction heating coil comprises a pair of annular conductors 21 and 22, a pair of power source terminals 23a and 23b for feeding a high-frequency electric current to the pair of annular conductors 21 and 22, and a plurality of small coils 24a through 24f and 25a through 25f having the pair of annular conductors as opposite electrodes and projecting toward the axis of the pair of annular conductors extending from a first annular conductor 21 to a second annular conductor 22.
    • 提供了一种高频感应加热线圈,其使得在生长过程中的半导体单晶能够均匀地掺入杂质,从而允许准备好调节热分布特性,并且排除跨越狭缝的电力放电。 高频感应加热线圈包括一对环形导体21和22,一对用于将高频电流馈送到一对环形导体21和22的电源端子23a和23b,以及多个小线圈 24a至24f和25a至25f,其具有作为相对电极的一对环形导体,并且朝向从第一环形导体21延伸到第二环形导体22的一对环形导体的轴线突出。