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31. 发明申请

US20080246160A1 STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING THE SAME 有权
标题翻译：包括其的标准单元和半导体器件
公开(公告)号：US20080246160A1
公开(公告)日：2008-10-09
申请号：US12098035
申请日：2008-04-04
申请人： Ritsuko Ozoe , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
发明人： Ritsuko Ozoe , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
IPC分类号： H01L23/52
CPC分类号： H01L27/11807 , H01L27/0207
摘要： This invention prevents a break in a signal wire disposed between wire ends due to attenuation and improves production yields of devices. In a standard cell, a first signal wire extends in a first direction. Second and third signal wires extend in a second direction substantially perpendicular to the first direction and are facing each other across the first signal wire. The second and third signal wires have the widths larger than the width of the first signal wire.
摘要翻译：本发明防止由于衰减引起的布线在线端之间的信号线断裂，并且提高了器件的产量。在标准单元中，第一信号线在第一方向上延伸。第二和第三信号线在基本上垂直于第一方向的第二方向上延伸并且跨越第一信号线彼此面对。第二和第三信号线的宽度大于第一信号线的宽度。

32. 发明授权

US06895728B2 Film packaging method and film packaging device 有权
标题翻译：薄膜包装方法和薄膜包装装置
公开(公告)号：US06895728B2
公开(公告)日：2005-05-24
申请号：US10419748
申请日：2003-04-22
申请人： Hideaki Kondo
发明人： Hideaki Kondo
IPC分类号： B65B11/20 , B65B11/54 , B65B53/00
CPC分类号： B65B11/54
摘要： The purpose of this invention is to provide a packaging method and a packaging device in which a loading work and an unloading work for a packaged item performed by an operator can be reduced, a longitudinal length of the device can be made short and it can be manufactured in less-expensive manner. There is provided a packaging method for packaging a packaged item with a use of stretch film comprising the steps of: mounting the packaged item on a mounting table placed at a predetermined position; positioning an upper end of the packaged item below a position lower than a packaging segment for tensioning and holding the film used for a packaging operation after the packaged item is mounted on the mounting table; tensioning and holding the film on the packaging segment; moving the tensioned and held film and the mounting table having the packaged item mounted thereon in a relative manner and packaging the upper surface of the packaged item with the film; and folding the end part of the film packaging the upper surface of the packaged item below the packaged item.
摘要翻译：本发明的目的是提供一种包装方法和包装装置，其中可以减少由操作者执行的包装物的装载作业和卸载作业，可以缩短装置的纵向长度，并且可以以较便宜的方式制造。提供了一种用于使用拉伸膜包装包装物品的包装方法，包括以下步骤：将包装的物品安装在放置在预定位置的安装台上; 将包装物品的上端定位在低于包装部分的位置下方，用于在将包装物品安装在安装台上之后张紧和保持用于包装操作的膜; 在包装部分张紧和保持胶片; 以相对的方式移动张紧保持膜和安装有安装在其上的包装物品的安装台，并将包装物品的上表面与膜包装; 并将薄膜的端部折叠包装在包装物品下方的包装物品的上表面。

33. 发明授权

US09343340B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US09343340B2
公开(公告)日：2016-05-17
申请号：US13021827
申请日：2011-02-07
申请人： Keita Nogi , Hideaki Kondo , Susumu Tauchi , Teruo Nakata
发明人： Keita Nogi , Hideaki Kondo , Susumu Tauchi , Teruo Nakata
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67201 , H01L21/67745
摘要： A vacuum processing apparatus is disclosed for processing workpieces. The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum. Vacuum transport chambers are connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated. The workpiece can be transferred between each of the process chambers and the load lock via the corresponding vacuum transport chamber. The apparatus also includes load lock valves for switching between interrupt and opening between the load lock and the corresponding vacuum transport chambers, and process chamber valves for switching between interrupt and opening between the process chambers and the corresponding vacuum transport chambers. Timing for opening and closing the valves is controlled in synchronization with the transfer of the workpieces.
摘要翻译：公开了一种用于处理工件的真空处理装置。该装置包括适于将工件存储在大气和真空之间并在大气和真空之间切换的负载锁定。在负载锁定和每个处理室被隔离的状态下，真空输送室连接到负载锁和相应的处理室。工件可以通过相应的真空输送室在每个处理室和装载锁之间传送。该装置还包括用于在负载锁和相应的真空输送室之间的中断和开启之间切换的负载锁定阀，以及用于在处理室和相应的真空输送室之间的中断和打开之间切换的处理室阀。用于打开和关闭阀门的时间与工件的传送同步地控制。

34. 发明授权

US08969480B2 Polymer alloy and rubber product, and production method thereof 有权
标题翻译：聚合物合金和橡胶制品及其制备方法
公开(公告)号：US08969480B2
公开(公告)日：2015-03-03
申请号：US13984563
申请日：2011-11-21
申请人： Naoki Iwase , Hideyuki Imai , Akishige Seo , Hideaki Kondo , Yusuke Katono
发明人： Naoki Iwase , Hideyuki Imai , Akishige Seo , Hideaki Kondo , Yusuke Katono
IPC分类号： C08L15/00 , C08L21/00 , C08L19/00 , C08C19/22 , C08L23/16 , C08L9/02
CPC分类号： C08L19/006 , C08C19/22 , C08L9/02 , C08L15/00 , C08L23/16 , C08L33/04 , C08L33/08
摘要： To provide a polymer alloy formed of a non-polar rubber and a polar rubber, and a rubber product, which are improved in ozone resistance (weather resistance) while having oil resistance and can achieve high mechanical strength (in particular, tensile strength), and a production method thereof.A rubber product in which an organic peroxide or other cross-linking agent is used to cross-link a polymer alloy comprising: a modified rubber in which EPDM, NR, or another non-polar rubber having a non-conjugated double bond is modified with 2-methoxy-1-naphthonitrile oxide, 2,6-dimethoxybenzonitrile oxide, or another nitrile oxide of an aromatic nitrile oxide derivative; and nitrile rubber, acrylic rubber, or another polar rubber.
摘要翻译：为了提供具有耐油性且能够获得高机械强度（特别是拉伸强度）的耐臭氧性（耐候性）改善的由非极性橡胶和极性橡胶形成的聚合物合金和橡胶制品，及其制造方法。一种橡胶制品，其中使用有机过氧化物或其它交联剂来交联聚合物合金，其包括：改性橡胶，其中EPDM，NR或另一种具有非共轭双键的非极性橡胶用 2-甲氧基-1-萘甲腈氧化物，2,6-二甲氧基苄腈氧化物或芳香族氧化腈衍生物的另一种腈氧化物; 丁腈橡胶，丙烯酸橡胶或其他极性橡胶。

35. 发明授权

US08143724B2 Standard cell and semiconductor device including the same 有权
标题翻译：包括其的标准单元和半导体器件
公开(公告)号：US08143724B2
公开(公告)日：2012-03-27
申请号：US13211130
申请日：2011-08-16
申请人： Ritsuko Ozoe , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
发明人： Ritsuko Ozoe , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
IPC分类号： H01L23/52
CPC分类号： H01L27/11807 , H01L27/0207
摘要： This invention prevents a break in a signal wire disposed between wire ends due to attenuation and improves production yields of devices. In a standard cell, a first signal wire extends in a first direction. Second and third signal wires extend in a second direction substantially perpendicular to the first direction and are facing each other across the first signal wire. The second and third signal wires have the widths larger than the width of the first signal wire.
摘要翻译：本发明防止由于衰减引起的布线在线端之间的信号线断裂，并且提高了器件的产量。在标准单元中，第一信号线在第一方向上延伸。第二和第三信号线在基本上垂直于第一方向的第二方向上延伸并且跨越第一信号线彼此面对。第二和第三信号线的宽度大于第一信号线的宽度。

36. 发明申请

US20120027542A1 Vacuum processor 审中-公开
标题翻译：真空处理器
公开(公告)号：US20120027542A1
公开(公告)日：2012-02-02
申请号：US12805837
申请日：2010-08-20
申请人： Ryoichi Isomura , Susumu Tauchi , Hideaki Kondo
发明人： Ryoichi Isomura , Susumu Tauchi , Hideaki Kondo
IPC分类号： H01L21/677 , H01L21/673
CPC分类号： H01L21/67742
摘要： A vacuum processor includes a first transfer vessel that is connected on the back of a lock chamber connected on the back of an atmospheric transfer vessel and has a first robot; a second transfer vessel that is arranged at the back of this first transfer vessel, connected to the first transfer vessel, and has a second robot; a repeating vessel that connects the transfer vessels, and has a storage section in which the wafer is transferred between the robots; and a processing vessel that is connected, on an almost perpendicular side, to the repeating vessel around the second transfer vessel and in which the wafer is processed at a processing chamber, wherein the first robot has two arms that are expanded and contracted to both directions across a pivot axis, and the second robot has two arms that are expanded and contracted to the same direction around the pivot axis.
摘要翻译：真空处理器包括第一转移容器，其连接在连接在大气转移容器背面的锁定室的后部，并具有第一机器人; 第二转移容器，其布置在该第一转移容器的背面，连接到第一转移容器，并具有第二机器人; 连接转移容器的重复容器，并且具有其中晶片在机器人之间转移的存储部分; 以及处理容器，其在几乎垂直的一侧上连接到围绕第二转移容器的重复容器，并且其中晶片在处理室处理，其中第一机器人具有两个臂，两个臂被扩展和收缩到两个方向跨越枢转轴线，并且第二机器人具有两个臂，其围绕枢转轴线以相同的方向膨胀和收缩。

37. 发明申请

US20110318143A1 VACUUM PROCESSING APPARATUS 审中-公开
标题翻译：真空加工设备
公开(公告)号：US20110318143A1
公开(公告)日：2011-12-29
申请号：US12854255
申请日：2010-08-11
申请人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
发明人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67161
摘要： A vacuum processing apparatus includes a first lock chamber and a second lock chamber coupled to a back face side of the atmospheric transfer chamber in parallel, a first transfer chamber coupled to a rear side of the first lock chamber, a second transfer chamber coupled, on the rear side of the first transfer chamber, a third transfer chamber coupled to the rear side of the second lock chamber, a first and a second relay chamber disposed between the first transfer chamber/the second transfer chamber and the first transfer chamber/the third transfer chamber to transfer a wafer between these chambers, and a plurality of processing chambers coupled to either the first, the second or the third transfer chamber, in addition, the number of the processing chambers coupled to the second transfer chamber is greater than that of the processing chambers coupled to either the first or the third transfer chamber, and the wafer alone processed in the processing chamber coupled to either the first or the second transfer chamber is transferred to the third robot in the second relay chamber.
摘要翻译：真空处理装置包括并联连接到大气传送室的背面侧的第一锁定室和第二锁定室，耦合到第一锁定室的后侧的第一传送室，耦合到第二锁定室第一传送室的后侧，耦合到第二锁定室的后侧的第三传送室，设置在第一传送室/第二传送室和第一传送室/第三传送室之间的第一和第二中继室传送室以在这些室之间传送晶片，以及耦合到第一，第二或第三传送室的多个处理室，另外，耦合到第二传送室的处理室的数量大于耦合到第一或第三传送室的处理室，以及在处理室中单独处理的晶片，其耦合到第一或第二传输室第二传送室被传送到第二中继室中的第三机器人。

38. 发明申请

US20110298138A1 STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING THE SAME 有权
公开(公告)号：US20110298138A1
公开(公告)日：2011-12-08
申请号：US13211130
申请日：2011-08-16
申请人： Ritsuko OZOE , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
发明人： Ritsuko OZOE , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
IPC分类号： H01L23/52
CPC分类号： H01L27/11807 , H01L27/0207
摘要： This invention prevents a break in a signal wire disposed between wire ends due to attenuation and improves production yields of devices. In a standard cell, a first signal wire extends in a first direction. Second and third signal wires extend in a second direction substantially perpendicular to the first direction and are facing each other across the first signal wire. The second and third signal wires have the widths larger than the width of the first signal wire.

39. 发明申请

US20110110752A1 VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE 审中-公开
标题翻译：真空加工系统和半导体加工基板的真空加工方法
公开(公告)号：US20110110752A1
公开(公告)日：2011-05-12
申请号：US12883602
申请日：2010-09-16
申请人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67766 , H01L21/67778
摘要： The invention provides a vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same, comprising an atmospheric transfer chamber having a plurality of cassette stands, a lock chamber arranged on a rear side of the atmospheric transfer chamber, and a first vacuum transfer chamber connected to a rear side of the lock chamber, wherein the first vacuum transfer chamber does not have any vacuum processing chamber connected thereto and has transfer intermediate chambers connected thereto, and the transfer intermediate chambers have subsequent vacuum transfer chambers connected thereto, and wherein the wafers are transferred via the lock chamber to the first vacuum transfer chamber to be processed in each of the subsequent vacuum processing chambers, which are further transferred via any of the transfer intermediate chambers connected to the first vacuum transfer chamber to the subsequent vacuum transfer chambers, and the respective wafers transferred to the subsequent vacuum transfer chambers other than the first vacuum transfer chamber are transferred to the respective vacuum processing chambers connected to each of the vacuum processing chambers and processed therein.
摘要翻译：本发明提供了一种半导体处理基板的真空处理系统和使用该真空处理方法的真空处理方法，包括具有多个盒架的大气传送室，布置在大气传送室后侧的锁定室，以及第一真空传送室连接到锁定室的后侧，其中第一真空传送室不具有连接到其上的任何真空处理室，并且具有连接到其上的传送中间室，并且传送中间室具有连接到其上的随后的真空传送室，其中所述晶片经由所述锁定室传送到所述第一真空传送室，以在随后的每个真空处理室中被处理，所述真空处理室进一步通过连接到所述第一真空传送室的任何转移中间室转移到随后的真空转印室和相应的晶片tr 推送到除了第一真空转移室之后的后续真空转移室被转移到连接到每个真空处理室的各个真空处理室中并在其中处理。

40. 发明授权

US07859023B2 Standard cell and semiconductor device including the same 有权
标题翻译：包括其的标准单元和半导体器件
公开(公告)号：US07859023B2
公开(公告)日：2010-12-28
申请号：US12098035
申请日：2008-04-04
申请人： Ritsuko Ozoe , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
发明人： Ritsuko Ozoe , Hiroki Taniguchi , Hidetoshi Nishimura , Masaki Tamaru , Hideaki Kondo
IPC分类号： H01L27/10
CPC分类号： H01L27/11807 , H01L27/0207
摘要： This invention prevents a break in a signal wire disposed between wire ends due to attenuation and improves production yields of devices. In a standard cell, a first signal wire extends in a first direction. Second and third signal wires extend in a second direction substantially perpendicular to the first direction and are facing each other across the first signal wire. The second and third signal wires have the widths larger than the width of the first signal wire.
摘要翻译：本发明防止由于衰减引起的布线在线端之间的信号线断裂，并且提高了器件的产量。在标准单元中，第一信号线在第一方向上延伸。第二和第三信号线在基本上垂直于第一方向的第二方向上延伸并且跨越第一信号线彼此面对。第二和第三信号线的宽度大于第一信号线的宽度。

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