专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US07955982B2 Method for smoothing wafer surface and apparatus used therefor 有权
标题翻译：晶圆表面平滑的方法及其使用的装置
公开(公告)号：US07955982B2
公开(公告)日：2011-06-07
申请号：US12161070
申请日：2007-01-17
申请人： Takeo Katoh , Tomohiro Hashii , Katsuhiko Murayama , Sakae Koyata , Kazushige Takaishi
发明人： Takeo Katoh , Tomohiro Hashii , Katsuhiko Murayama , Sakae Koyata , Kazushige Takaishi
IPC分类号： H01L21/311
CPC分类号： H01L21/30604 , H01L21/02019 , H01L21/6708
摘要： Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.
摘要翻译：公开了一种通过切割半导体晶锭获得的晶片的至少一侧的表面的平滑化方法。在该方法中，根据晶片表面的突起施加流体，从而减少突起。或者，将流体施加在晶片表面上，从而使晶片的整个表面平滑，同时减少晶片表面中的突起。

32. 发明授权

US07938303B2 Gas combustion-type driving tool 有权
标题翻译：气体燃烧型驱动工具
公开(公告)号：US07938303B2
公开(公告)日：2011-05-10
申请号：US12440384
申请日：2007-09-13
申请人： Junichi Tamura , Katsuhiko Murayama , Masakazu Konishi
发明人： Junichi Tamura , Katsuhiko Murayama , Masakazu Konishi
IPC分类号： B25C1/08
CPC分类号： B25C1/08 , B25C1/008 , B25C5/1627
摘要： In a feed piston and cylinder mechanism for feeding a feed claw that engages with and disengages from connected nails accommodated within a magazine to a nose portion, the feed claw is biased in a feeding direction by a bias member and is retracted in a backward direction by high-pressure combustion gas. A valve is provided in a path which guides the high-pressure combustion gas to the feed piston and cylinder mechanism and communicates the path with the atmosphere. The feed piston and cylinder mechanism is controlled by opening/closing the valve.
摘要翻译：在馈送活塞和气缸机构中，用于馈送与容纳在盒体内的连接的钉子啮合并与其分离的馈送爪到鼻部，馈送爪通过偏置构件在馈送方向上被偏置，并且通过高压燃气。在将高压燃烧气体引导到进料活塞和气缸机构并将通道与大气连通的路径中设置有阀。进料活塞和气缸机构通过打开/关闭阀门来控制。

33. 发明授权

US07762443B2 Gas combustion type driving tool 有权
标题翻译：气体燃烧式驱动工具
公开(公告)号：US07762443B2
公开(公告)日：2010-07-27
申请号：US12063377
申请日：2006-08-07
申请人： Junichi Tamura , Katsuhiko Murayama
发明人： Junichi Tamura , Katsuhiko Murayama
IPC分类号： B25C1/08
CPC分类号： B25C1/08 , B25C5/1627
摘要： When gas is explosively burnt within a combustion chamber, a striking piston is impulsively driven to drive out a fastener from a nose portion. A gas tube is provided between the combustion chamber and a feed cylinder which accommodates a feed piston that reciprocally moves a feed claw engaged with and disengaged from connected fasteners to a nail feed direction for feeding to the nose portion side and an evacuation direction in opposite thereto. A check valve having a restriction hole is disposed on the way of the gas tube so as to be opened and closed. The check valve is normally urged by a spring to a closed direction and opens against the force of the spring by the gas pressure from the combustion chamber.
摘要翻译：当气体在燃烧室内爆炸性燃烧时，冲击活塞被冲动驱动以从鼻部驱出紧固件。在燃烧室和进料缸之间设置一个气体管，该进料圆筒容纳一个进料活塞，该进料活塞使一个与连接的紧固件接合和脱离啮合的进给爪往另一个进给方向移动，以进给到前端部分侧和与其相反的排气方向。具有限制孔的止回阀设置在气管的通路上以便打开和关闭。止回阀通常由弹簧向闭合方向推动，并通过来自燃烧室的气体压力抵抗弹簧的力而打开。

34. 发明申请

US20090224022A1 GAS COMBUSTION TYPE DRIVING TOOL 有权
标题翻译：气体燃烧式驱动工具
公开(公告)号：US20090224022A1
公开(公告)日：2009-09-10
申请号：US12063084
申请日：2006-08-07
申请人： Junichi Tamura , Katsuhiko Murayama
发明人： Junichi Tamura , Katsuhiko Murayama
IPC分类号： B25C1/14
CPC分类号： B25C1/08
摘要： When a movable sleeve 11 on a cylinder moves upward, a combustion chamber 5 in a sealed state is formed. Mixed gas is explosively burnt within the combustion chamber 5 so as to drive a fastener out. A lock cylinder 22 is disposed beneath the movable sleeve 11. A lock piston 23 is housed within the lock cylinder 22 so as to be movable in an up/down direction. The upper end of the lock piston 23 is capable of being engaged with a holding member 12 which is interlocked with the movable sleeve 11. The lower portion of the lock cylinder is coupled to the combustion chamber via a gas tube 24. The gas tube 24 is provided with a check valve 25. The lock cylinder 22 is provided with an electromagnetic valve 27. The electromagnetic valve 27 opens upon the lapse of a predetermined time period after the combustion within the combustion chamber.
摘要翻译：当气缸上的可动套筒11向上移动时，形成处于密封状态的燃烧室5。混合气体在燃烧室5内爆炸性燃烧，从而驱动紧固件出来。锁芯22设置在可动套筒11的下面。锁定活塞23容纳在锁芯22内，以便能够在上/下方向上移动。锁定活塞23的上端能够与与可动套筒11互锁的保持构件12接合。锁芯的下部通过气体管24联接到燃烧室。气体管24 设置有止回阀25.锁缸22设置有电磁阀27.电磁阀27在燃烧室内燃烧之后经过预定时间段时打开。

35. 发明授权

US07556182B2 Gas combustion type driving tool 有权
标题翻译：气体燃烧式驱动工具
公开(公告)号：US07556182B2
公开(公告)日：2009-07-07
申请号：US11919035
申请日：2006-04-28
申请人： Katsuhiko Murayama , Hajime Takemura , Junichi Tamura
发明人： Katsuhiko Murayama , Hajime Takemura , Junichi Tamura
IPC分类号： B27F7/09
CPC分类号： B25C1/08
摘要： In a gas combustion type driving tool, on a feed cylinder 21 included in a feed piston/cylinder device 7, there is provided a spring for normally urging a feed piston 22 in a feed direction. A portion of the feed cylinder 21 opposite to the spring is connected to a combustion chamber 5 through a gas conduit 26. In an intermediate portion of the gas conduit 26, there is provided a delay piston/cylinder device A. One end of a delay cylinder 27 is disposed on the combustion chamber 5 side, while the other end thereof is disposed on the feed cylinder 21 side. When a delay piston 28 is slidingly moved from one end of the delay cylinder 27 to the other end thereof by the pressure of combustion gas, air compressed within the delay cylinder 27 is supplied from the other end of the delay cylinder 27 to the feed cylinder 21.
摘要翻译：在气体燃烧式驱动工具中，在进料活塞/气缸装置7中包括的进料缸21上设置有用于在进给方向上正常地推进进料活塞22的弹簧。进料筒21的与弹簧相对的部分通过气体导管26连接到燃烧室5.在气体导管26的中间部分，设置有延迟活塞/气缸装置A.延迟的一端气缸27设置在燃烧室5侧，而另一端设置在进料缸21侧。当延迟活塞28通过燃烧气体的压力从延迟气缸27的一端滑动到另一端时，在延迟气缸27内被压缩的空气从延迟气缸27的另一端供给给进料筒 21。

36. 发明申请

US20090117749A1 Etching Method of Single Wafer 审中-公开
标题翻译：单晶片蚀刻方法
公开(公告)号：US20090117749A1
公开(公告)日：2009-05-07
申请号：US12259940
申请日：2008-10-28
申请人： Sakae KOYATA , Tomohiro Hashii , Katsuhiko Murayama , Kazushige Takaishi , Takeo Katoh
发明人： Sakae KOYATA , Tomohiro Hashii , Katsuhiko Murayama , Kazushige Takaishi , Takeo Katoh
IPC分类号： H01L21/306
CPC分类号： H01L21/30608 , H01L21/02019 , H01L21/02087 , H01L21/67075 , H01L21/6708
摘要： Local shape collapse of a wafer end portion is suppressed to the minimum level, and a wafer front surface as well as a wafer end portion is uniformly etched while preventing an etchant from flowing to a wafer rear surface.There is provided an etching method of a single wafer which supplies an etchant onto a wafer front surface in a state where a single wafer having flattened front and rear surfaces is held, and etches the wafer front surface and a front surface side end portion by using a centrifugal force generated by horizontally rotating the wafer. According to this method, the etchant is intermittently supplied onto the front surface of the wafer in twice or more, supply of the etchant is stopped after the etchant for one process is supplied, and the etchant for the next process is supplied after the supplied etchant flows off from the end portion of the wafer.
摘要翻译：将晶片端部的局部形状塌陷抑制到最小水平，并且在防止蚀刻剂流入晶片后表面的同时均匀地蚀刻晶片前表面以及晶片端部。提供了在保持具有平坦的前后表面的单个晶片的状态下将蚀刻剂提供到晶片前表面的状态的单晶片的蚀刻方法，并且通过使用晶片前表面和前表面侧端部蚀刻通过水平旋转晶片产生的离心力。根据该方法，蚀刻剂以两次或更多次间歇地供给到晶片的前表面上，在提供一个工艺的蚀刻剂之后停止供应蚀刻剂，并且在所提供的蚀刻剂之后提供用于下一工艺的蚀刻剂从晶片的端部流出。

37. 发明申请

US20070295727A1 Gas cartridge 有权
标题翻译：气瓶
公开(公告)号：US20070295727A1
公开(公告)日：2007-12-27
申请号：US11657699
申请日：2007-01-25
申请人： Keijiro Murayama , Katsuhiko Murayama , Jyunichi Tamura , Masakazu Konishi
发明人： Keijiro Murayama , Katsuhiko Murayama , Jyunichi Tamura , Masakazu Konishi
IPC分类号： B65D51/00
CPC分类号： B65D83/62 , B25C1/08
摘要： In a gas cartridge, inside of a metal made outer can 1 is arranged with a metal made inner bag 2 charged with a fuel gas G1. A space between the outer can 1 and the inner bag 2 is charged with a compression gas G2 for pressing to crush the inner bag 2 in accordance with consumption of the fuel gas G1. Pertinent positions on an inner side of the outer can 1 are provided with deformation introducing members P1 through P7 for producing an initial deformation for introducing a deformation of the inner bag when a press force of the compression gas G2 is received.
摘要翻译：在气体盒中，金属制的外罐1的内部配有带有燃料气体G 1的金属制的内袋2.在外罐1和内袋2之间的空间内装有压缩气体G 2 用于按照燃料气体G 1的消耗挤压内袋2.在外罐1的内侧的相关位置设置有变形引导构件P 1至P 7，用于产生用于引入变形的初始变形当压缩气体G 2的压力被接收时，

38. 发明申请

US20070175863A1 Single Wafer Etching Apparatus and Single Wafer Etching Method 失效
标题翻译：单晶片蚀刻设备和单晶片蚀刻方法
公开(公告)号：US20070175863A1
公开(公告)日：2007-08-02
申请号：US11669431
申请日：2007-01-31
申请人： Sakae Koyata , Tomohiro Hashii , Katsuhiko Murayama , Kazushige Takaishi , Takeo Katoh
发明人： Sakae Koyata , Tomohiro Hashii , Katsuhiko Murayama , Kazushige Takaishi , Takeo Katoh
IPC分类号： H01L47/00 , C03C15/00 , B44C1/22 , H01L21/306 , C23F1/00
CPC分类号： H01L21/6708 , H01L21/02019 , H01L21/30604
摘要： An object of the present invention is to provide a single wafer etching apparatus realizing a high flatness of wafers and an increase in productivity thereof. In the single wafer etching apparatus, a single thin disk-like wafer sliced from a silicon single crystal ingot is mounted on a wafer chuck and spun thereon, and an overall front surface of the wafer is etched with an etching solution supplied thereto by centrifugal force generated by spinning the wafer 11. The singe wafer etching apparatus includes a plurality of supply nozzles 26, 27 capable of discharging the etching solution 14 from discharge openings 26a, 27a onto the front surface of the wafer 11, nozzle-moving devices each capable of independently moving the plurality of supply nozzles 28, 29, and an etching solution supplying device 30 for supplying the etching solution 14 to each of the plurality of supply nozzles and discharging the etching solution 14 from each of the discharge openings to the front surface of the wafer 11.
摘要翻译：本发明的目的是提供一种实现晶片的高平坦度和提高其生产率的单晶片蚀刻装置。在单晶片蚀刻装置中，将从硅单晶锭切片的单个薄片状晶片安装在晶片卡盘上并在其上纺丝，并且用通过离心力供给的蚀刻溶液蚀刻晶片的整个前表面通过旋转晶片11产生。单晶硅晶片蚀刻装置包括能够将蚀刻溶液14从排出口26a，27a排出到晶片11的前表面上的多个供给喷嘴26,27，每个喷嘴移动装置能够独立地移动多个供给喷嘴28,29和蚀刻液供给装置30，用于向多个供给喷嘴中的每一个供给蚀刻液14，并将蚀刻液14从各喷出口排出到晶片11的前表面。

39. 发明申请

US20070087568A1 Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer 失效
公开(公告)号：US20070087568A1
公开(公告)日：2007-04-19
申请号：US11582880
申请日：2006-10-17
申请人： Sakae Koyata , Tomohiro Hashii , Katsuhiko Murayama , Kazushige Takaishi , Takeo Katoh
发明人： Sakae Koyata , Tomohiro Hashii , Katsuhiko Murayama , Kazushige Takaishi , Takeo Katoh
IPC分类号： C03C15/00 , H01L21/306 , H01L21/302
CPC分类号： H01L21/6708 , H01L21/67075 , Y10S134/902
摘要： An apparatus for etching a wafer by a single-wafer process comprises a fluid supplying device which feeds an etching fluid on a wafer, and a wafer-chuck for horizontally holding the wafer. The wafer-chuck is equipped with a gas injection device for injecting a gas to the wafer, a first fluid-aspirating device, and a second fluid-aspirating device. The etching fluid supplied on the wafer is spread by a rotation of the wafer. The etching fluid is scattered by a centrifugal force, or flows down over an edge portion of the wafer and is blown-off by the gas injected from the gas injection unit, and is aspirated by the first fluid-aspirating device or the second fluid-aspirating device.

40. 发明申请

US20060264157A1 Wafer polishing apparatus and method for polishing wafers 有权
标题翻译：晶圆抛光装置及抛光晶片的方法
公开(公告)号：US20060264157A1
公开(公告)日：2006-11-23
申请号：US11433701
申请日：2006-05-11
申请人： Tomohiro Hashii , Katsuhiko Murayama , Sakae Koyata , Kazushige Takaishi
发明人： Tomohiro Hashii , Katsuhiko Murayama , Sakae Koyata , Kazushige Takaishi
IPC分类号： B24B7/30 , B24B29/00
CPC分类号： B24B37/04 , B24B57/02 , H01L21/02024
摘要： This wafer polishing apparatus includes: a polishing plate having a polishing pad; a carrier plate which is placed facing the polishing pad and which slides and presses wafers against the polishing pad, while rotating in a state of holding the wafers; and an abrasive slurry supply device, wherein the abrasive slurry supply device is able to supply different abrasive slurries, each of the abrasive slurries contains abrasives of which the average grain size is different from those contained in the other abrasive slurries. This method for polishing wafers includes: while supplying an abrasive slurry to a surface of a polishing pad, sliding and pressing wafers against the polishing pad, wherein different abrasive slurries are supplied to the surface of the polishing pad, and each of the abrasive slurries contains abrasives of which the average grain size is different from those contained in the other abrasive slurries.
摘要翻译：该晶片抛光装置包括：具有抛光垫的抛光板; 载体板，其面向抛光垫放置并且在保持晶片的状态下旋转的同时将晶片滑动并压靠在抛光垫上; 和磨料浆料供应装置，其中磨料浆料供应装置能够供应不同的研磨浆料，每个研磨浆料含有平均粒径与其它磨料浆料中所含磨料不同的研磨剂。抛光晶片的这种方法包括：当将研磨浆料供应到抛光垫的表面时，将晶片滑动并压靠抛光垫，其中不同的磨料浆料被供应到抛光垫的表面，并且每个磨料浆料包含研磨剂的平均粒径与其他磨料浆料中所含的磨粒不同。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式