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    • 33. 发明申请
    • Methods of Coating Substrate With Plasma Resistant Coatings and Related Coated Substrates
    • 用等离子体涂层和相关涂层基材涂覆基材的方法
    • US20110135915A1
    • 2011-06-09
    • US12953224
    • 2010-11-23
    • Sang Ho LeeGary Reichl
    • Sang Ho LeeGary Reichl
    • B32B5/00C23C14/30C23C14/28C23C14/06C23C16/22C23C14/34B05D1/36
    • C23C14/083H01J2237/332Y10T428/265
    • The invention includes a method of coating a substrate with a plasma etch-resistant layer that exhibits reduced particulation comprising applying an coating layer to a substrate wherein coating layer has a thickness of about 20 microns or less and wherein the coating layer, after exposure to a fluorine based plasma for an amount of time, is substantially free of any cracks or fissures that span the cross section of the coating layer.A coated substrate prepared by the methods described. Also included in the invention are coated substrates for use as a structural element in a fluorine-based semiconductor wafer processing protocol, wherein the coating is a coating layer having a thickness of about 20 microns or less and wherein the coating layer, after exposure to a fluorine based plasma for an amount of time, is substantially free of any cracks or fissures that span the cross section of the coating layer and exhibits reduced particulation.Included are structural elements used in a fluorine-based semiconductor wafer processing protocol, wherein at least a portion of a surface of a structural element is coated with a coating layer that having a thickness of about 20 microns or less and wherein the coating layer, after exposure to a fluorine based plasma for an amount of time, is substantially free of any cracks or fissures that span the cross section of the coating layer and exhibits reduced particulation.
    • 本发明包括一种用等离子体耐蚀刻层涂覆基材的方法,该层具有减小的颗粒,包括将涂层施加到基材上,其中涂层具有约20微米或更小的厚度,并且其中所述涂层在暴露于 基于氟的等离子体一段时间,基本上没有跨过涂层的横截面的任何裂纹或裂缝。 通过所述方法制备的涂布基材。 本发明还包括用作氟基半导体晶片处理方案中的结构元件的涂布基材,其中所述涂层是具有约20微米或更小的厚度的涂层,并且其中所述涂层在暴露于 基于氟的等离子体一段时间,基本上没有任何裂缝或裂缝跨过涂层的横截面并显示减少的颗粒。 包括在氟基半导体晶片处理方案中使用的结构元件,其中结构元件的表面的至少一部分涂覆有具有约20微米或更小的厚度的涂层,并且其中所述涂层在 暴露于基于氟的等离子体一段时间内,基本上没有任何裂缝或裂缝跨过涂层的横截面并表现出减少的颗粒化。
    • 37. 发明申请
    • Actuator for Active Roll Control System
    • 主动滚动控制系统执行机构
    • US20100007103A1
    • 2010-01-14
    • US12499523
    • 2009-07-08
    • Sung Jun KIMHae Ryong ChoiSang Ho Lee
    • Sung Jun KIMHae Ryong ChoiSang Ho Lee
    • B60G21/055
    • B60G21/0555B60G2202/422B60G2204/1224B60G2204/4193
    • An actuator for an active roll control system that connects a stabilizer bar with a lower arm may include a screw housing having a space, a power transmitter slidably mounted in an upper interior circumference of the screw housing, and having an upper end portion connected to one end of the stabilizer bar and a lower end portion slidably movable in the space wherein the lower end portion of the power transmitter includes a screw groove and a screw thread is formed at an interior circumference of an inlet portion, a lead screw being inserted in the screw groove of the power transmitter and threaded to the screw thread of the inlet portion and having a screw rotation shaft integrally connected to a lower end thereof, and a drive motor mounted at a lower portion of the screw housing and having a rotation shaft connected to the screw rotation shaft.
    • 用于将稳定杆与下臂连接的主动滚动控制系统的致动器可以包括具有空间的螺旋壳体,可滑动地安装在螺钉壳体的上部内周中的动力传递器,并且具有连接到一个 所述稳定杆的端部和在所述动力变送器的下端部具有螺纹槽的空间可滑动地移动的下端部,在所述入口部的内周形成有螺纹, 电动变送器的螺纹槽,并且与入口部分的螺纹螺纹连接,并且具有与其下端一体连接的螺杆旋转轴,以及安装在螺钉壳体的下部的驱动马达,其具有连接到 螺杆旋转轴。