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31. 发明授权

US07104869B2 Barrier removal at low polish pressure 失效
公开(公告)号：US07104869B2
公开(公告)日：2006-09-12
申请号：US10187857
申请日：2002-06-27
申请人： Stan Tsai , Rashid Mavliev , Lizhong Sun , Feng Q. Liu , Liang-Yuh Chen , Ratson Morad
发明人： Stan Tsai , Rashid Mavliev , Lizhong Sun , Feng Q. Liu , Liang-Yuh Chen , Ratson Morad
IPC分类号： B24B1/00 , H01L21/47
CPC分类号： B24B37/0056 , B24B37/044 , B24B49/006 , B24B49/16 , C09G1/02 , H01L21/3212
摘要： The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds, selective polishing pads, and selective polishing temperatures, for removing barrier materials by a chemical mechanical polishing technique with minimal residues and minimal seam damage. Aspects of the invention are achieved by employing a strategic multi-step process including sequential CMP at low polishing pressure to remove the deposited barrier materials.

32. 发明授权

US06955516B2 Single wafer dryer and drying methods 有权
标题翻译：单片干燥机和干燥方法
公开(公告)号：US06955516B2
公开(公告)日：2005-10-18
申请号：US10286404
申请日：2002-11-01
申请人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： H01L21/304 , H01L21/00 , B65G1/133
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

33. 发明授权

US06869498B1 Chemical mechanical polishing with shear force measurement 失效
标题翻译：化学机械抛光用剪切力测量
公开(公告)号：US06869498B1
公开(公告)日：2005-03-22
申请号：US10358780
申请日：2003-02-04
申请人： Stan Tsai , Rashid Mavliev , Liang-Yuh Chen
发明人： Stan Tsai , Rashid Mavliev , Liang-Yuh Chen
IPC分类号： B24B37/04 , B24B49/16 , H01L21/304
CPC分类号： B24B37/005 , B24B49/16
摘要： A chemical mechanical polishing system uses a shear force measurement system. Polishing parameters, such as the polishing pressure, can be adjusted in response to the measured shear force. For example, the pressure can be increased to avoid hydroplaning or decreased to avoid delamination or damage to a low-k dielectric film being polished. The shear force measurement system can include a sensor disk and one or more load cells.
摘要翻译：化学机械抛光系统使用剪切力测量系统。抛光参数，例如抛光压力，可以根据测得的剪切力进行调节。例如，可以增加压力以避免滑水或降低，以避免分层或损坏被抛光的低k电介质膜。剪切力测量系统可以包括传感器盘和一个或多个称重传感器。

34. 发明授权

US06821881B2 Method for chemical mechanical polishing of semiconductor substrates 失效
标题翻译：半导体衬底的化学机械抛光方法
公开(公告)号：US06821881B2
公开(公告)日：2004-11-23
申请号：US10199444
申请日：2002-07-19
申请人： Stan D. Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Q. Liu , Rashid Mavliev , Ratson Morad , Daniel A. Carl
发明人： Stan D. Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Q. Liu , Rashid Mavliev , Ratson Morad , Daniel A. Carl
IPC分类号： H01L214763
CPC分类号： H01L21/7684 , B24B37/042 , B24B49/16 , H01L21/3212 , Y02P80/30
摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.
摘要翻译：提供了用于处理基板以改善抛光均匀性，改善平面化，去除残留材料并最小化缺陷形成的方法和装置。在一个方面，提供了一种用于处理具有导电材料和设置在其上的低介电常数材料的衬底的方法，其包括在约2psi或更小的抛光压力和约200cps或更高的压板旋转速度下抛光衬底。抛光工艺可以使用含有至多约1重量％的磨料的抛光组合物。磨料的百分比。抛光工艺可以集成到多步抛光工艺中。

35. 发明授权

US06392745B1 Method and apparatus for the fast detection of surface characteristics 失效
标题翻译：快速检测表面特性的方法和装置
公开(公告)号：US06392745B1
公开(公告)日：2002-05-21
申请号：US09593644
申请日：2000-06-13
申请人： Rashid Mavliev , Hwa-Chi Wang
发明人： Rashid Mavliev , Hwa-Chi Wang
IPC分类号： G01N100
CPC分类号： G01N21/94 , G01N15/0205 , G01N15/065 , G01N21/9501
摘要： A method and apparatus for quickly detecting the surface characteristics of a surface, such as features, anomalies or contaminants are disclosed. The method and apparatus use heterogeneous condensation of a vapor on a surface and evaporation to reveal the surface characteristics of the surface and thereby enable the detection of such features.
摘要翻译：公开了用于快速检测表面的表面特性（例如特征，异常或污染物）的方法和装置。该方法和装置使用蒸气在表面上的异质凝结和蒸发以揭示表面的表面特性，从而能够检测这些特征。

36. 发明申请

US20110053465A1 METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL 审中-公开
标题翻译：用于本地抛光控制的方法和装置
公开(公告)号：US20110053465A1
公开(公告)日：2011-03-03
申请号：US12941816
申请日：2010-11-08
申请人： STAN TSAI , Feng Q. Liu , Yan Wang , Rashid Mavliev , Liang-Yuh Chen , Alain Duboust
发明人： STAN TSAI , Feng Q. Liu , Yan Wang , Rashid Mavliev , Liang-Yuh Chen , Alain Duboust
IPC分类号： B24B1/00 , B24D11/00
CPC分类号： B24B37/046 , B24B37/26 , B24B49/10 , C25F7/00 , H01L21/32125
摘要： A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.
摘要翻译：通常提供用于处理室中的局部抛光和沉积控制的方法和装置。在一个实施例中，提供了一种用于电化学处理衬底的设备，其通过控制跨越处理区域的电偏压分布来选择性地抛光衬底的离散导电部分，从而控制衬底的两个或更多导电部分之间的处理速率。

37. 发明授权

US07738101B2 Systems and methods for in-line monitoring of particles in opaque flows 失效
标题翻译：用于在不透明流中的颗粒在线监测的系统和方法
公开(公告)号：US07738101B2
公开(公告)日：2010-06-15
申请号：US12169500
申请日：2008-07-08
申请人： Rashid Mavliev
发明人： Rashid Mavliev
IPC分类号： G01N15/02 , G01N33/36
CPC分类号： G01N15/1459 , G01N15/1436 , G01N21/05 , G01N21/51 , G01N21/85 , G01N2015/1493 , G01N2021/0346 , G01N2021/0378 , G01N2021/513
摘要： Systems and methods are disclosed for particle monitoring. An exemplary method includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; measuring transparency of the flowable sample; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths, and the method can include identifying characteristics of particles contained in the sample which has been compressed.
摘要翻译：公开了用于粒子监测的系统和方法。一种示例性方法包括限制对于至少第一波长波长的光波是不透明的可流动样品; 测量可流动样品的透明度; 同时在与第一和第二方向正交的第三方向延伸样品的同时将样品限制在平行于可流动样品的流动方向并与第一方向正交的第二方向上，同时沿第一方向压缩可流动样品。当样品在第一方向被压缩时，样品对于第一波长范围中的至少一个波长变得透明，并且该方法可以包括识别被压缩的样品中包含的颗粒的特征。

38. 发明授权

US07678245B2 Method and apparatus for electrochemical mechanical processing 失效
标题翻译：电化学机械加工的方法和装置
公开(公告)号：US07678245B2
公开(公告)日：2010-03-16
申请号：US10880752
申请日：2004-06-30
申请人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
发明人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
IPC分类号： C25B9/00
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/16 , B24B49/16 , B24B53/017 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。残余处理单元包括偏置的导电平面化表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

39. 发明申请

US20100007879A1 SYSTEMS AND METHODS FOR IN-LINE MONITORING OF PARTICLES IN OPAQUE FLOWS 失效
标题翻译：用于在线性流体中颗粒进行在线监测的系统和方法
公开(公告)号：US20100007879A1
公开(公告)日：2010-01-14
申请号：US12169500
申请日：2008-07-08
申请人： Rashid Mavliev
发明人： Rashid Mavliev
IPC分类号： G01N15/02 , G01N1/10
CPC分类号： G01N15/1459 , G01N15/1436 , G01N21/05 , G01N21/51 , G01N21/85 , G01N2015/1493 , G01N2021/0346 , G01N2021/0378 , G01N2021/513
摘要： Systems and methods are disclosed for particle monitoring. An exemplary method includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; measuring transparency of the flowable sample; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths, and the method can include identifying characteristics of particles contained in the sample which has been compressed.
摘要翻译：公开了用于粒子监测的系统和方法。一种示例性方法包括限制对于至少第一波长波长的光波是不透明的可流动样品; 测量可流动样品的透明度; 同时在与第一和第二方向正交的第三方向延伸样品的同时将样品限制在平行于可流动样品的流动方向并与第一方向正交的第二方向上，同时沿第一方向压缩可流动样品。当样品在第一方向被压缩时，样品对于第一波长范围中的至少一个波长变得透明，并且该方法可以包括识别被压缩的样品中包含的颗粒的特征。

40. 发明授权

US07422516B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07422516B2
公开(公告)日：2008-09-09
申请号：US11868829
申请日：2007-10-08
申请人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
IPC分类号： B24D11/02 , B23H5/06 , C25D5/22
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
摘要翻译：提供了用于研磨衬底的抛光制品的实施例。在一个实施例中，抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层，以及夹在环形上层和环形下层之间的环形子垫，其与之形成可更换组件。

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