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    • 36. 发明授权
    • Thermosetting quinazolone resins their preparation and their applications
    • 热固性喹唑啉酮树脂的制备及应用
    • US4931541A
    • 1990-06-05
    • US313679
    • 1989-02-22
    • Regis MercierBernard Sillion
    • Regis MercierBernard Sillion
    • C07D239/91C08F38/00C08F138/00C08G73/06
    • C08G73/0694C08F38/00
    • Thermosetting quinazolone resins, their preparation and their applicationsre described.These thermosetting quinazolone resins can be defined as having the following general formula: ##STR1## in which Ar.sup.1 is a bivalent mono- or polycyclic aromatic radical and Ar.sup.2 is a bivalent aromatic radical of several simple aromatic rings bound two by two by atoms or bivalent groups.These Ar.sup.1 and Ar.sup.2 radicals are chosen so that the melting or emollescence temperature is between 80.degree. C. and 170.degree. C.The resins can be prepared from condensation of an ethynylarylbenzoxazinone with an aromatic diamine containing flexibilizing groups.These quinazolone resins can be polymerized in bulk in order to prepare adhesives or composite matrices in particular.
    • 热固性喹唑啉酮树脂及其制备方法及应用。 这些热固性喹唑啉酮树脂可以定义为具有以下通式:其中Ar1是二价单环或多环芳族基团,Ar2是几个由原子或二价基团键合的两个简单芳环的二价芳族基团 。 选择这些Ar1和Ar2基团,使得熔融或发泡温度在80℃和170℃之间。树脂可以由乙炔基芳基苯并恶嗪酮与含有柔性基团的芳族二胺的缩合制备。 这些喹唑啉酮树脂可以大量聚合,以便制备粘合剂或复合基质。