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    • 1. 发明授权
    • Polyimide precursor composition and application therefrom
    • 聚酰亚胺前体组合物及其应用
    • US5104968A
    • 1992-04-14
    • US564236
    • 1990-08-08
    • Serge GonzalezPaul MariaggiGuy RabilloudBernard Sillion
    • Serge GonzalezPaul MariaggiGuy RabilloudBernard Sillion
    • C08G73/10C09D5/25H01B3/30
    • C08G73/1003C08G73/1007C08G73/1042H01B3/306Y10T428/31504
    • Polyimide precursor compositions incorporating at least one compound of fula (1), at least one compound of formula (2), at least one compound of formula (3) and at least one compound of formula (4) ##STR1## in which one of the groups R.sup.3 and R.sup.4 represents a hydrogen atom and the other, in the same way as the groups R.sup.1 and R.sup.2, which can be the same or different, in each case represent a hydrocarbon group having 1 to 16 carbon atoms, m is a number between 5 and 20, n is an integer between 1 and 5 and R.sup.5 represents a hydrogen atom, a halogen atom, a hydrocarbon group with 1 to 16 carbon atoms, or a group of formula R.sup.6 --O-- in which R.sup.6 represents a hydrocarbon group having 1 to 16 carbon atoms. The preferred composition contains 30 to 70% by weight of dry matter of compounds of formulas (1), (2) and (3), in which the groups R.sup.1, R.sup.2 and one of the groups R.sup.3 and R.sup.4 is a methyl or ethyl group and the compound of formula (4) is benzyl alcohol. These compositions are usable as smoothing and/or protective coatings for metals, metal alloys or other substrates and in particular in the electrical and electronic industries, e.g. for the formation of dielectric films.
    • 引入至少一种式(1)化合物,至少一种式(2)化合物,至少一种式(3)化合物和至少一种式(4)化合物的聚酰亚胺前体组合物 图像(2)(3)(4)其中R3和R4中的一个代表氢原子,另一个与R1和R2基团相同,可以相同 或者不同,在每种情况下都表示具有1至16个碳原子的烃基,m是5至20之间的数,n是1和5之间的整数,R 5表示氢原子,卤素原子,具有1个 至16个碳原子的基团,或其中R 6表示具有1至16个碳原子的烃基的式R6-O-基团。 优选的组合物包含30至70重量%的式(1),(2)和(3)化合物的干物质,其中基团R 1,R 2和基团R 3和R 4中的一个是甲基或乙基 并且式(4)的化合物是苄醇。 这些组合物可用作金属,金属合金或其它基材的平滑和/或保护涂层,特别是在电气和电子工业中。 用于形成介电膜。