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31. 发明申请

US20080292492A1 Solder Alloy 有权
标题翻译：焊接合金
公开(公告)号：US20080292492A1
公开(公告)日：2008-11-27
申请号：US11720578
申请日：2005-12-01
申请人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
发明人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
IPC分类号： C22C13/00 , B23K35/24
CPC分类号： B23K35/262 , C22C1/06 , C22C13/00 , C22C13/02
摘要： An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
摘要翻译：适用于波峰焊工艺，回流焊接工艺，热空气整平工艺或球栅阵列的合金，该合金含有0.08-3wt。％铋，0.15-1.5重量％％铜，0.1-1.5重量％％银，0-0.1重量％％磷，0-0.1重量％％锗，0-0.1重量％％镓，0-0.3重量％％的一种或多种稀土元素，0-0.3wt。％铟，0-0.3重量％％镁，0-0.3重量％％钙，0-0.3重量％％硅，0-0.3重量％％铝，0-0.3重量％％锌，以及从0.02-0.3重量％镍，0.008-0.2重量％锰，0.01-0.3重量％钴，0.01-0.3重量％铬，0.02-0.3重量％铁，，和0.008-0.1重量％的锆，余量为锡，以及不可避免的杂质。

32. 发明申请

US20070009738A1 Nanoscale structures and methods of preparation and use 有权
标题翻译：纳米结构及其制备和使用方法
公开(公告)号：US20070009738A1
公开(公告)日：2007-01-11
申请号：US11176017
申请日：2005-07-07
申请人： Rakesh Kumar , Bawa Singh , Brian Lewis , Michael Marczi
发明人： Rakesh Kumar , Bawa Singh , Brian Lewis , Michael Marczi
IPC分类号： B32B1/00
CPC分类号： B01J13/14 , B01J35/06 , B01J35/08 , Y10T428/2982 , Y10T428/2984 , Y10T428/2991
摘要： Structures in the nanoscale and mesoscale domain are provided. The structures typically have a shell which can be comprised of a porous polymeric material such as parylene. The surfaces of the shell can further comprise pendant functional groups that can provide reactive or passive characteristics.
摘要翻译：提供了纳米尺度和中尺度域中的结构。结构通常具有可以由多孔聚合材料如聚对二甲苯构成的壳。壳体的表面可进一步包含可提供反应性或被动特性的侧链官能团。

33. 发明申请

US20060035413A1 Thermal protection for electronic components during processing 审中-公开
标题翻译：加工过程中电子部件的热保护
公开(公告)号：US20060035413A1
公开(公告)日：2006-02-16
申请号：US10755944
申请日：2004-01-13
申请人： Alan Rae , Bawa Singh
发明人： Alan Rae , Bawa Singh
IPC分类号： H01L21/50
CPC分类号： H01L23/36 , H01L24/81 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00
摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.
摘要翻译：一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。存在与电子部件热连通的冷却单元，其从其提取热量。

34. 发明申请

US20050151554A1 Cooling devices and methods of using them 审中-公开
标题翻译：冷却装置及其使用方法
公开(公告)号：US20050151554A1
公开(公告)日：2005-07-14
申请号：US10892303
申请日：2004-07-15
申请人： Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
发明人： Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
IPC分类号： G01R31/02 , H01L21/60 , H01L23/36
CPC分类号： H01L23/36 , H01L24/81 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00
摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.
摘要翻译：公开了一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。在某些实例中，冷却装置包括可从电子部件和/或周围环境接收，吸收或提取热量的冷却装置主体和任选的冷却介质。

35. 发明授权

US06303143B1 Pharmaceutical product 失效
标题翻译：药品
公开(公告)号：US06303143B1
公开(公告)日：2001-10-16
申请号：US09095616
申请日：1998-06-10
申请人： Suggy S. Chrai , Ramaswamy Murari , Eugene Samuel Poliniak , Hoi Cheong (Steve) Sun , Nitin Vithalbhai Desai , Dominic Stephen Rosati , Nalin Kumar , William Ronald Roach , Lawrence Harrison Hammer , Peter David Southgate , Bawa Singh , Howard Christopher Rivenburg , David Keller , Peter John Zanzucchi , Aaron William Levine , Prince Lal
发明人： Suggy S. Chrai , Ramaswamy Murari , Eugene Samuel Poliniak , Hoi Cheong (Steve) Sun , Nitin Vithalbhai Desai , Dominic Stephen Rosati , Nalin Kumar , William Ronald Roach , Lawrence Harrison Hammer , Peter David Southgate , Bawa Singh , Howard Christopher Rivenburg , David Keller , Peter John Zanzucchi , Aaron William Levine , Prince Lal
IPC分类号： A61K948
CPC分类号： A61J3/00 , A61J1/035 , A61K9/70 , B05B5/08 , B65B1/04 , B65B1/30 , B65B11/50 , G01N33/521
摘要： A substrate is roboticaly picked up at a station and transported to a measuring station to measure the distance to a reference. The substrate is aligned to a robot before measurement. The measured substrate is then transported to a pharmaceutical or diagnostic powder/grain deposition station where the powder/grains are controllably deposited on the substrate to predetermined thicknesses over a plurality of powder/grain collection zones. The deposited powder/grains are then measured to determine the thickness and area covered by the deposited powder/grains at each collection zone. The substrate is then transported to a lamination station and each collection zone of powder/grains is welded to a cover substrate. The system remembers which collection zones are out of specification so that they can be later selectively discarded.
摘要翻译：机器人被机器人拾取并运送到测量站以测量到参考的距离。在测量之前，将基板与机器人对准。然后将测量的基底输送到药物或诊断粉末/颗粒沉积站，其中粉末/颗粒可控地沉积在基底上至多个粉末/颗粒收集区域上的预定厚度。然后测量沉积的粉末/颗粒以确定在每个收集区域沉积的粉末/颗粒覆盖的厚度和面积。然后将基板输送到层压站，并将粉末/颗粒的每个收集区域焊接到覆盖基板。系统会记住哪些收集区域超出规范，以便随后可以选择性地丢弃它们。

36. 发明授权

US06228228B1 Method of making a light-emitting fiber 失效
标题翻译：制造发光纤维的方法
公开(公告)号：US06228228B1
公开(公告)日：2001-05-08
申请号：US09418774
申请日：1999-10-15
申请人： Bawa Singh , William Ronald Roach , William Chiang
发明人： Bawa Singh , William Ronald Roach , William Chiang
IPC分类号： H05B3300
CPC分类号： G09F9/305 , H01L27/32 , H01L51/5203 , H01L51/5287 , Y10S362/80
摘要： A display as for images and/or information comprises a plurality of light-emitting fibers disposed in side-by-side arrangement to define a viewing surface. Each light-emitting fiber includes a plurality of light-emitting elements disposed along its length, each having two electrodes between which are applied electrical signals to cause the light-emitting element to emit light to display a pixel or sub-pixel of the image and/or information. The light-emitting fiber includes an electrical conductor disposed along its length to serve as a first electrode, a layer of light-emissive material disposed thereon, and a plurality of electrical contacts disposed on the light-emissive material to serve as the second electrodes of the light-emitting elements, and are formed in a continuous process wherein a transparent fiber passes through a plurality of processing chambers for receiving the electrical conductor, the light-emissive layer and the plurality of electrical contacts thereon. The method of making a light-emitting fiber comprises providing a length of a fiber, forming a first electrode along the fiber, depositing a light-emitting material along the fiber in electrical contact with the first electrode, and forming a plurality of second electrodes along the fiber in electrical contact with the light-emitting material.
摘要翻译：关于图像和/或信息的显示包括并排布置的多个发光纤维，以限定观察表面。每个发光光纤包括沿着其长度设置的多个发光元件，每个发光元件具有两个电极，它们之间被施加电信号，以使发光元件发光以显示图像的像素或子像素;以及 /或信息。发光光纤包括沿其长度布置以用作第一电极的电导体，设置在其上的发光材料层，以及设置在发光材料上以用作第二电极的第二电极的多个电触点发光元件，并且以连续工艺形成，其中透明光纤通过用于接收电导体，发光层和多个电触点的多个处理室。制造发光纤维的方法包括提供长度的纤维，沿着纤维形成第一电极，沿着光纤与第一电极电接触沉积发光材料，并沿着第一电极形成多个第二电极光纤与发光材料电接触。

37. 发明授权

US6149774A AC waveforms biasing for bead manipulating chucks 失效
公开(公告)号：US6149774A
公开(公告)日：2000-11-21
申请号：US095425
申请日：1998-06-10
申请人： Hoi Cheong Steve Sun , Eugene Samuel Poliniak , Dominic Stephen Rosati , Bawa Singh , Nitin Vithalbhai Desai
发明人： Hoi Cheong Steve Sun , Eugene Samuel Poliniak , Dominic Stephen Rosati , Bawa Singh , Nitin Vithalbhai Desai
IPC分类号： B01J19/08 , B01J19/00 , G01N35/00 , H02N13/00
CPC分类号： H02N13/00 , B01J19/0046 , B01J2219/00468 , B01J2219/005 , G01N2035/00574 , Y10S118/02 , Y10T279/23
摘要： AC waveforms biasing of bead transporter chucks and their accumulated charge sensing circuits tailored for low resistivity substrates and beads where if traditional DC quasi-static biasing potentials were used, the bead attraction potentials of the chuck would undergo rapid RC decay and cause the bead transporter chuck to stop working. Methods for selecting AC waveforms are given, including those that maximize the time average of the bead attraction potential at the bead collection zone of the bead contact surface.

38. 发明授权

US5857456A Inhaler apparatus with an electronic means for enhanced release of dry powders 失效
标题翻译：具有电子装置的吸入装置，用于增强干粉的释放
公开(公告)号：US5857456A
公开(公告)日：1999-01-12
申请号：US661212
申请日：1996-06-10
申请人： Hoi Cheong Steve Sun , Bawa Singh , Howard Christopher Rivenburg , Pabitra Datta , Nitin Vithabhi Desai
发明人： Hoi Cheong Steve Sun , Bawa Singh , Howard Christopher Rivenburg , Pabitra Datta , Nitin Vithabhi Desai
IPC分类号： A61M15/00
CPC分类号： A61M15/0045 , A61M15/0051 , A61M15/0055 , A61M2205/0233
摘要： The present invention is directed, in part, to an inhaler apparatus with a substrate having medicament deposited thereon, the substrate being configured for electronic release of the medicament. In preferred embodiments, the inhaler comprises a conductive layer and a dielectric layer thereon. In preferred embodiments, the inhaler further comprises a second conductive layer positioned above the substrate without having contact with the substrate. In certain preferred embodiments, the voltage source is connected to the conductive layer in the substrate and the second conductive layer above the substrate. In other preferred embodiments, the inhaler apparatus further comprises a third conductive layer positioned below the substrate, and the voltage source is preferably connected to the second conductive layer above the substrate and the third conductive layer below the substrateIn another aspect, the present invention provides a method for dispensing a medicant from an inhaler, comprising: (a) providing an inhaler with a substrate having a medicant deposited thereon, the substrate comprising a conductive layer and a dielectric layer and a voltage source connected to said conductive layer; and (b) actuating the voltage source.
摘要翻译：本发明部分地涉及具有沉积有药剂的基底的吸入器装置，该基底被配置为电子释放药物。在优选实施例中，吸入器在其上包括导电层和介电层。在优选实施例中，吸入器还包括位于衬底上方的第二导电层，而不与衬底接触。在某些优选实施例中，电压源连接到衬底中的导电层和衬底上方的第二导电层。在其它优选实施例中，吸入器装置还包括位于衬底下方的第三导电层，并且电压源优选地连接到衬底上方的第二导电层和衬底下方的第三导电层。在另一方面，本发明提供一种从吸入器分配药物的方法，包括：（a）为吸入器提供具有沉积在其上的药物的基底，所述基底包括导电层和电介质层以及连接到所述导电层的电压源; 和（b）致动电压源。

39. 发明申请

US20080160310A1 REDUCING JOINT EMBRITTLEMENT IN LEAD-FREE SOLDERING PROCESSES 有权
标题翻译：在无铅焊接工艺中减少焊接接头
公开(公告)号：US20080160310A1
公开(公告)日：2008-07-03
申请号：US12036604
申请日：2008-02-25
申请人： Brian G. Lewis , Bawa Singh , John Laughlin , Ranjit Pandher
发明人： Brian G. Lewis , Bawa Singh , John Laughlin , Ranjit Pandher
IPC分类号： B32B1/00
CPC分类号： B23K35/262 , H05K1/09 , H05K3/244 , H05K3/3463 , H05K2201/0355 , Y10T428/2991
摘要： In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.
摘要翻译：在制造诸如印刷线路板或芯片级封装和球栅阵列的产品中，将选自Ni，Co，Cr，Mn，Zr，Fe和Si中的一种或多种元素掺入无铅焊接工艺中以减少接合脆化。在不同的实施例中，这可以通过喷涂到焊料球体或预型体表面上，通过喷涂到器件衬底表面上，或通过结合到器件衬底合金中来实现。

40. 发明申请

US20080159903A1 SOLDER ALLOY 有权
标题翻译：焊接合金
公开(公告)号：US20080159903A1
公开(公告)日：2008-07-03
申请号：US12036497
申请日：2008-02-25
申请人： Brian G. Lewis , Bawa Singh , John Laughlin , Ranjit Pandher
发明人： Brian G. Lewis , Bawa Singh , John Laughlin , Ranjit Pandher
IPC分类号： C22C13/00
CPC分类号： C22C13/00
摘要： An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
摘要翻译：适用于球栅阵列或芯片级封装的合金，其包含0.05-1.5wt。％铜，0.1-2重量％％银，0.005-0.3重量％镍，0.003-0.3重量％铬，0-0.1重量％％磷，0-0.1重量％％锗，0-0.1重量％％镓，0-0.3重量％％的一种或多种稀土元素，0-0.3wt。％铟，0-0.3重量％％镁，0-0.3重量％％钙，0-0.3重量％％硅，0-0.3重量％％铝，0-0.3重量％％锌，0-2重量％％铋，0-1重量％％的锑，0-0.2重量％的锰，0-0.3重量％的钴，0-0.3重量％的铁和0-0.1重量％的锆，余量为的锡以及不可避免的杂质。

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