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31. 发明申请

US20100073893A1 MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE 有权
标题翻译：使用电容最小化芯片包装中的镀层反射
公开(公告)号：US20100073893A1
公开(公告)日：2010-03-25
申请号：US12237444
申请日：2008-09-25
申请人： Bhyrav Murthy Mutnury , Moises Cases , Nanju Na , Tae Hong Kim
发明人： Bhyrav Murthy Mutnury , Moises Cases , Nanju Na , Tae Hong Kim
IPC分类号： H05K7/00 , H01L21/00
CPC分类号： H01L21/4853 , C25D5/02 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H05K1/0231 , H05K1/162 , H05K3/242 , H05K2203/049 , H01L2924/00012 , H01L2924/00
摘要： Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer.
摘要翻译：本发明的实施例涉及通过连接开放式电镀短截线和接地之间的电容来将高频芯片封装中的谐振频率从工作频率移开。一个实施例提供了用于将芯片与印刷电路板接口的多层基板。第一外层提供了芯片安装位置。信号互连与芯片安装位置间隔开，并且信号迹线从芯片安装位置附近延伸到信号互连。安装在芯片安装位置的芯片可以通过引线键合连接到信号迹线。电镀短截线从信号互连延伸到衬底的周围。电容器用于将电镀端子电容耦合到接地层。

32. 发明申请

US20080091389A1 SYSTEMS AND METHODS FOR ELECTROMAGNETIC BAND GAP STRUCTURE SYNTHESIS 有权
标题翻译：电磁带隙结构合成的系统与方法
公开(公告)号：US20080091389A1
公开(公告)日：2008-04-17
申请号：US11854997
申请日：2007-09-13
申请人： Tae Hong Kim , Ege Engin , Madhavan Swaminathan
发明人： Tae Hong Kim , Ege Engin , Madhavan Swaminathan
IPC分类号： G06F17/10
CPC分类号： G06F17/5068
摘要： The present invention describes methods and apparatus for electromagnetic band gap structure synthesis. An exemplary embodiment of the present invention provides a method of electromagnetic band gap structure synthesis, which includes the step of providing a set of desired characteristics for an electromagnetic band gap structure. Furthermore, the method includes generating populations of patch shape members with a genetic algorithm routine and solving one or more of patch shape members of the populations with an electrodynamics modeling technique. Thereafter, the method includes the step of converting the output of the electrodynamics modeling technique into a set of response data for one or more of the patch shape members and calculating a fitness level for one or more of the sets of response data in comparison to the set of desired characteristics for the electromagnetic band gap structure. Next, the method includes the step of determining whether the fitness level of one of the patch shape members is within a predetermined tolerance. Subsequently, if none of the patch shape members provides a fitness level within the predetermined tolerance, then the steps of generating, solving, converting, calculating, and determining are repeated.
摘要翻译：本发明描述了用于电磁带隙结构合成的方法和装置。本发明的一个示例性实施例提供了一种电磁带隙结构合成方法，其包括为电磁带隙结构提供一组所需特性的步骤。此外，该方法包括使用遗传算法程序生成斑块形状成员的群体，并用电动力学建模技术解决群体中的一个或多个斑块形状成员。此后，该方法包括以下步骤：将电动力学建模技术的输出转换成用于一个或多个补片形状构件的一组响应数据，并计算一组或多组响应数据的适应度水平，与设置电磁带隙结构的所需特性。接下来，该方法包括以下步骤：确定一个贴片形状构件的适合度是否在预定的容限内。随后，如果贴片形状构件中没有一个在预定公差内提供适合度，则重复生成，求解，转换，计算和确定的步骤。

33. 发明授权

US07289712B2 Planar optical waveguide and method of fabricating the same 失效
标题翻译：平面光波导及其制造方法
公开(公告)号：US07289712B2
公开(公告)日：2007-10-30
申请号：US11237223
申请日：2005-09-28
申请人： Tae Hong Kim , Jong Jun You , Hee Kyung Sung
发明人： Tae Hong Kim , Jong Jun You , Hee Kyung Sung
IPC分类号： G02B6/10
CPC分类号： G02B6/125 , G02B6/12004 , G02B6/12007
摘要： Provided are a planar optical waveguide and a method of fabricating the same which is adapted to a planar optical component and an optical component for use in a optical communication. The planar optical waveguide includes: a lower cladding layer formed on a substrate, a core formed on the lower cladding layer, a dielectric layer covering the core, and an upper cladding layer formed on the lower cladding layer having the dielectric layer. By forming the dielectric layer having a low refractive index between the core and the clad, a difference of refractive indices between the core and the clad increases so that light is densely focused into the core, thereby forming a single mode having a strong energy to minimize a propagation loss.
摘要翻译：提供一种平面光波导及其制造方法，其适用于用于光通信的平面光学部件和光学部件。平面光波导包括：形成在基板上的下包层，形成在下包层上的芯，覆盖芯的电介质层和形成在具有电介质层的下包层上的上包层。通过在芯和包层之间形成具有低折射率的电介质层，芯和包层之间的折射率差增加，使得光密集地聚焦到芯中，从而形成具有强能量的单模以最小化传播损失。

34. 发明授权

US08830690B2 Minimizing plating stub reflections in a chip package using capacitance 有权
标题翻译：使用电容最小化芯片封装中的电镀短截线反射
公开(公告)号：US08830690B2
公开(公告)日：2014-09-09
申请号：US12237444
申请日：2008-09-25
申请人： Bhyrav M Mutnury , Moises Cases , Nanju Na , Tae Hong Kim
发明人： Bhyrav M Mutnury , Moises Cases , Nanju Na , Tae Hong Kim
IPC分类号： H05K1/18 , H05K1/02 , H05K1/16 , H05K3/24
CPC分类号： H01L21/4853 , C25D5/02 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H05K1/0231 , H05K1/162 , H05K3/242 , H05K2203/049 , H01L2924/00012 , H01L2924/00
摘要： Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer.
摘要翻译：本发明的实施例涉及通过连接开放式电镀短截线和接地之间的电容来将高频芯片封装中的谐振频率从工作频率移开。一个实施例提供了用于将芯片与印刷电路板接口的多层基板。第一外层提供了芯片安装位置。信号互连与芯片安装位置间隔开，并且信号迹线从芯片安装位置附近延伸到信号互连。安装在芯片安装位置的芯片可以通过引线键合连接到信号迹线。电镀短截线从信号互连延伸到衬底的周围。电容器用于将电镀端子电容耦合到接地层。

35. 发明授权

US08444495B2 Cross groove type constant velocity joint 有权
标题翻译：十字槽型恒速接头
公开(公告)号：US08444495B2
公开(公告)日：2013-05-21
申请号：US12582602
申请日：2009-10-20
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/223
CPC分类号： F16C1/04 , F16D3/227
摘要： A constant velocity joint for a drive system includes an outer joint member and an inner joint member, each having a plurality of ball grooves, the ball grooves consisting of a first group of grooves of a skewed groove shape with a first skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of the outer and inner joint members, and a second group of grooves of a skewed groove shape with a second skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of the outer and inner joint members, the second skew angle less than the first skew angle. In addition to the differentiated skew angles, the contact angles of the balls in the first and second group of grooves may also be differentiated.
摘要翻译：用于驱动系统的恒速接头包括外接头构件和内接头构件，每个都具有多个球槽，所述球槽由具有第一偏斜角度而不是零的倾斜槽形状的第一组槽组成并且相对于外接头构件和内接头构件的旋转轴线相反的方向交替地布置，并且具有倾斜槽形状的第二组沟槽形状，具有除了零之外的第二歪斜角度，并且相对于外接头构件和内接头构件的旋转，第二歪斜角小于第一歪斜角。除了不同的偏斜角之外，第一组和第二组凹槽中的球的接触角也可以是不同的。

36. 发明授权

US08409020B2 Cross groove type constant velocity joint with composite groove patterns 有权
标题翻译：具有复合槽图案的十字槽型等速万向节
公开(公告)号：US08409020B2
公开(公告)日：2013-04-02
申请号：US13477186
申请日：2012-05-22
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/226
CPC分类号： F16D3/223 , F16D3/229 , F16D3/24
摘要： A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair.
摘要翻译：用于驱动系统的等速万向节包括：具有多个向内的外球槽的外接头构件，所述外滚珠槽由第一组槽组成，第二组槽具有复合或非直线槽图案; 内侧接头构件，其设置在所述外侧接头构件的内侧，具有由第一组槽构成的多个向外的内部球槽和具有复合或非直线槽形状的第二组槽，所述内侧接头的每个内部球槽构件与所述外接头构件的相应的外球槽大致交叉对地联接。

37. 发明授权

US08382600B2 Cross groove type constant velocity joint with composite groove patterns 有权
标题翻译：具有复合槽图案的十字槽型等速万向节
公开(公告)号：US08382600B2
公开(公告)日：2013-02-26
申请号：US12563029
申请日：2009-09-18
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/226
CPC分类号： F16D3/223 , F16D3/229 , F16D3/24
摘要： A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair; and a cage having circumferentially displaced cage windows to accommodate a plurality of balls therein. The groove patterns of the ball grooves can be a combination of skewed grooves and non-linear grooves, a combination of non-linear grooves such as a curved groove or a compositely shaped groove, or a combination of linear grooves and non-linear grooves.
摘要翻译：用于驱动系统的等速万向节包括：具有多个向内的外球槽的外接头构件，所述外滚珠槽由第一组槽组成，第二组槽具有复合或非直线槽图案; 内侧接头构件，其设置在所述外侧接头构件的内侧，具有由第一组槽构成的多个向外的内部球槽和具有复合或非直线槽形状的第二组槽，所述内侧接头的每个内部球槽构件与所述外接头构件的相应的外球槽大致交叉对地联接; 以及笼，其具有周向移位的笼窗，以容纳其中的多个球。球槽的凹槽图案可以是斜槽和非直线槽的组合，诸如弯曲凹槽或复合形状凹槽的非线性凹槽的组合，或者线性凹槽和非直线凹槽的组合。

38. 发明申请

US20130008696A1 CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE 有权
标题翻译：具有最小化焊盘电容的多层电路基板
公开(公告)号：US20130008696A1
公开(公告)日：2013-01-10
申请号：US13614314
申请日：2012-09-13
申请人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
发明人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
IPC分类号： H05K1/00
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/16 , H01L2224/16 , H01L2224/16235 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H05K1/0231 , H05K1/024 , H05K1/0251 , H05K1/113 , H05K1/144 , H05K2201/0187 , H05K2201/041 , H05K2201/09481 , H05K2201/09718 , H05K2201/10734 , Y10T29/49124 , Y10T29/49151 , H01L2924/00
摘要： A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
摘要翻译：多层互连衬底具有至少两个间隔开的金属层，每个金属层上具有导电焊盘。在金属层之间放置两种不同类型的绝缘层。这种放置使得两种不同类型的绝缘层中的一种被放置在导电焊盘之间，另一种类型的绝缘层被放置在两个间隔开的金属层之间。

39. 发明申请

US20130003335A1 CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE 审中-公开
标题翻译：具有最小化焊盘电容的无线多层电路基板
公开(公告)号：US20130003335A1
公开(公告)日：2013-01-03
申请号：US13612459
申请日：2012-09-12
申请人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
发明人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
IPC分类号： H05K7/06
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/16 , H01L2224/16 , H01L2224/16235 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H05K1/0231 , H05K1/024 , H05K1/0251 , H05K1/113 , H05K1/144 , H05K2201/0187 , H05K2201/041 , H05K2201/09481 , H05K2201/09718 , H05K2201/10734 , Y10T29/49124 , Y10T29/49151 , H01L2924/00
摘要： A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
摘要翻译：多层互连衬底具有至少两个间隔开的金属层，每个金属层上具有导电焊盘。在金属层之间放置两种不同类型的绝缘层。这种放置使得两种不同类型的绝缘层中的一种被放置在导电焊盘之间，另一种类型的绝缘层被放置在两个间隔开的金属层之间。

40. 发明申请

US20120238370A1 CROSS GROOVE TYPE CONSTANT VELOCITY JOINT WITH COMPOSITE GROOVE PATTERNS 有权
标题翻译：具有复合沟槽图案的交叉型恒定速度接头
公开(公告)号：US20120238370A1
公开(公告)日：2012-09-20
申请号：US13477186
申请日：2012-05-22
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/24
CPC分类号： F16D3/223 , F16D3/229 , F16D3/24
摘要： A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair.
摘要翻译：用于驱动系统的等速万向节包括：具有多个向内的外球槽的外接头构件，所述外滚珠槽由第一组槽组成，第二组槽具有复合或非直线槽图案; 内侧接头构件，其设置在所述外侧接头构件的内侧，具有由第一组槽构成的多个向外的内部球槽和具有复合或非直线槽形状的第二组槽，所述内侧接头的每个内部球槽构件与所述外接头构件的相应的外球槽大致交叉对地联接。

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