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    • 33. 发明专利
    • RESIZING METHOD FOR POLYGON GROUP
    • JPH0452770A
    • 1992-02-20
    • JP15568490
    • 1990-06-14
    • NIPPON TELEGRAPH & TELEPHONE
    • TAZAWA SATOSHIOKUBO TSUNEOSAITO KAZUYUKIKOMATSU KAZUHIKO
    • G06F17/50
    • PURPOSE:To shorten processing time by inserting a virtual side whose length is zero into a required place at the time of giving contact information and giving contact information to the virtual side if necessary. CONSTITUTION:A regular edge is defined in a part which is not brought into contact with other polygon on respective sides showing the outlines of respective polygons. A contact edge 20 is defined in a contact part on the side of one polygon, and the regular edge on the contact part of the side of the other polygon in the part which is brought into contact with the other polygon. The regular edge whose length is zero or the contact edge 30 is inserted into all boundary points of the regular edge and the contact edge 20 as to mixed sides. A straight line obtained by shifting it in parallel in a direction to be resized by a resized quantity is assumed for the regular edge and the straight lines obtained by shifting them in parallel in a direction opposite to the direction to be resized by the resized quantity are assumed to be the contact edges 20 and 30. Then, respective apexes are shifted to the position of the intersection point of two assumed straight lines. Thus, resizing processing time is shortened.
    • 38. 发明专利
    • PROJECTION EXPOSURE METHOD
    • JPH09260255A
    • 1997-10-03
    • JP6854796
    • 1996-03-25
    • NIPPON TELEGRAPH & TELEPHONE
    • HORIUCHI TOSHIYUKIMIMURA YOSHIAKIHARADA KATSUYUKIKOMATSU KAZUHIKO
    • G03F7/20G02B1/12H01L21/027
    • PROBLEM TO BE SOLVED: To form a smaller microscopic pattern by a method wherein the partial coherent coefficients, which correspond to those of circular secondary light sources having outer and inner diameters equal to those of torus-shaped secondary light sources, of the torus-shaped secondary light sources are set at a value within a specified range, the reflectance of exposure light from a substrate to be exposed is set at a specified one or lower and the film thickness of a resist is formed in a thickness of the value or lower of a specified formula. SOLUTION: An antireflection film 3 is formed on a silicon wafer 1, which is mirror-finished, so that the reflectance of exposure rays is 0.5% or lower and a resist film 4 is formed on this film 3 in a thickness of 3.λ/(2n) or thinner. Here, the (λ) is assumed an exposure wavelength and the (n) is assumed the refractive index of the resist film. Therefore, the resolution of the resist film can be significantly enhanced. Here, by using torus-shaped secondary light sources, which have the mean value (σm) of the partial coherent coefficients to correspond to those of circular secondary light sources having outer and inner diameters equal to those of the torus-shaped secondary light sources within the range of 0.61 to 0.73 and have the value (Δσ) of 1/2 of the difference between their coherent coefficients within the range of 0.05 to 0.15, in combination with each other, a high-resolution pattern transfer can be made even in a low contrast of about 0.4.