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31. 发明授权

US5526687A Semiconductor acceleration sensor and testing method thereof 失效
标题翻译：半导体加速度传感器及其测试方法
公开(公告)号：US5526687A
公开(公告)日：1996-06-18
申请号：US252557
申请日：1994-06-01
申请人： Katsumichi Ueyanagi
发明人： Katsumichi Ueyanagi
IPC分类号： G01P15/08 , G01P15/12 , G01P21/00
CPC分类号： G01P21/00 , G01P15/0802 , G01P15/124 , G01P2015/0828
摘要： A semiconductor acceleration sensor includes a silicon detecting member integrally processed from a silicon substrate, having a weight, a supporting portion, and a beam for coupling the weight with the supporting portion, at least one semiconductor strain gauge being formed on an upper surface of the beam; an upper glass provided on an upper portion of the silicon detecting member, and having a concave by which the weight is displaceable; and a lower glass provided on a lower portion of the silicon detecting member, and having a concave by which the weight is displaceable. The supporting portion of the silicon detecting member is electrostatically jointed with the upper glass and the lower glass, respectively; and conductive film is formed on the concave of the lower glass; and an opening portion through which a wiring pattern is externally derived from the conductive film is formed in the lower glass.
摘要翻译：半导体加速度传感器包括从具有重量的硅衬底整体加工的硅检测构件，支撑部分和用于将重物与支撑部分联接的梁，至少一个半导体应变计形成在光束; 设置在所述硅检测部件的上部的上部玻璃，并且具有凹部，所述重物可移动通过所述凹部; 以及设置在硅检测构件的下部上的下玻璃，并且具有凹部，重量可移动。硅检测部件的支撑部分分别与上玻璃和下玻璃静电接合; 并且在下玻璃的凹部上形成导电膜; 并且在下玻璃中形成有从导电膜外部导出布线图案的开口部。

32. 发明授权

US08030749B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08030749B2
公开(公告)日：2011-10-04
申请号：US12292480
申请日：2008-11-20
申请人： Shin Soyano , Katsumichi Ueyanagi
发明人： Shin Soyano , Katsumichi Ueyanagi
IPC分类号： H01L23/48
CPC分类号： H01L25/072 , H01L24/37 , H01L24/40 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40225 , H01L2224/48091 , H01L2224/73221 , H01L2224/84205 , H01L2224/84214 , H01L2224/84801 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At least one terminal block has at least one wiring terminal for electrically connecting the semiconductor element and the external connection terminals.
摘要翻译：半导体器件包括树脂壳体，固定地设置在树脂壳体上的多个外部连接端子和设置在树脂壳体中的至少一个半导体元件。至少一个端子块具有用于电连接半导体元件和外部连接端子的至少一个接线端子。

33. 发明授权

US07705443B2 Semiconductor device with lead frame including conductor plates arranged three-dimensionally 有权
标题翻译：具有引线框架的半导体器件包括三维布置的导体板
公开(公告)号：US07705443B2
公开(公告)日：2010-04-27
申请号：US11872867
申请日：2007-10-16
申请人： Toshiyuki Yokomae , Katsumichi Ueyanagi , Eiji Mochizuki , Yoshinari Ikeda
发明人： Toshiyuki Yokomae , Katsumichi Ueyanagi , Eiji Mochizuki , Yoshinari Ikeda
IPC分类号： H01L23/48 , H01L23/52 , H01L23/495 , H01L29/40
CPC分类号： H01L25/072 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/84 , H01L25/162 , H01L25/18 , H01L25/50 , H01L2224/05553 , H01L2224/37011 , H01L2224/371 , H01L2224/37111 , H01L2224/37144 , H01L2224/37147 , H01L2224/3754 , H01L2224/40137 , H01L2224/45124 , H01L2224/48091 , H01L2224/48175 , H01L2224/48227 , H01L2224/48247 , H01L2224/49111 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83224 , H01L2224/83801 , H01L2224/84801 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electrical connection inside a semiconductor device is established by lead frames formed of plural conductor plates. The lead frames are disposed three-dimensionally so that the respective weld parts thereof are exposed toward a laser light source used in the laser welding. The laser welding is then performed by irradiating a laser beam. According to the above, welding can be performed readily in a reliable manner. The productivity of the semiconductor device and the manufacturing method of the semiconductor device can be thus enhanced. In addition, because the lead frames have the cooling effect, they have the capability of a heat spreader. It is thus possible to provide a semiconductor device and a manufacturing method of the semiconductor device with high productivity.
摘要翻译：通过由多个导体板形成的引线框架建立半导体器件内部的电连接。引线框架三维地设置，使得其各个焊接部分朝向激光焊接中使用的激光源曝光。然后通过照射激光束来进行激光焊接。根据上述，可以容易地以可靠的方式进行焊接。因此可以提高半导体器件的生产率和半导体器件的制造方法。另外，由于引线框具有冷却效果，因此具有散热器的能力。因此，可以以高生产率提供半导体器件的半导体器件和制造方法。

34. 发明授权

US07412894B2 Pressure sensing device incorporating pressure sensing chip in resin case 有权
标题翻译：压力传感装置，包含树脂盒中的压力传感芯片
公开(公告)号：US07412894B2
公开(公告)日：2008-08-19
申请号：US10926797
申请日：2004-08-26
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L9/00
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/143 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.
摘要翻译：一种压力传感器装置包括：压力传感器芯片，其包含隔膜，压电电阻器，放大电路和各种调节电路;以及传感器芯片接合的基座构件，隔膜面向基座构件的通孔。基部构件和金属构件接合，使得它们各自的通孔彼此连通。将金属构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片电连接以形成压力传感器单元。通过将O形环连接到金属构件并且从上方按压树脂壳体，压力传感器单元固定到例如油封块的外壳上。使用具有弯曲部分和螺纹部分的连接器，压力传感器单元可以通过弯曲压力传感器单元上的弯曲部分而固定到连接器。螺纹部分可以拧入外壳。

35. 发明申请

US20080087994A1 Semiconductor apparatus 有权
标题翻译：半导体装置
公开(公告)号：US20080087994A1
公开(公告)日：2008-04-17
申请号：US11896153
申请日：2007-08-30
申请人： Toshiyuki Yokomae , Katsumichi Ueyanagi , Eiji Mochizuki , Yoshinari Ikeda
发明人： Toshiyuki Yokomae , Katsumichi Ueyanagi , Eiji Mochizuki , Yoshinari Ikeda
IPC分类号： H01L23/495
CPC分类号： H01L23/492 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/371 , H01L2224/37599 , H01L2224/40137 , H01L2224/45124 , H01L2224/48091 , H01L2224/49111 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00015 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor apparatus equipped with at least one semiconductor element includes a metallic plate bonded to an upper surface of the semiconductor element and a conductor plate, bonded to the metallic plate and serving as an electric current path of the semiconductor apparatus. The conductor plate and the metallic plate are bonded to each other by laser welding at a part other than a part directly above the semiconductor element. As a result, heat damage caused by laser welding can be reduced.
摘要翻译：配备有至少一个半导体元件的半导体装置包括接合到半导体元件的上表面的金属板和接合到金属板并用作半导体装置的电流路径的导体板。导体板和金属板通过激光焊接在除半导体元件正上方的部分之外的部分彼此接合。结果，可以减少由激光焊接引起的热损伤。

36. 发明授权

US07234358B2 Pressure detecting apparatus 有权
标题翻译：压力检测装置
公开(公告)号：US07234358B2
公开(公告)日：2007-06-26
申请号：US11354959
申请日：2006-02-16
申请人： Kazunori Saito , Yuji Ichimura , Kei Yamaguchi , Katsumichi Ueyanagi , Shigeru Shinoda
发明人： Kazunori Saito , Yuji Ichimura , Kei Yamaguchi , Katsumichi Ueyanagi , Shigeru Shinoda
IPC分类号： G01L9/00
CPC分类号： G01L19/143 , G01L19/0084 , G01L19/146 , G01L19/147
摘要： A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.
摘要翻译：压力检测装置具有压力检测装置，其将施加于其上的应力引起的应变转换为电信号，并输出转换后的电信号。该装置具有壳体基部，该壳体基部包括容纳凹部，该壳体凹部容纳其中的压力检测装置，以及插入在压力检测装置和壳体凹部之间的连接材料。连接材料以约400％以上的拉伸伸长率连接压力检测装置和容纳凹部。压力检测装置有助于防止热应力对其检测性能产生不利影响，并且产生优异的热响应。

37. 发明申请

US20060238186A1 Semiconductor device and temperature detection method using the same 审中-公开
标题翻译：半导体器件和温度检测方法使用相同
公开(公告)号：US20060238186A1
公开(公告)日：2006-10-26
申请号：US11342877
申请日：2006-01-31
申请人： Mutsuo Nishikawa , Katsumichi Ueyanagi
发明人： Mutsuo Nishikawa , Katsumichi Ueyanagi
IPC分类号： G01N27/00
CPC分类号： G01K7/01 , G01K2205/02 , H01L27/092 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor apparatus has a temperature detecting section for detecting temperature with a semiconductor device formed in a semiconductor substrate; a temperature detector output terminal formed on the substrate for outputting a detection signal; a current generating device connected to the output terminal for supplying a driving current to the temperature detecting section; and a voltage measuring device connected to the output terminal for measuring the voltage of the output terminal. The apparatus detects temperature based on the voltage measured by the voltage measuring device when the driving current is supplied from the current generating device to the temperature detecting section. The apparatus is small, accurate, and easily manufactured at relatively low cost.
摘要翻译：半导体装置具有温度检测部，用于利用半导体衬底中形成的半导体器件来检测温度; 温度检测器输出端子，形成在所述基板上，用于输出检测信号; 连接到输出端子的电流产生装置，用于向温度检测部分提供驱动电流; 以及连接到输出端子的电压测量装置，用于测量输出端子的电压。当从电流发生装置向温度检测部提供驱动电流时，该装置基于由电压测量装置测量的电压来检测温度。该设备小巧，准确，易于以相对较低的成本制造。

38. 发明申请

US20050016289A1 Physical value detecting apparatus and housing for physical value detecting means 有权
标题翻译：物理值检测装置和物理值检测装置
公开(公告)号：US20050016289A1
公开(公告)日：2005-01-27
申请号：US10854232
申请日：2004-05-27
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi , Shigeru Shinoda
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi , Shigeru Shinoda
IPC分类号： G01L9/00 , G01D11/24 , H01L23/16 , H01L29/84 , H03H7/38
CPC分类号： G01D11/245 , H01L23/16 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/00012
摘要： A physical value detecting apparatus includes a housing having a concave portion; a physical value detecting device housed in the concave portion and having a substantially rectangular shape for converting a physical value into an electric signal and outputting the electric signal; a device for taking out a signal from the physical value detecting device; an adhesive member for adhering the physical value detecting device to the concave portion; and a positioning device provided on an inner wall of the concave portion for positioning the physical value detecting device. The concave portion supports the physical value detecting device at a bottom thereof via the adhesive member without contacting corner parts of the physical value detecting device.
摘要翻译：物理值检测装置包括具有凹部的壳体; 物理值检测装置，其容纳在所述凹部中并且具有用于将物理值转换为电信号并输出所述电信号的大致矩形形状; 用于从物理值检测装置取出信号的装置; 用于将所述物理值检测装置粘附到所述凹部的粘合构件; 以及设置在所述凹部的内壁上的定位装置，用于定位所述物理值检测装置。凹部经由粘接部件在其底部支撑物理值检测装置，而不接触物理值检测装置的角部。

39. 发明授权

US06684371B2 Layout of semiconductor integrated circuit 有权
标题翻译：半导体集成电路布局
公开(公告)号：US06684371B2
公开(公告)日：2004-01-27
申请号：US10117340
申请日：2002-04-08
申请人： Katsuyuki Uematsu , Mutsuo Nishikawa , Katsumichi Ueyanagi
发明人： Katsuyuki Uematsu , Mutsuo Nishikawa , Katsumichi Ueyanagi
IPC分类号： G06F1750
CPC分类号： G06F17/5068 , H01L2224/05553
摘要： To improve the capability to withstand noises and surges in a semiconductor integrated circuit in which an RC filter for cutting electromagnetic wave noises is integrated with analog circuits and digital circuits, a positive electrode of a capacitor constituting the RC filter is disposed apart from circuit elements or connection lines constituting the circuits at such an interval as to prevent malfunction of the circuit elements resulting from a noise superimposed on the positive electrode, or dielectric breakdown of the capacitor constituting the RC filter and latch-up and dielectric breakdown of the circuit elements resulting from a surge applied to the positive electrode. The interval is larger than the minimum interval required by a layout rule or five times longer than the minimum.
摘要翻译：为了提高在用于切割电磁波噪声的RC滤波器与模拟电路和数字电路集成的半导体集成电路中抵抗噪声和浪涌的能力，构成RC滤波器的电容器的正电极与电路元件或构成电路的连接线以这样的间隔来防止由叠加在正电极上的噪声导致的电路元件的故障，或者构成RC滤波器的电容器的电介质击穿以及由此产生的电路元件的闭锁和电介质击穿施加到正电极的浪涌。间隔大于布局规则所需的最小间隔或比最小值长五倍的间隔。

40. 发明授权

US06494092B2 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor 失效
标题翻译：半导体传感器芯片及其制造方法，以及用于组装传感器的半导体传感器和封装
公开(公告)号：US06494092B2
公开(公告)日：2002-12-17
申请号：US09957241
申请日：2001-09-21
申请人： Katsumichi Ueyanagi , Mutsuo Nishikawa , Mitsuo Sasaki
发明人： Katsumichi Ueyanagi , Mutsuo Nishikawa , Mitsuo Sasaki
IPC分类号： G01P102
CPC分类号： G01P1/023 , G01P15/0802 , G01P15/0888 , G01P15/11 , G01P15/123 , G01P21/00 , H01F10/126 , H01F10/265 , H05K1/18
摘要： The present invention is a semiconductor sensor having a semiconductor sensor chip for detecting a physical value applied in a direction perpendicular to the chip surface; and a package for incorporating the semiconductor sensor chip. The main surface for mounting the semiconductor sensor chip is formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides for connecting with input/output terminals of the semiconductor sensor chip. A bottom surface, perpendicular to the main surface, is provided with a plurality of pins formed along the two sides parallel to the main surface, so that the plurality of pins are inserted into mounting holes formed in the printed circuit board. The plurality of terminals and the plurality of pins are electrically connected, and input/output terminals of the semiconductor sensor chip mounted on the main surface are electrically connected with the plurality of terminals of the package.
摘要翻译：本发明是具有半导体传感器芯片的半导体传感器，用于检测在垂直于芯片表面的方向上施加的物理值; 以及用于并入半导体传感器芯片的封装。用于安装半导体传感器芯片的主表面相对于用于安装封装的印刷电路板的表面以预定角度形成。主表面沿着两个相对侧设置有多个端子，用于连接半导体传感器芯片的输入/输出端子。垂直于主表面的底面设置有沿着平行于主表面的两侧形成的多个销，使得多个销插入形成在印刷电路板中的安装孔中。多个端子和多个引脚电连接，并且安装在主表面上的半导体传感器芯片的输入/输出端子与封装的多个端子电连接。

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