专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07370536B2 Pressure sensor device and pressure sensor cell thereof 有权
标题翻译：压力传感器装置及其压力传感器单元
公开(公告)号：US07370536B2
公开(公告)日：2008-05-13
申请号：US11372465
申请日：2006-03-10
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L9/00
CPC分类号： G01L19/0627 , G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.
摘要翻译：压力传感器装置包括压力传感器单元，该压力传感器单元包括具有压电电阻的隔膜的传感器芯片，放大电路和各种调节电路，以及传感器芯片接合的基座构件，隔膜面向通孔的基础成员。基部构件和金属构件与接合构件接合在一起，使得它们各自的通孔彼此连通。保护膜或填充物覆盖基部构件和金属管构件之间的接合构件。金属管构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片通过引线接合电连接在一起，从而形成压力传感器单元。金属管构件突出超过树脂壳体的端面以支撑负载。

2. 发明申请

US20050087020A1 Pressure sensor device and cell thereof 有权
标题翻译：压力传感器及其单元
公开(公告)号：US20050087020A1
公开(公告)日：2005-04-28
申请号：US10926797
申请日：2004-08-26
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L19/14 , G01L9/00 , G01L9/04 , G01L19/00 , H01L29/84
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/143 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.
摘要翻译：一种压力传感器装置包括：压力传感器芯片，其包含隔膜，压电电阻器，放大电路和各种调节电路;以及传感器芯片接合的基座构件，隔膜面向基座构件的通孔。基部构件和金属构件接合，使得它们各自的通孔彼此连通。将金属构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片电连接以形成压力传感器单元。通过将O形环连接到金属构件并且从上方按压树脂壳体，压力传感器单元固定到例如油封块的外壳上。使用具有弯曲部分和螺纹部分的连接器，压力传感器单元可以通过弯曲压力传感器单元上的弯曲部分而固定到连接器。螺纹部分可以拧入外壳。

3. 发明申请

US20060213276A1 Pressure sensor device and pressure sensor cell thereof 有权
标题翻译：压力传感器装置及其压力传感器单元
公开(公告)号：US20060213276A1
公开(公告)日：2006-09-28
申请号：US11372465
申请日：2006-03-10
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L9/00
CPC分类号： G01L19/0627 , G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.
摘要翻译：压力传感器装置包括压力传感器单元，该压力传感器单元包括具有压电电阻的隔膜的传感器芯片，放大电路和各种调节电路，以及传感器芯片接合的基座构件，隔膜面向通孔的基础成员。基部构件和金属构件与接合构件接合在一起，使得它们各自的通孔彼此连通。保护膜或填充物覆盖基部构件和金属管构件之间的接合构件。金属管构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片通过引线接合电连接在一起，从而形成压力传感器单元。金属管构件突出超过树脂壳体的端面以支撑负载。

4. 发明授权

US07004035B2 Physical value detecting apparatus and housing for physical value detecting means 有权
标题翻译：物理值检测装置和物理值检测装置
公开(公告)号：US07004035B2
公开(公告)日：2006-02-28
申请号：US10854232
申请日：2004-05-27
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi , Shigeru Shinoda
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi , Shigeru Shinoda
IPC分类号： G01L21/12
CPC分类号： G01D11/245 , H01L23/16 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/00012
摘要： A physical value detecting apparatus includes a housing having a concave portion; a physical value detecting device housed in the concave portion and having a substantially rectangular shape for converting a physical value into an electric signal and outputting the electric signal; a device for taking out a signal from the physical value detecting device; an adhesive member for adhering the physical value detecting device to the concave portion; and a positioning device provided on an inner wall of the concave portion for positioning the physical value detecting device. The concave portion supports the physical value detecting device at a bottom thereof via the adhesive member without contacting corner parts of the physical value detecting device.
摘要翻译：物理值检测装置包括具有凹部的壳体; 物理值检测装置，其容纳在所述凹部中并且具有用于将物理值转换为电信号并输出所述电信号的大致矩形形状; 用于从物理值检测装置取出信号的装置; 用于将所述物理值检测装置粘附到所述凹部的粘合构件; 以及设置在所述凹部的内壁上的定位装置，用于定位所述物理值检测装置。凹部经由粘接部件在其底部支撑物理值检测装置，而不接触物理值检测装置的角部。

5. 发明授权

US07412894B2 Pressure sensing device incorporating pressure sensing chip in resin case 有权
标题翻译：压力传感装置，包含树脂盒中的压力传感芯片
公开(公告)号：US07412894B2
公开(公告)日：2008-08-19
申请号：US10926797
申请日：2004-08-26
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L9/00
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/143 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.
摘要翻译：一种压力传感器装置包括：压力传感器芯片，其包含隔膜，压电电阻器，放大电路和各种调节电路;以及传感器芯片接合的基座构件，隔膜面向基座构件的通孔。基部构件和金属构件接合，使得它们各自的通孔彼此连通。将金属构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片电连接以形成压力传感器单元。通过将O形环连接到金属构件并且从上方按压树脂壳体，压力传感器单元固定到例如油封块的外壳上。使用具有弯曲部分和螺纹部分的连接器，压力传感器单元可以通过弯曲压力传感器单元上的弯曲部分而固定到连接器。螺纹部分可以拧入外壳。

6. 发明申请

US20050016289A1 Physical value detecting apparatus and housing for physical value detecting means 有权
标题翻译：物理值检测装置和物理值检测装置
公开(公告)号：US20050016289A1
公开(公告)日：2005-01-27
申请号：US10854232
申请日：2004-05-27
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi , Shigeru Shinoda
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi , Shigeru Shinoda
IPC分类号： G01L9/00 , G01D11/24 , H01L23/16 , H01L29/84 , H03H7/38
CPC分类号： G01D11/245 , H01L23/16 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/00012
摘要： A physical value detecting apparatus includes a housing having a concave portion; a physical value detecting device housed in the concave portion and having a substantially rectangular shape for converting a physical value into an electric signal and outputting the electric signal; a device for taking out a signal from the physical value detecting device; an adhesive member for adhering the physical value detecting device to the concave portion; and a positioning device provided on an inner wall of the concave portion for positioning the physical value detecting device. The concave portion supports the physical value detecting device at a bottom thereof via the adhesive member without contacting corner parts of the physical value detecting device.
摘要翻译：物理值检测装置包括具有凹部的壳体; 物理值检测装置，其容纳在所述凹部中并且具有用于将物理值转换为电信号并输出所述电信号的大致矩形形状; 用于从物理值检测装置取出信号的装置; 用于将所述物理值检测装置粘附到所述凹部的粘合构件; 以及设置在所述凹部的内壁上的定位装置，用于定位所述物理值检测装置。凹部经由粘接部件在其底部支撑物理值检测装置，而不接触物理值检测装置的角部。

7. 发明授权

US07571652B2 Pressure sensor apparatus and pressure sensor housing 有权
标题翻译：压力传感器设备和压力传感器外壳
公开(公告)号：US07571652B2
公开(公告)日：2009-08-11
申请号：US11939077
申请日：2007-11-13
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
IPC分类号： G01L7/00
CPC分类号： G01L19/0038 , G01L19/0627 , G01L19/141
摘要： A pressure sensor apparatus and a pressure sensor housing are provided that are capable of preventing the occurrence of frozen moisture, swelling of a gel-like coating member and damage of a pressure sensor element without accumulating moisture, oil, gasoline or the like on a protective wall even when the pressure sensor apparatus is disposed obliquely. The protective wall prevents entry of foreign matter into the pressure detection chamber, or a pressure sensor housing of the pressure sensor apparatus. The protective wall has an inclined surface that is provided with an angle θ8a in which a second angle θ2 is acquired between a horizontal line HL and the inclined surface that slopes downward when the pressure sensor apparatus is disposed obliquely by a first angle θ1 with respect to the horizontal line HL.
摘要翻译：提供一种压力传感器装置和压力传感器壳体，其能够防止冻结的水分的发生，凝胶状涂层部件的膨胀和压力传感器元件的损坏，而不会将水分，油，汽油等积聚在保护即使压力传感器装置倾斜地设置。保护壁防止异物进入压力检测室或压力传感器装置的压力传感器外壳。保护壁具有倾斜表面，该倾斜表面设置有角度θ8a，其中当压力传感器装置相对于第一角度θ1倾斜设置时，在水平线HL和倾斜表面之间获取第二角度θ2，水平线HL。

8. 发明授权

US07574919B2 Integrated sensor including a pressure sensor and a temperature sensor 有权
标题翻译：集成传感器，包括压力传感器和温度传感器
公开(公告)号：US07574919B2
公开(公告)日：2009-08-18
申请号：US11937950
申请日：2007-11-09
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
IPC分类号： G01L19/04
CPC分类号： G01K13/02 , G01K1/14 , G01K1/18 , G01K2205/02 , G01L19/0092 , G01L23/24
摘要： An integrated sensor includes a pressure sensor integrated with a temperature sensor. When the sensor is attached to an object of attachment at a mounting position at an angle of θrq degrees with respect to an ideal attachment position, in which a central axis of at sensor body element of the temperature sensor element is disposed perpendicular to a direction in which a gas to be measured passes through the object of attachment, an inclination angle θpos at which the central axis of the sensor body element is inclined at the mounting position with respect to a position of the central axis of the main body element at the ideal attachment position is set according to the following equation: (θrq−θallow)≦θpos≦(θrq+θallow) wherein θallow represents an allowable angle at which an allowable response speed of the temperature sensor element is obtained.
摘要翻译：集成传感器包括与温度传感器集成的压力传感器。当传感器在相对于理想的安装位置以相同角度的安装位置附接到安装位置时，其中温度传感器元件的传感器主体元件的中心轴垂直于被测量的气体通过安装对象，传感器体元件的中心轴线相对于主体元件的中心轴位置处于理想状态的安装位置倾斜的倾斜角度附件位置根据以下等式设置：<？in-line-formula description =“In-line Formulas”end =“lead”？>（thetarq-thetaallow）<= thetapos <=（thetarq + thetaallow）<？in -line-formula description =“In-line Formulas”end =“tail”？>其中thetaallow表示获得温度传感器元件的允许响应速度的允许角度。

9. 发明授权

US06747346B2 Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device 失效
标题翻译：用于半导体传感器的容器，其制造方法和半导体传感器装置
公开(公告)号：US06747346B2
公开(公告)日：2004-06-08
申请号：US10121431
申请日：2002-04-12
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
IPC分类号： H01L2312
CPC分类号： G01L19/142 , G01L19/147 , H01L23/057 , H01L23/10 , H01L23/24 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A container for a semiconductor sensor includes a housing body and a cover. On the upper surface of the housing body outer than the pressure detection room, a groove is provided to trap the gel protective material overflowed from the pressure detection room. The housing body and the cover are respectively provided with a recess portion and a protruding portion, engaging with each other, to secure adhesion of the cover to the housing body. The clearance between the housing body and the lead terminal is filled with filler that is formed by applying and curing polyimide resin. The sensor-mounting pit is provided with a relief portion for releasing excess portion of the adhesive, which is used for adhering the pedestal. The excess adhesive is released into the relief portion, to suppress creeping up of the adhesive.
摘要翻译：用于半导体传感器的容器包括壳体和盖。在壳体的比压力检测室以外的上表面设置有用于捕获从压力检测室溢出的凝胶保护材料的槽。壳体和盖分别设置有彼此接合的凹部和突出部分，以确保盖与壳体的粘附。壳体与引线端子之间的间隙填充有通过涂覆和固化聚酰亚胺树脂形成的填料。传感器安装凹坑设置有用于释放用于粘附基座的粘合剂的多余部分的释放部分。多余的粘合剂被释放到浮雕部分中，以抑制粘合剂的蠕变。

10. 发明授权

US06962081B2 Semiconductor physical quantity sensor with improved noise resistance 有权
标题翻译：半导体物理量传感器具有改进的抗噪声能力
公开(公告)号：US06962081B2
公开(公告)日：2005-11-08
申请号：US10053528
申请日：2002-01-18
申请人： Katsumichi Ueyanagi , Kazunori Saito , Kimihiro Ashino , Mutsuo Nishikawa , Katsuyuki Uematsu
发明人： Katsumichi Ueyanagi , Kazunori Saito , Kimihiro Ashino , Mutsuo Nishikawa , Katsuyuki Uematsu
IPC分类号： G01L9/00 , G01L9/04 , G01P1/02 , G01P15/08 , G01P15/12 , H01L29/84 , G01P15/00
CPC分类号： G01L19/0084 , G01L19/069 , G01P1/023 , G01P15/123 , H01L2224/05553 , H01L2224/45124 , H01L2224/48247 , H01L2224/49175 , H01L2924/19107 , H01L2924/3025 , H01L2924/00
摘要： An inexpensive, accurate, and reliable semiconductor physical quantity sensor having improved resistance to noise is provided, wherein pads that have been pulled down to ground inside a semiconductor chip are arranged closer to a ground pad, while pads and that have been pulled up to a power supply inside the chip are arranged closer to a power supply pad. Of the digital input/output pads that have undergone digital trimming to obtain a predetermined output, the pulled-down pads and the ground pad are electrically connected to a ground terminal outside the chip via internal exposed portions, wires, and a ground-connecting external wire. The pulled-up pads and the power supply pad are electrically connected to a power supply terminal outside the chip via the internal exposed portions, the wires, and a power-supply-connecting external wire. Terminals may be electrically connected together on a package or a mounting substrate.
摘要翻译：提供了具有改善的抗噪声性能的廉价，准确和可靠的半导体物理量传感器，其中在半导体芯片内被下拉到地的焊盘被布置成更靠近接地焊盘，而焊盘已经被拉到芯片内的电源设置得更靠近电源板。在经过数字修整以获得预定输出的数字输入/输出焊盘中，下拉焊盘和接地焊盘通过内部暴露部分，导线和接地外部电路与芯片外部的接地端子电连接线。上拉焊盘和电源焊盘通过内部暴露部分，电线和电源连接的外部电线电连接到芯片外部的电源端子。端子可以在封装或安装基板上电连接在一起。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式