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31. 发明授权

US08313312B2 Screw compressor 有权
标题翻译：螺杆压缩机
公开(公告)号：US08313312B2
公开(公告)日：2012-11-20
申请号：US12533688
申请日：2009-07-31
申请人： Hideki Fujimoto , Hitoshi Nishimura , Yusuke Nagai
发明人： Hideki Fujimoto , Hitoshi Nishimura , Yusuke Nagai
IPC分类号： F04B39/02
CPC分类号： F04C29/04 , F04B39/0033 , F04C18/16 , F04C23/00 , F04C23/001 , F04C29/045 , F04C29/06
摘要： A screw compressor comprising: a pair of male and female screw rotors; and an air-cooled heat exchanger, wherein the air-cooled heat exchanger is provided above a motor for driving the compressor body; wherein, with respect to a cooling wind for the air-cooled heat exchanger, the air-cooled heat exchanger is inclined to the upstream side; wherein the uppermost portion of a unit suction port for the air-cooled heat exchanger cooling winds is positioned below the uppermost portion of the air-cooled heat exchanger positioned at the uppermost portion; wherein the lowermost portion of the unit suction port for the air-cooled heat exchanger cooling wind is positioned below the lowermost portion of the air-cooled heat exchanger positioned at the lowermost portion; and wherein the cooling wind for the air-cooled heat exchanger is exhausted from a ceiling portion of the compressor unit. With this structure, it becomes possible to provide a compact screw compressor with less noise whose installation area can be reduced.
摘要翻译：一种螺杆式压缩机，包括：一对公螺纹转子和内螺纹转子; 以及空气冷却热交换器，其中所述风冷式热交换器设置在用于驱动所述压缩机主体的马达上方; 其中，对于风冷式热交换器的冷却风，风冷式热交换器向上游侧倾斜，其特征在于，所述风冷式热交换器的冷却风的单元吸入口的最上部位于位于所述最上部的所述风冷式热交换器的最上部，其中用于风冷式热交换器冷却风的单元吸入口的最下部位于位于最下部的空气冷却热交换器的最下部的下方; 并且其中所述风冷式热交换器的冷却风从所述压缩机单元的顶部排出。利用这种结构，可以提供一种噪音较小的紧凑型螺旋压缩机，其安装面积可以减小。

32. 发明授权

US07881654B2 Image processing apparatus 有权
标题翻译：图像处理装置
公开(公告)号：US07881654B2
公开(公告)日：2011-02-01
申请号：US11827806
申请日：2007-07-13
申请人： Naofumi Ueda , Yusuke Nagai
发明人： Naofumi Ueda , Yusuke Nagai
IPC分类号： G03G15/00
CPC分类号： G03G21/043 , G03G15/6582 , G03G2215/00818
摘要： A document is made which consists of a large number of recording sheets whose originality can be certified with reliability. Different specific images are respectively formed on a plurality of recording sheets of recording sheets outputted in constant order. Confirmation holes are formed on recording sheets at higher levels than the recording sheets with the specific images formed thereon, in positions in conformity with the positions of the specific images. When a document made by stacking those recording sheets is seen from the top, and the specific images are visible through the confirmation holes, the originality of the document can be certified. When the specific image is invisible through the confirmation hole, it is found that the document has been changed due to missing of part of the recording sheets, a change in order of the recording sheets, or the like, and hence the originality of the document cannot be certified.
摘要翻译：制作了一份文件，其中包含大量可以通过可靠性认证的记录册。不同的特定图像分别形成在以恒定顺序输出的多张记录片材的记录片材上。在与特定图像的位置一致的位置上，在与其上形成有特定图像的记录片材比较高的记录片材上形成确认孔。通过从顶部看到通过堆叠这些记录纸制成的文档，并且通过确认孔可以看到特定图像，可以认证文档的原创性。当特定图像通过确认孔不可见时，发现由于缺少部分记录纸而改变了文档，记录纸的顺序改变等等，因此文档的原创性无法认证。

33. 发明授权

US07602071B2 Apparatus for dividing an adhesive film mounted on a wafer 有权
标题翻译：用于分离安装在晶片上的粘合膜的设备
公开(公告)号：US07602071B2
公开(公告)日：2009-10-13
申请号：US11190966
申请日：2005-07-28
申请人： Naoki Ohmiya , Kentaro Iizuka , Yusuke Nagai
发明人： Naoki Ohmiya , Kentaro Iizuka , Yusuke Nagai
IPC分类号： H01L23/28
CPC分类号： H01L21/67132 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： A method of dividing an adhesive film mounted on the back surface of a wafer having a plurality of streets formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of streets, along the streets in a state where the wafer is put on the surface of a protective tape mounted on an annular frame, wherein the adhesive film is cooled and the protective tape is expanded to divide the adhesive film along the peripheries of the function elements.
摘要翻译：将安装在具有在前表面上形成的多个街道的晶片的背面上的粘合膜分割成格子图案的方法和形成在由多个街道分割的多个区域中的功能元件沿着街道其中晶片被放置在安装在环形框架上的保护带的表面上，其中粘合剂膜被冷却并且保护带被扩张以沿着功能元件的周边划分粘合剂膜。

34. 发明授权

US07179721B2 Method of dividing a non-metal substrate 有权
标题翻译：分割非金属基板的方法
公开(公告)号：US07179721B2
公开(公告)日：2007-02-20
申请号：US10849796
申请日：2004-05-21
申请人： Yusuke Nagai
发明人： Yusuke Nagai
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2101/40 , B23K2103/50 , H01L21/78
摘要： A method of dividing a non-metal substrate having a first surface and a second surface formed parallel to the first surface, comprising: a deteriorated layer forming step for forming a deteriorated layer in the inside of the non-metal substrate along dividing lines by applying a laser beam capable of passing through the non-metal substrate from the first surface side with its converging point on the inside thereof; and a deteriorated layer exposing step for exposing the deteriorated layer to the first surface by grinding the first surface side of the non-metal substrate having the deteriorated layer formed therein.
摘要翻译：一种分割具有与第一表面平行形成的第一表面和第二表面的非金属基板的方法，包括：劣化层形成步骤，用于通过施加沿分割线在非金属基板的内侧形成劣化层激光束，其能够从第一表面侧穿过非金属基板，其内部具有会聚点; 以及劣化层曝光步骤，用于通过研磨其中形成有劣化层的非金属基板的第一表面侧将劣化层暴露于第一表面。

35. 发明授权

US07141443B2 Semiconductor wafer dividing method utilizing laser beam 有权
标题翻译：采用激光束的半导体晶片分割方法
公开(公告)号：US07141443B2
公开(公告)日：2006-11-28
申请号：US10870053
申请日：2004-06-18
申请人： Yusuke Nagai , Satoshi Kobayashi
发明人： Yusuke Nagai , Satoshi Kobayashi
IPC分类号： H01L21/00
CPC分类号： B23K26/40 , B23K26/53 , B23K26/57 , B23K2101/40 , B23K2103/50
摘要： A method which can divide a semiconductor wafer sufficiently precisely along a street by use of a laser beam, while fully avoiding or suppressing contamination of circuits formed in rectangular regions on the face of the semiconductor water, and without causing chipping to the rectangular regions on the face. A laser beam is applied from beside one of the back and the face of a semiconductor substrate and focused onto the other of the back and the face of the semiconductor substrate, or the vicinity thereof, to partially deteriorate at least a zone ranging from the other of the back and the face of the semiconductor substrate to a predetermined depth.
摘要翻译：可以通过使用激光束沿着街道充分精确地分割半导体晶片的方法，同时完全避免或抑制在半导体水的表面上形成的矩形区域中形成的电路的污染，并且不会导致半导体晶片上的矩形区域的碎片面对。激光束从半导体衬底的背面和表面之一施加，并且聚焦到半导体衬底的背面和表面的另一个或其附近，以至少部分地劣化从另一个区域的半导体衬底的背面和表面到预定深度。

36. 发明授权

US07134942B2 Wafer processing method 有权
标题翻译：晶圆加工方法
公开(公告)号：US07134942B2
公开(公告)日：2006-11-14
申请号：US10936678
申请日：2004-09-09
申请人： Yusuke Nagai , Masashi Aoki , Hitoshi Hoshino
发明人： Yusuke Nagai , Masashi Aoki , Hitoshi Hoshino
IPC分类号： B24B1/00 , H01L21/463
CPC分类号： B24B37/042 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/78
摘要： A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of the back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.
摘要翻译：一种晶片处理方法，用于沿着分割线分割形成在由表面上形成为格子图案的分割线划分的多个区域中的光学器件的晶片，该分割线包括施加激光束的激光束施加步骤沿着分割线从其背面的一侧到晶片，以形成在后表面中具有预定深度的凹槽; 保护片固定步骤，将保护片固定在具有后表面的凹槽的晶片的前表面; 分割步骤，沿着所述凹槽分割具有固定在所述前表面上的所述保护片的所述晶片; 以及磨削步骤，在保护片固定在晶片上的状态下研磨沿着槽划分的晶片的背面，以去除凹槽。

37. 发明申请

US20060084239A1 Wafer dividing method 审中-公开
标题翻译：晶圆分割法
公开(公告)号：US20060084239A1
公开(公告)日：2006-04-20
申请号：US11246103
申请日：2005-10-11
申请人： Yusuke Nagai , Kentaro Iizuka
发明人： Yusuke Nagai , Kentaro Iizuka
IPC分类号： H01L21/78 , H01L21/301
CPC分类号： H01L21/6835 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/68336
摘要： A method of dividing a wafer having a plurality of dividing lines formed in a lattice pattern on the front surface, into individual chips along the dividing lines, the method comprising: a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines; a wafer supporting step for putting one surface side of the wafer on a support tape which is mounted on an annular frame and shrinks by an external stimulus; a wafer-dividing step for dividing the wafer along the dividing lines where the deteriorated layer has been formed by exerting external force to the wafer which has been put on the support tape; and a chip spacing formation step for shrinking the shrink area between the inner periphery of the annular frame and the area, to which the wafer is affixed, in the support tape affixed to the divided wafer, by exerting an external stimulus to the shrink area.
摘要翻译：一种将沿着分割线将具有以格状图案形成的多个分割线的晶片分割为分割线的各个芯片的方法，该方法包括：劣化层形成步骤，用于在晶片内部形成劣化层通过施加能够沿分割线穿过晶片的激光束; 用于将晶片的一个表面侧放置在安装在环形框架上并通过外部刺激收缩的支撑带上的晶片支撑步骤; 晶片分割步骤，用于通过对已经放置在支撑带上的晶片施加外力沿着已经形成有劣化层的分割线分割晶片; 以及芯片间隔形成步骤，用于通过向收缩区域施加外部刺激，将环形框架的内周边和晶片固定到的区域之间的收缩区域收缩在固定到分割晶片的支撑带中。

38. 发明申请

US20050259459A1 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US20050259459A1
公开(公告)日：2005-11-24
申请号：US11128197
申请日：2005-05-13
申请人： Yusuke Nagai , Toshiyuki Tateishi , Tadato Nagasawa
发明人： Yusuke Nagai , Toshiyuki Tateishi , Tadato Nagasawa
IPC分类号： B23K26/00 , B23K26/40 , B23K101/40 , B28D5/00 , G11C5/06 , H01L21/301 , H01L21/68 , H01L21/78
CPC分类号： H01L21/78 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/68336 , Y10T225/12
摘要： A method of dividing a wafer having a plurality of first dividing lines and a plurality of second dividing lines intersecting with the first dividing lines formed on the surface of the wafer along the first dividing lines and the second dividing lines, which comprises an internal deteriorated layer forming step for forming a deteriorated layer in the inside of the water along the first dividing lines and the second dividing lines by applying a laser beam along the first dividing lines and the second dividing lines; an intersection deteriorated layer forming step for forming a deteriorated layer thicker than the deteriorated layer formed in the internal deteriorated layer forming step by applying a laser beam to intersection areas between the first dividing lines and the second dividing lines; and a dividing step for dividing the wafer into individual chips along the first dividing lines and the second dividing lines by exerting external force to the wafer.
摘要翻译：一种分割具有多个第一分割线和多条第二分割线的晶片的方法，该晶片具有与形成在晶片表面上的第一分割线相交的第一分割线和第二分割线，该第一分割线包括内部劣化层通过沿着第一分割线和第二分割线施加激光束，沿着第一分割线和第二分割线在水的内部形成劣化层的形成步骤; 交叉劣化层形成步骤，用于通过对第一分割线和第二分割线之间的交叉区域施加激光来形成比内部劣化层形成步骤中形成的劣化层更厚的劣化层; 以及分割步骤，通过向晶片施加外力，将晶片沿着第一分割线和第二分割线分割成单独的芯片。

39. 发明申请

US20050090077A1 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US20050090077A1
公开(公告)日：2005-04-28
申请号：US10968100
申请日：2004-10-20
申请人： Yusuke Nagai , Masuru Nakamura , Satoshi Kobayashi , Yukio Morishige
发明人： Yusuke Nagai , Masuru Nakamura , Satoshi Kobayashi , Yukio Morishige
IPC分类号： B23K26/00 , B23K26/40 , B23K101/40 , B28D5/00 , H01L21/301 , H01L21/304 , H01L21/78 , H01L21/46
CPC分类号： H01L21/3043 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the wafer along the dividing lines; an extensible protective tape affixing step for affixing an extensible protective tape to one side of the wafer before or after the deteriorated layer forming step; and a dividing step for dividing the wafer along the deteriorated layers by expanding the protective tape affixed to the wafer after the deteriorated layer forming step.
摘要翻译：一种沿着预定分割线分割晶片的方法，包括以下步骤：劣化层形成步骤，用于施加能够沿着分割线穿过晶片的脉冲激光束，以沿着分割线在晶片内部形成劣化层 ; 用于将可延伸保护带固定在劣化层形成步骤之前或之后的晶片的一侧的可延伸的保护带固定步骤; 以及分割步骤，用于通过在劣化层形成步骤之后扩展固定在晶片上的保护带，沿着劣化层分割晶片。

40. 发明申请

US20050061788A1 Laser beam machine 审中-公开
标题翻译：激光束机
公开(公告)号：US20050061788A1
公开(公告)日：2005-03-24
申请号：US10938724
申请日：2004-09-13
申请人： Yusuke Nagai , Satoshi Kobayashi
发明人： Yusuke Nagai , Satoshi Kobayashi
IPC分类号： B23K26/06 , B23K26/00 , B23K26/14 , B23K26/40 , B23K26/42 , B23Q11/14 , G02B7/00 , H01L21/78
CPC分类号： G02B7/008 , B23K26/40 , B23K26/703 , B23K2103/50
摘要： A laser beam machine comprising a workpiece holding means for holding a workpiece and a laser beam application means comprising a condenser for applying a laser beam to the workpiece held on the workpiece holding means, wherein the machine further comprises thermostatic means for maintaining the temperature of a case for housing the condenser lenses of the condenser constant.
摘要翻译：一种激光束机，包括用于保持工件的工件保持装置和激光束施加装置，该激光束施加装置包括用于将激光束施加到被保持在工件保持装置上的工件的冷凝器，其中该机器还包括恒温装置，用于容纳聚光镜的聚光镜的情况恒定。

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