专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US5233221A Electronic substrate multiple location conductor attachment technology 失效
标题翻译：电子基板多位导体附着技术
公开(公告)号：US5233221A
公开(公告)日：1993-08-03
申请号：US736090
申请日：1991-07-26
申请人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
发明人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498 , H05K3/40
CPC分类号： H01L24/86 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4084
摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.
摘要翻译：一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。另一个支撑带在接触位置处具有窗口。导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

32. 发明授权

US5132351A Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent 失效
标题翻译：包含金属盐，聚苯醚和溶剂的化学焊料
公开(公告)号：US5132351A
公开(公告)日：1992-07-21
申请号：US728865
申请日：1991-07-11
申请人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
发明人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
IPC分类号： B23K1/00 , B23K35/22 , B23K35/34 , B23K101/40 , H05K3/10 , H05K3/34
CPC分类号： B23K35/34 , H05K3/3484 , H05K2203/121 , H05K3/105 , Y10T29/49169
摘要： A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal.A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

33. 发明授权

US5120418A Lead frame plating apparatus for thermocompression bonding 失效
标题翻译：用于热塑性接合的导线框架镀膜设备
公开(公告)号：US5120418A
公开(公告)日：1992-06-09
申请号：US664388
申请日：1991-03-04
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separatre independently powered anodes, is provided.
摘要翻译：用于集成电路封装中的热压接的接触构件在导体端具有均匀的织构可变形层，硬度值在Knoop尺度上大约为90的软金的范围内，粗糙的表面形态具有大约 1微米调制频率和脊之间的深度为平均集成电路板的1/4至1/2。可变形层通过在0.03-0.05mA / sq.cm范围内的强电负电镀浴中镀金而制成。当前密度。提供了用于电镀不同区域的电镀装置，具有不同的电负性条件，具有独立供电的阳极。

34. 发明授权

US5117275A Electronic substrate multiple location conductor attachment technology 失效
标题翻译：电子基板多位置导线器附件技术
公开(公告)号：US5117275A
公开(公告)日：1992-05-26
申请号：US602837
申请日：1990-10-24
申请人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
发明人： Mark F. Bregman , Raymond R. Horton , Alphonso P. Lanzetta , Ismail C. Noyan , Michael J. Palmer , Ho-Ming Tong
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498 , H01L23/50 , H05K3/40
CPC分类号： H01L24/86 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4084 , Y10T29/49142 , Y10T29/49153 , Y10T29/53235
摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

35. 发明授权

US5052606A Tape automated bonding feeder 失效
标题翻译：胶带自动接合给料机
公开(公告)号：US5052606A
公开(公告)日：1991-10-01
申请号：US546496
申请日：1990-06-29
申请人： Thomas M. Cipolla , Raymond R. Horton , Alphonso P. Lanzetta , Michael J. Palmer , Mark B. Ritter
发明人： Thomas M. Cipolla , Raymond R. Horton , Alphonso P. Lanzetta , Michael J. Palmer , Mark B. Ritter
IPC分类号： H01L21/60 , H01L21/00
CPC分类号： H01L21/67144 , H01L21/67132 , Y10T156/1734
摘要： A hitch feeder for a TAB tape is described which comprises: a stationary jas assembly having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly which includes a lower movable gripper positioned below the tape and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly. A feed control is operative when the movable gripping assembly moves towards the stationary jaw assembly, to move the gripper jaws to grip the tape and to open the opposing jaws, and is further operative when the movable gripper assembly moves away from the stationary jaw assembly, to move the gripper jaws away from the tape and to close the opposing jaws.

36. 发明授权

US4832255A Precision solder transfer method and means 失效
标题翻译：精密焊接传输方式和手段
公开(公告)号：US4832255A
公开(公告)日：1989-05-23
申请号：US223818
申请日：1988-07-25
申请人： Harry R. Bickford , Kurt R. Grebe , Caroline A. Kovac , Michael J. Palmer
发明人： Harry R. Bickford , Kurt R. Grebe , Caroline A. Kovac , Michael J. Palmer
IPC分类号： B23K3/06 , B23K35/14 , B23K35/40 , H01L21/60 , H05K3/04 , H05K3/34 , H05K13/04
CPC分类号： H01L24/27 , B23K3/06 , H05K13/0465 , H05K3/3473 , H05K3/3478 , H01L2224/13111 , H01L2224/29111 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/1579 , H05K2203/0108 , H05K2203/0338 , H05K2203/043 , H05K2203/0528 , H05K2203/0726 , H05K2203/1105 , H05K3/046 , Y10T29/49204 , Y10T29/4921 , Y10T29/49213
摘要： This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

37. 发明申请

US20090256099A1 GATE VALVE WITH EQUALIZER PORT 有权
标题翻译：带平衡口的门阀
公开(公告)号：US20090256099A1
公开(公告)日：2009-10-15
申请号：US12102168
申请日：2008-04-14
申请人： Michael J. Palmer
发明人： Michael J. Palmer
IPC分类号： F16K3/00
CPC分类号： F16K3/0209 , F16K3/029 , F16K3/314 , F16K39/04 , Y10T137/86509 , Y10T137/86831 , Y10T137/86936 , Y10T137/8696 , Y10T137/87378 , Y10T137/87491
摘要： A gate valve has a gate movable between open and closed positions within a valve body, and walls in the gate defining an equalizer port between opposite sides of the gate. The equalizer port is adapted and arranged to be shiftable by actuation of the gate between closed and opened positions and between opened and closed positions.
摘要翻译：闸阀具有可在阀体内的打开和关闭位置之间移动的闸门，并且闸门中的壁限定在闸门的相对侧之间的均衡器端口。均衡器端口被适配和布置成可以通过在关闭位置和打开位置之间以及在打开位置和关闭位置之间的门的致动来移动。

38. 发明授权

US06467001B1 VLSI chip macro interface 失效
标题翻译： VLSI芯片宏接口
公开(公告)号：US06467001B1
公开(公告)日：2002-10-15
申请号：US09374222
申请日：1999-08-13
申请人： Mandy Alexander Gray , Michael J. Palmer , Ian David Judd
发明人： Mandy Alexander Gray , Michael J. Palmer , Ian David Judd
IPC分类号： G06F1336
CPC分类号： H04L49/101
摘要： The present invention provides a method and a system for connecting together, in a VLSI chip, a plurality of macros which require data flow connections between each other. A simple standard interface is realised between all macros. Any number of macros can be connected together, also allowing concurrent transactions between 4 or more macros using a cross-bar switch. Each macro may be a master (capable of requesting connections), a slave (capable of receiving connections from a master) or both. The centralised inter-connect logic includes three major components: the cross-bar switch, which makes the connections between the macros, the address decoder, which determines which slave each master wishes to connect to and an arbiter, which arbitrates between the macros when two or more masters request a connection simultaneously.
摘要翻译：本发明提供了一种用于在VLSI芯片中将需要相互数据流连接的多个宏连接在一起的方法和系统。所有宏之间实现简单的标准接口。任何数量的宏都可以连接在一起，也允许使用交叉开关的4个或更多宏之间的并发事务。每个宏可以是主（能够请求连接），从机（能够从主机接收连接）或两者。集中式互连逻辑包括三个主要部分：交叉开关，它们使得宏之间的连接，地址解码器确定每个主机希望连接的从属和仲裁器，它们在宏之间进行仲裁或更多的主人同时请求连接。

39. 发明授权

US5968054A Compressible structure clamping and cutting 失效
标题翻译：可压缩结构夹紧和切割
公开(公告)号：US5968054A
公开(公告)日：1999-10-19
申请号：US22061
申请日：1998-02-11
申请人： Stanley D. Yeatts, II , Michael J. Palmer
发明人： Stanley D. Yeatts, II , Michael J. Palmer
IPC分类号： A61B17/42 , A61B17/10 , A61B17/12 , A61B17/122 , A61B17/128 , A61B17/32
CPC分类号： A61B17/122 , A61B17/128 , A61B17/32 , A61B17/42 , A61B2017/1225
摘要： A device and method are provided for clamping and severing a compressible structure containing a fluid. A clamp having a pair of arms is secured in a clamped position about the structure so that the fluid between the arms is forced outward therefrom. A cutting assembly coupled to the clamp cuts through the pair of arms while in the clamped position to form first and second separated clamps that remain in the clamped position. As a result, the structure is severed and clamped without fluid discharge.
摘要翻译：提供了用于夹紧和切断包含流体的可压缩结构的装置和方法。具有一对臂的夹具被固定在围绕结构的夹紧位置，使得臂之间的流体从其向外被强制向外。耦合到夹具的切割组件在处于夹紧位置时切穿该对臂，以形成保持在夹紧位置的第一和第二分离的夹具。结果，结构被切断并夹紧而没有流体排放。

40. 发明授权

US5593083A Castellated nozzle and method of use therof 失效
标题翻译： Castellated喷嘴和使用方法
公开(公告)号：US5593083A
公开(公告)日：1997-01-14
申请号：US388327
申请日：1995-02-14
申请人： Bernie Hernandez , Raymond R. Horton , Michael J. Palmer , Frederick G. Weindelmayer
发明人： Bernie Hernandez , Raymond R. Horton , Michael J. Palmer , Frederick G. Weindelmayer
IPC分类号： H01L21/60 , H05K3/36 , H05K3/40 , H05K3/34
CPC分类号： H01L24/86 , H05K3/363 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K2201/0394 , H05K2201/09709 , H05K2201/10477 , H05K2201/10681 , H05K2203/0195 , H05K2203/167 , H05K3/4084
摘要： A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row. A channel is formed adjacent to at least one castellation. The first and second plurality of castellations are arranged in a staggered format wherein at a first point along the length of the opening one of the castellations in the first row is located opposite to one of the channels of the second row, and wherein at a second point along the length of the opening one of the channels in the first row is located opposite to one of the castellations in the second row. An opening is formed between the first and second row. The castellated nozzle includes a hole for aligning the castellated nozzle to a flexible circuit carrier.
摘要翻译：一种用于将多个微电子引线连接到相关联的多个接触焊盘的雉形喷嘴及其使用方法。所述雉形喷嘴包括具有从其突出的多个蓖耳体的主体，其中每个所述雉ations都具有接触表面。形成与多个城堡中的至少一个城堡相邻的通道。开口延伸穿过主体，用于在其中引入加热的气体。多个城堡的接触表面与相应的多个引线对准。典型地，雉形喷嘴包括形成第一排的第一多个雉ell和形成第二排的第二多个雉。。与至少一个城堡相邻形成通道。第一和第二多个城堡以交错格式布置，其中沿着开口的长度的第一点处，第一行中的一个雉is位于与第二排的通道之一相对的位置，并且其中在第二沿着开口的长度，第一行中的通道之一位于与第二排中的一个城堡相对的位置。在第一排和第二排之间形成开口。雉形喷嘴包括用于将雉形喷嘴对准柔性电路载体的孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式