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    • 34. 发明授权
    • Dynamic memory
    • 动态内存
    • US5642326A
    • 1997-06-24
    • US534558
    • 1995-09-27
    • Kiyofumi SakuraiSatoru TakaseMasaki Ogihara
    • Kiyofumi SakuraiSatoru TakaseMasaki Ogihara
    • G11C11/407G11C7/22G11C8/18G11C11/4076G11C11/409G11C7/00
    • G11C11/4076G11C7/22G11C8/18
    • A dynamic memory comprises a control circuit for controlling the selection of the row decoder and the activation of the sense amplifiers in accordance with a RAS signal externally supplied thereto and a word line control circuit for controlling a selected word line to turn the electric potentials read out from the memory cells connected to the word line on the bit lines connected to the respective memory cells back to an inactive level after the electric potentials are sensed and amplified by the sense amplifiers corresponding to the respective bit lines during the time period from the time when the RAS signal is turned to an active level and the time when it is turned back to the inactive level. A dynamic memory has gate oxide films are designed to be subjected to a less electric field strength in order to minimize the degradation of reliability and the memory can effectively reduce the fall of the word line driving stepped-up voltage to eliminate the necessity of a leak current compensation circuit. Additionally, the memory reduces the time required to restore the electric potentials for a data reading operation and also the cycle time required for a data writing operation.
    • 动态存储器包括控制电路,用于根据外部提供给它的+ E,ovs RAS + EE信号和用于控制选定字线的字线控制电路来控制行解码器的选择和感测放大器的激活 将连接到各个存储器单元的位线上连接到字线的存储单元读出的电位在由该位线对应的读出放大器在 从+ E,ovs RAS + EE信号变为有效电平的时间段和其回到无效电平的时间。 具有栅极氧化膜的动态存储器被设计为经受较少的电场强度以便最小化可靠性的劣化,并且存储器可以有效地减少字线驱动升压电压的下降以消除泄漏的必要性 电流补偿电路。 此外,存储器减少了恢复数据读取操作的电位所需的时间以及数据写入操作所需的周期时间。
    • 36. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08743587B2
    • 2014-06-03
    • US13197050
    • 2011-08-03
    • Satoru Takase
    • Satoru Takase
    • G11C11/00G11C11/36
    • G11C13/0007G11C8/005G11C11/5685G11C13/0033G11C13/0069G11C14/00G11C16/3431G11C2211/5641
    • According to one embodiment, a semiconductor memory device includes first cells, first lines, second lines, a first cell array, and a signal driver. The first cell has in either a first state or a second state. Retention time in the second state is longer than in the first state. The first cell array has the first cells formed in a matrix the individuals. The first cells are electrically connected by the first, second lines. The signal driver drives the first cells. The signal driver causes the first cells to transition to either the first state or the second state by controlling any one of a voltage, a current, and a charge amount applied to the first cells, or a combination of these, and waveforms of the voltage, current, and charge amount and/or the length of transfer time of at least one of the voltage, current, and charge amount.
    • 根据一个实施例,半导体存储器件包括第一单元,第一行,第二行,第一单元阵列和信号驱动器。 第一个单元格处于第一状态或第二状态。 处于第二状态的保持时间长于第一状态。 第一个单元阵列具有在矩阵中形成的第一个单元。 第一个单元通过第一个第二行电连接。 信号驱动器驱动第一个单元。 信号驱动器通过控制施加到第一单元的电压,电流和电荷量中的任何一个或这些的组合以及电压的波形来使第一单元转变到第一状态或第二状态 ,电流,电荷量和/或电压,电流和电荷量中的至少一个的传输时间长度。
    • 37. 发明授权
    • Semiconductor storage device
    • 半导体存储设备
    • US08040715B2
    • 2011-10-18
    • US12609617
    • 2009-10-30
    • Satoru Takase
    • Satoru Takase
    • G11C11/00
    • G11C8/08G11C5/02G11C8/10G11C13/00G11C13/0004G11C13/0011G11C13/0028G11C13/0069G11C2013/009G11C2213/71G11C2213/72
    • Plural memory cell arrays laminated on the semiconductor substrate each includes a plurality of first wirings and second wirings formed to intersect with each other. The control circuit provides, in a non-selected second memory cell array that shares the first wiring with a selected first memory cell array, and a non-selected third memory cell array located more distant from the first memory cell array than the second memory cell array, the first potential to all of the first wirings and all of the second wirings. It also provides, in a non-selected fourth memory cell array that shares the second wiring with the first memory cell array and a non-selected fifth memory cell array located more distant from the first memory cell array than the fourth memory cell array, the second potential to all of the first wirings and all of the second wirings.
    • 层叠在半导体基板上的多个存储单元阵列各自包括形成为彼此交叉的多个第一布线和第二布线。 控制电路在与所选择的第一存储单元阵列共享第一布线的未选择的第二存储单元阵列中提供位置比第二存储单元更远离第一存储单元阵列的未选择的第三存储单元阵列 阵列,所有的第一个布线和所有第二个布线的第一个潜力。 它还在与第一存储单元阵列共享第二布线的未选择的第四存储单元阵列和位于比第四存储单元阵列更远离第一存储单元阵列的未选择的第五存储单元阵列中, 所有第一条布线和所有第二条布线的第二个潜力。
    • 38. 发明申请
    • RESISTANCE CHANGE MEMORY DEVICE
    • 电阻变化存储器件
    • US20110103130A1
    • 2011-05-05
    • US12987201
    • 2011-01-10
    • Satoru Takase
    • Satoru Takase
    • G11C11/00G11C8/08
    • G11C13/0007G11C7/12G11C13/0023G11C13/0026G11C13/0038G11C13/0069G11C2013/0088G11C2213/32G11C2213/71G11C2213/72H01L27/101
    • A resistance change memory device including: a cell array having a resistance change type of memory cells disposed at the cross-points of word lines and bit lines, the resistance value of the memory cell being reversibly settable; a word line driver circuit configured to apply a selecting drive voltage to one selected in the word lines; and a bit line driver circuit configured to drive multiple bit lines in such a manner that a set mode and a reset mode are set simultaneously for multiple memory cells selected by the selected word line, the set mode being for changing a selected memory cell from a first resistance state into a second resistance state while the reset mode is for changing a selected memory cell from the second resistance state into the first resistance state.
    • 一种电阻变化存储装置,包括:具有设置在字线和位线的交叉点的存储单元的电阻变化型的单元阵列,可逆地设定存储单元的电阻值; 字线驱动器电路,被配置为向所述字线中选择的一个施加选择驱动电压; 以及位线驱动电路,其被配置为以这样的方式驱动多个位线,使得对于由所选择的字线选择的多个存储器单元同时设置设置模式和复位模式,所述设置模式用于将选择的存储器单元从 第一电阻状态变为第二电阻状态,而复位模式用于将所选择的存储单元从第二电阻状态改变为第一电阻状态。
    • 39. 发明授权
    • Resistance change memory device
    • 电阻变化记忆装置
    • US07885121B2
    • 2011-02-08
    • US12245152
    • 2008-10-03
    • Satoru Takase
    • Satoru Takase
    • G11C16/06
    • G11C13/0007G11C7/12G11C13/0023G11C13/0026G11C13/0038G11C13/0069G11C2013/0088G11C2213/32G11C2213/71G11C2213/72H01L27/101
    • A resistance change memory device including: a cell array having a resistance change type of memory cells disposed at the cross-points of word lines and bit lines, the resistance value of the memory cell being reversibly settable; a word line driver circuit configured to apply a selecting drive voltage to one selected in the word lines; and a bit line driver circuit configured to drive multiple bit lines in such a manner that a set mode and a reset mode are set simultaneously for multiple memory cells selected by the selected word line, the set mode being for changing a selected memory cell from a first resistance state into a second resistance state while the reset mode is for changing a selected memory cell from the second resistance state into the first resistance state.
    • 一种电阻变化存储装置,包括:具有设置在字线和位线的交叉点的存储单元的电阻变化型的单元阵列,可逆地设定存储单元的电阻值; 字线驱动器电路,被配置为向所述字线中选择的一个施加选择驱动电压; 以及位线驱动电路,其被配置为以这样的方式驱动多个位线,使得对于由所选择的字线选择的多个存储器单元同时设置设置模式和复位模式,所述设置模式用于将选择的存储器单元从 第一电阻状态变为第二电阻状态,而复位模式用于将所选择的存储单元从第二电阻状态改变为第一电阻状态。