会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明授权
    • Copying machine
    • 复印机
    • US5822672A
    • 1998-10-13
    • US711602
    • 1996-09-10
    • Akiyoshi JohdaiAkira OhhataHiroki YamashitaHirokazu MatsuoYoshihito Hirano
    • Akiyoshi JohdaiAkira OhhataHiroki YamashitaHirokazu MatsuoYoshihito Hirano
    • B65H5/02B65H7/20G03G15/00
    • G03G15/60G03G2215/00185G03G2215/0032Y10S271/902
    • A copying machine having a two-in-one copying mode comprises a document feeder means 65, 75 and three conveying means 90, 95, 101. The feeder means 65, 75 feeds a document toward a glass platen 29 one by one to stop the document at a first-out position. The first conveying means 90 conveys the document fed by the feeder means 65, 75 onto the glass platen. The second conveying means 95 conveys the document conveyed by the first conveying means 90 along the glass platen 29 until the rear end of the document reaches at a predetermined switch-back position, then conveys the document to the opposite direction to retreat a predetermined distance, and then conveys the document as well as a succeeding document stopped at the first-out position such that the front end of the document situated on a downstream side of the document conveying direction may be aligned with a exposure reference SP, and then discharging the documents to the downstream side of the document conveying direction after exposure. The third conveying means 101 for conveying the documents discharged by the second conveying means 95 from the glass platen 29 to a discharge section 115.
    • 具有二合一复印模式的复印机包括文件馈送装置65,75和三个传送装置90,91,101。馈送装置65,75将文件一个接一个地朝向玻璃台板29送出,以停止 以先到先得的位置记录。 第一传送装置90将由馈送装置65,75馈送的文件传送到玻璃台板上。 第二输送装置95沿着玻璃压板29输送由第一输送装置90输送的原稿,直到文件的后端到达预定的切换位置,然后将文件传送到相反的方向以退回预定的距离, 然后传送原稿以及在首出位置停止的后续文件,使得位于文件传送方向的下游侧的文档的前端可以与曝光参考SP对准,然后排出文档 到曝光后文件传送方向的下游侧。 用于将由第二输送装置95排出的原稿从玻璃压板29输送到排出部115的第三输送装置101。
    • 33. 发明授权
    • Semiconductor integrated circuit memory
    • 半导体集成电路存储器
    • US4954866A
    • 1990-09-04
    • US247250
    • 1988-09-21
    • Hirotoshi TanakaHiroki YamashitaNoboru MasudaJunji ShigetaYasunari UmemotoOsamu Kagaya
    • Hirotoshi TanakaHiroki YamashitaNoboru MasudaJunji ShigetaYasunari UmemotoOsamu Kagaya
    • H01L27/06H01L27/105H01L27/11
    • H01L27/1104H01L27/0605H01L27/1116H01L27/105
    • A semiconductor integrated circuit memory is disclosed in which a first impurity-doped layer for making circuit elements such as MESFET's and a second impurity-doped layer opposite in conductivity type to the first impurity-doped layer are formed in a semi-insulating substrate in such a manner that the second impurity-doped layer is formed under and between circuit elements for making up a memory cell array part and a peripheral circuit part, and is divided into at least first and second regions. For example, the first region formed under and between the circuit elements of the memory cell array part is made of a P-type layer which is high in carrier density, and the second region formed under and between the circuit elements of the peripheral circuit part is made of a P-type layer which is low in carrier density. The high carrier-density P-type layer formed under the memory cell array part allows a memory cell having a minimum critical charge for alpha-particles to gain satisfactory alpha-particle immunity even when the memory cell is made fine in size. Further, the low carrier-density P-type layer formed under the peripheral circuit part having a critical charge larger than that of the memory cell can improve the alpha-particle immunity of the peripheral circuit part and can suppress an increase in parasitic capacitance at the peripheral circuit part to maintain the high-speed operation of the memory.
    • 公开了一种半导体集成电路存储器,其中在半绝缘衬底中形成用于制造电路元件的第一杂质掺杂层,例如MESFET和与第一杂质掺杂层的导电类型相反的第二杂质掺杂层 第二杂质掺杂层形成在用于构成存储单元阵列部分的电路元件和外围电路部分之间的方式,并且被划分为至少第一和第二区域。 例如,形成在存储单元阵列部分的电路元件之下和之间的第一区域由载流子密度高的P型层制成,并且第二区域形成在外围电路部分的电路元件之下 由载流子浓度低的P型层构成。 形成在存储单元阵列部分下方的高载流子密度P型层允许具有最小临界电荷的存储单元获得满意的α粒子免疫,即使当存储单元的尺寸精细时。 此外,形成在具有大于存储单元的临界电荷的外围电路部分下的低载流子密度P型层可以改善外围电路部分的α粒子免疫力,并且可以抑制在外部电路部分的寄生电容的增加 外围电路部分保持高速运行的内存。
    • 34. 发明授权
    • Optical communication device
    • 光通信设备
    • US08445832B2
    • 2013-05-21
    • US13201212
    • 2009-03-05
    • Takashi TakemotoHiroki YamashitaTatsuya Saito
    • Takashi TakemotoHiroki YamashitaTatsuya Saito
    • H03F3/08H01J43/00H01J40/14G01R19/00
    • H03F3/087H03F1/223H03F1/34H03F3/082H03F3/3022H03F3/505H03F2200/453H04B10/6933
    • An optical communication device which can be operated at high speed is provided. For example, the optical communication device includes: a pre-amplifier circuit PREAMP1 amplifying a current signal Iin from a photodiode PD, and converting an amplified signal into a voltage signal; and an operating-point controller circuit VTCTL1 controlling an operation of the PREAMP1. The PREAMP1 includes a negative feedback path formed by a feedback resistance Rf1, and includes: a level-shift circuit LS1 level-shifting in accordance with an operating-point control signal Vcon; and an amplifier circuit AMP1 connected to a subsequent stage of the LS1 and performing an amplifying operation with a high gain. The VTCTL1 includes a replica circuit configured by the same circuit and circuit parameter as those of the AMP1 and electrically connected between the input and the output, and generates the Vcon so that an output DC level of this replica circuit is matched with an input DC level of the AMP1.
    • 提供可以高速运转的光通信装置。 例如,光通信装置包括:前置放大器电路PREAMP1,放大来自光电二极管PD的电流信号Iin,将放大后的信号变换为电压信号; 以及控制PREAMP1的操作的操作点控制器电路VTCTL1。 PREAMP1包括由反馈电阻Rf1形成的负反馈路径,并且包括:根据工作点控制信号Vcon的电平移位电路LS1电平移位; 以及连接到LS1的后级并且以高增益进行放大操作的放大器电路AMP1。 VTCTL1包括由与AMP1相同的电路和电路参数配置的电路复用电路,并且电连接在输入和输出端之间,并产生Vcon,使得该复制电路的输出直流电平与输入直流电平相匹配 的AMP1。
    • 38. 发明授权
    • Amplifier circuit
    • 放大器电路
    • US07714644B2
    • 2010-05-11
    • US12166666
    • 2008-07-02
    • Takashi TakemotoHiroki YamashitaTatsuya Saito
    • Takashi TakemotoHiroki YamashitaTatsuya Saito
    • H03F1/02
    • H03F3/45475H03F1/26H03F1/34H03F3/45085H03F3/45183H03F3/45968H03F2200/372H03F2200/375H03F2203/45534
    • An amplifier circuit block and a compensation circuit block are provided. The amplifier circuit block includes an analog adder for subtracting an output signal of the compensation circuit block from an input signal and an amplifier circuit operating in a wide band. The compensation circuit block includes an amplifier circuit with a low offset voltage and a low noise in a low frequency region, an analog adder block for subtracting an output signal of the amplifier circuit from an output signal of the amplifier circuit and generating a differential signal thereof, and a feedback circuit block for negatively feeding back the differential signal to the analog adder. The amplifier circuit block can reduce the offset voltage and the low-band noise by the negative feedback of the differential signal, and at the same time, the operation band of the entire amplifier circuit can be decided by the characteristic of the amplifier circuit.
    • 提供放大器电路块和补偿电路块。 放大器电路块包括用于从输入信号中减去补偿电路块的输出信号的模拟加法器和在宽带中工作的放大器电路。 补偿电路块包括在低频区域具有低失调电压和低噪声的放大器电路,用于从放大器电路的输出信号中减去放大器电路的输出信号并产生其差分信号的模拟加法器块 以及用于将差分信号负反馈给模拟加法器的反馈电路块。 放大器电路块可以通过差分信号的负反馈来减小偏移电压和低带噪声,同时整个放大器电路的工作频带可以由放大器电路的特性决定。
    • 39. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体存储器件及其制造方法
    • US20090194807A1
    • 2009-08-06
    • US11870839
    • 2007-10-11
    • Wakako TakeuchiHiroshi AkahoriHiroki Yamashita
    • Wakako TakeuchiHiroshi AkahoriHiroki Yamashita
    • H01L29/792H01L21/762
    • H01L27/115H01L27/11521H01L29/42336H01L29/66825H01L29/7881
    • A semiconductor memory device includes: a semiconductor substrate; an element isolation trench formed on the semiconductor substrate so as to surround an element region in which a memory element is to be formed; a first gate insulating film formed on the element region of the semiconductor substrate; a charge storing layer formed on the first gate insulating film; a second gate insulating film formed on the charge storing layer; a control electrode formed on the second gate insulating film; an impurity diffusion layer formed in a surface layer of the semiconductor substrate along a channel direction of the charge storing layer; a sidewall oxide film formed on a side surface of the element isolation trench; and an element isolation insulating film formed so as to fill the element isolation trench together with the element isolation insulation film; wherein the top surface of the sidewall oxide film is flush with or above the top surface of the first gate insulating film.
    • 半导体存储器件包括:半导体衬底; 元件隔离沟槽,形成在所述半导体衬底上,以围绕要形成存储元件的元件区域; 形成在所述半导体基板的所述元件区域上的第一栅极绝缘膜; 形成在所述第一栅极绝缘膜上的电荷存储层; 形成在所述电荷存储层上的第二栅极绝缘膜; 形成在所述第二栅极绝缘膜上的控制电极; 形成在电荷存储层的沟道方向上的半导体衬底的表面层中的杂质扩散层; 形成在所述元件隔离沟槽的侧表面上的侧壁氧化膜; 以及形成为与元件隔离绝缘膜一起填充元件隔离沟槽的元件隔离绝缘膜; 其中所述侧壁氧化物膜的顶表面与所述第一栅极绝缘膜的顶表面齐平或高于所述第一栅极绝缘膜的顶表面。