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31. 发明授权

US07274565B2 Information processing unit and information processing related units 有权
标题翻译：信息处理单元和信息处理相关单位
公开(公告)号：US07274565B2
公开(公告)日：2007-09-25
申请号：US11410915
申请日：2006-04-26
申请人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
发明人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
IPC分类号： G06F1/16
CPC分类号： G06F1/1616 , E05B73/0005 , E05B73/0082 , G06F1/1632 , G06F1/1635 , G06F1/1656 , G06F1/266
摘要： A labor of disconnecting many cables is omitted even when carrying a file basestation with an external storage loaded together with a main body. An information processing unit comprises: a main body having a CPU, a keyboard and a display unit; a file basestation with an external storage, such as an FD•D or a CD ROM•D, loaded; and a portreplicator with many connectors loaded. Removal of the main body alone from the portreplicator can omit the labor of disconnecting many cables connected to the portreplicator.
摘要翻译：即使携带具有与主体一起加载的外部存储器的文件基站，也省略了断开许多电缆的工作。信息处理单元包括：具有CPU，键盘和显示单元的主体; 具有外部存储器的文件基站，例如FD.D或CD ROM.D，加载; 和一个具有许多连接器的portreplicator。主机从复印机中单独拆卸可以省去断开连接到复印机的许多电缆的工作。

32. 发明申请

US20060209510A1 Information processing unit and information processing related units 有权
公开(公告)号：US20060209510A1
公开(公告)日：2006-09-21
申请号：US11410915
申请日：2006-04-26
申请人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
发明人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
IPC分类号： G06F1/16
CPC分类号： G06F1/1616 , E05B73/0005 , E05B73/0082 , G06F1/1632 , G06F1/1635 , G06F1/1656 , G06F1/266
摘要： A labor of disconnecting many cables is omitted even when carrying a file basestation with an external storage loaded together with a main body. An information processing unit comprises: a main body having a CPU, a keyboard and a display unit; a file basestation with an external storage, such as an FD•D or a CD ROM•D, loaded; and a portreplicator with many connectors loaded. Removal of the main body alone from the portreplicator can omit the labor of disconnecting many cables connected to the portreplicator.

33. 发明授权

US07068503B2 Information processing unit and information processing related units 有权
标题翻译：信息处理单元和信息处理相关单位
公开(公告)号：US07068503B2
公开(公告)日：2006-06-27
申请号：US11011189
申请日：2004-12-15
申请人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
发明人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
IPC分类号： G06F1/16
CPC分类号： G06F1/1616 , E05B73/0005 , E05B73/0082 , G06F1/1632 , G06F1/1635 , G06F1/1656 , G06F1/266
摘要： A labor of disconnecting many cables is omitted even when carrying a file basestation with an external storage loaded together with a main body. An information processing unit comprises: a main body having a CPU, a keyboard and a display unit; a file basestation with an external storage, such as an FD•D or a CD ROM•D, loaded; and a portreplicator with many connectors loaded. Removal of the main body alone from the portreplicator can omit the labor of disconnecting many cables connected to the portreplicator.
摘要翻译：即使携带具有与主体一起加载的外部存储器的文件基站，也省略了断开许多电缆的工作。信息处理单元包括：具有CPU，键盘和显示单元的主体; 具有外部存储器的文件基站，例如FD.D或CD ROM.D，加载; 和一个具有许多连接器的portreplicator。主机从复印机中单独拆卸可以省去断开连接到复印机的许多电缆的工作。

34. 发明申请

US20050111171A1 Information processing unit and information processing related units 有权
标题翻译：信息处理单元和信息处理相关单位
公开(公告)号：US20050111171A1
公开(公告)日：2005-05-26
申请号：US11011189
申请日：2004-12-15
申请人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
发明人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
IPC分类号： G06F15/02 , E05B73/00 , G06F1/16 , G06F1/26 , G06F3/00
CPC分类号： G06F1/1616 , E05B73/0005 , E05B73/0082 , G06F1/1632 , G06F1/1635 , G06F1/1656 , G06F1/266
摘要： A labor of disconnecting many cables is omitted even when carrying a file basestation with an external storage loaded together with a main body. An information processing unit comprises: a main body having a CPU, a keyboard and a display unit; a file basestation with an external storage, such as an FD·D or a CD ROM·D, loaded; and a portreplicator with many connectors loaded. Removal of the main body alone from the portreplicator can omit the labor of disconnecting many cables connected to the portreplicator.
摘要翻译：即使携带具有与主体一起加载的外部存储器的文件基站，也省略了断开许多电缆的工作。信息处理单元包括：具有CPU，键盘和显示单元的主体; 具有外部存储器的文件基站，例如FD.D或CD ROM.D，加载; 和一个具有许多连接器的portreplicator。主机从复印机中单独拆卸可以省去断开连接到复印机的许多电缆的工作。

35. 发明授权

US06898078B2 Information processing unit and information processing related units 有权
标题翻译：信息处理单元和信息处理相关单位
公开(公告)号：US06898078B2
公开(公告)日：2005-05-24
申请号：US10178745
申请日：2002-06-25
申请人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
发明人： Hideki Kamimaki , Yukihide Inagaki , Tsuyoshi Nakagawa , Koichi Kimura , Hideaki Gemma , Hitoshi Kawaguchi
IPC分类号： G06F15/02 , E05B73/00 , G06F1/16 , G06F1/26 , G06F3/00
CPC分类号： G06F1/1616 , E05B73/0005 , E05B73/0082 , G06F1/1632 , G06F1/1635 , G06F1/1656 , G06F1/266
摘要： A labor of disconnecting many cables is omitted even when carrying a file basestation with an external storage loaded together with a main body. An information processing unit comprises: a main body having a CPU, a keyboard and a display unit; a file basestation with an external storage, such as an FD•D or a CD-ROM•D, loaded; and a portreplicator with many connectors loaded. Removal of the main body alone from the portreplicator or removal of the main body and the file basestation can omit the labor of disconnecting many cables connected to the portreplicator.
摘要翻译：即使携带具有与主体一起加载的外部存储器的文件基站，也省略了断开许多电缆的工作。信息处理单元包括：具有CPU，键盘和显示单元的主体; 具有外部存储器的文件基站，例如FD.D或CD-ROM.D，加载; 和一个具有许多连接器的portreplicator。主机单独从复印机拆卸或拆除主体和文件基站可以省去断开连接到复印机的许多电缆的工作。

36. 发明授权

US08592994B2 Semiconductor package, core layer material, buildup layer material, and sealing resin composition 有权
标题翻译：半导体封装，芯层材料，堆积层材料和密封树脂组合物
公开(公告)号：US08592994B2
公开(公告)日：2013-11-26
申请号：US12517551
申请日：2007-12-05
申请人： Kenya Tachibana , Masahiro Wada , Hitoshi Kawaguchi , Kensuke Nakamura
发明人： Kenya Tachibana , Masahiro Wada , Hitoshi Kawaguchi , Kensuke Nakamura
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , C08L63/00 , H01L23/293 , H01L23/3735 , H01L23/3737 , H01L23/49822 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/0271 , H05K3/305 , H05K3/4602 , H05K2201/068 , H05K2201/10674 , H05K2201/10977 , H01L2924/00 , H01L2224/0401
摘要： A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75° C. of the cured member is 15 to 35 ppm/° C., the glass transition temperature of at least one buildup layer is 170° C. or more, and the coefficient of linear expansion of at 25 to 75° C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination.
摘要翻译：倒装芯片半导体封装包括具有芯层和至少一个堆积层的电路板，通过金属凸块连接到电路板的半导体器件，以及由密封树脂组合物制成的封装在其间的固化构件半导体器件和电路板。固化部件的25〜75℃的线膨胀系数为15〜35ppm /℃，至少一层积层的玻璃化转变温度为170℃以上，线膨胀系数在平面方向上的至少一个堆积层的25〜75℃为25ppm以下。可以通过防止裂纹和抑制分层而提供高度可靠的倒装芯片半导体封装，堆积层材料，芯层材料和密封树脂组合物。

37. 发明授权

US08592256B2 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device 有权
标题翻译：电路板制造方法，半导体制造装置，电路板和半导体装置
公开(公告)号：US08592256B2
公开(公告)日：2013-11-26
申请号：US12526631
申请日：2008-02-08
申请人： Yoshitaka Okugawa , Keiichi Tsukurimichi , Hitoshi Kawaguchi
发明人： Yoshitaka Okugawa , Keiichi Tsukurimichi , Hitoshi Kawaguchi
IPC分类号： H01L23/28
CPC分类号： H05K3/0011 , H01L23/145 , H01L23/49827 , H01L24/73 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2924/01322 , H01L2924/15311 , H01L2924/181 , H05K1/0366 , H05K2203/1105 , Y10T29/41 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit board 11 with a thickness of 230 μm manufactured using a cyanate-based prepreg 12 containing a resin composition with which a glass cloth is impregnated is heated at a higher temperature than a glass transition temperature of the resin composition after it is cured before reflow processing.
摘要翻译：提供了一种电路板制造方法，其可以以稳定的方式制造下一代半导体器件并且提高二次安装处理期间的产量。使用含有浸渍有玻璃布的树脂组合物的含氰酸酯类的预浸料12制造厚度为230μm的电路基板11，比在回流固化后的树脂组合物的玻璃化转变温度高的温度下加热处理。

38. 发明申请

US20110128103A1 ELECTROMAGNETIC ACTUATOR 失效
标题翻译：电磁致动器
公开(公告)号：US20110128103A1
公开(公告)日：2011-06-02
申请号：US12674214
申请日：2007-09-26
申请人： Kazuhikio Baba , Hitoshi Kawaguchi , Toyoshi Nomura , Kazuhiro Nakane , Nobuo Kojima
发明人： Kazuhikio Baba , Hitoshi Kawaguchi , Toyoshi Nomura , Kazuhiro Nakane , Nobuo Kojima
IPC分类号： H01F7/129
CPC分类号： H01F7/1638 , H01F7/081 , H01F7/128 , H02K5/12 , H02K33/02
摘要： An object is to provide an electromagnetic actuator that is highly resistant to corrosion and also capable of having high suction power, even in a condition where part of the electromagnetic actuator touches a corrosive liquid. An electromagnetic actuator 50 according to this invention is incorporated into a device using a corrosive liquid 17. The electromagnetic actuator 50 is characterized by including a magnetic pole piece 1; an outer yoke 6; a bottom yoke 5; a bobbin coil 2; a stepped portion 6a that is formed on an outer surface of the outer yoke 6; a waterproof portion 8 that prevents the corrosive liquid 17 from entering at least where the bobbin coil 2 and the magnetic pole piece 1 are; a movable plate 12 that is placed in the corrosive liquid 17 to form a magnetic circuit together with the magnetic pole piece 1, the outer yoke 6, and the bottom yoke 5, The movable plate 12 is stored in a space 14 created either in the electromagnetic actuator 50 or between the device using the corrosive liquid 17 and the electromagnetic actuator 50. The outer yoke 6 is incorporated into the device using the corrosive liquid 17, on a reduced diameter side from the stepped portion 6a.
摘要翻译：本发明的目的是提供一种电磁致动器，该致动器高度耐腐蚀，并且即使在电磁致动器的一部分接触到腐蚀性液体的情况下也能够具有高吸力。根据本发明的电磁致动器50被结合到使用腐蚀性液体17的装置中。电磁致动器50的特征在于包括磁极片1; 外轭铁6; 底部轭5; 筒管线圈2; 形成在外轭铁6的外表面上的阶梯部分6a; 防止腐蚀性液体17至少进入到线圈架2和磁极片1的防水部8; 放置在腐蚀性液体17中以与磁极片1，外轭铁6和底轭5一起形成磁路的可动板12。可移动板12存储在空间14中，电磁致动器50或使用腐蚀性液体17和电磁致动器50的装置之间。外磁轭6使用腐蚀性液体17在与台阶部分6a缩径的一侧结合到装置中。

39. 发明申请

US20100258938A1 SUBSTRATE AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：基板和半导体器件
公开(公告)号：US20100258938A1
公开(公告)日：2010-10-14
申请号：US12742926
申请日：2007-12-05
申请人： Teppei Ito , Hitoshi Kawaguchi , Hiroyuki Tanaka
发明人： Teppei Ito , Hitoshi Kawaguchi , Hiroyuki Tanaka
IPC分类号： H01L23/498 , H05K1/03
CPC分类号： H05K1/0271 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/0224 , H05K3/4602 , H05K3/4682 , H05K2201/068 , H05K2201/09136 , H05K2201/09236 , H05K2201/09681 , H05K2201/09709 , H01L2924/00 , H01L2224/0401
摘要： A substrate (3) has a build-up layer in which insulating layers containing a resin and conductor interconnect layers (312) are alternately laminated and the conductor interconnect layers (312) are mutually connected through the conductor layer formed in a via-hole of the insulating layer. A conductor interconnect layer (312D) arranged on the outermost surface side of a substrate among the conductor interconnect layers (312) has a plurality of signal lines (312D1) formed in a signal line arrangement area (A) and extended in a predetermined direction. When αsig-x represents a coefficient of thermal expansion in a direction substantially parallel to the signal lines (312D1) in the signal line arrangement area (A) having the signal lines (312D1) as determined by a laser speckle method and αsig-y represents a coefficient of thermal expansion in a direction substantially orthogonal to the signal lines as determined by a laser speckle method, a dependence rate in the signal line direction of a coefficient of thermal expansion represented by the following equation is 25 or less. Dependence rate in the signal line direction of the coefficient of thermal expansion=(|αsig-y−αsig-x|/αsig-x)×100.
摘要翻译：基板（3）具有积层层，其中包含树脂和导体互连层（312）的绝缘层交替层叠，并且导体互连层（312）通过形成在通孔中的导体层相互连接绝缘层。布置在导体互连层（312）中的基板的最外表面侧的导体互连层（312D）具有形成在信号线布置区域（A）中并沿预定方向延伸的多条信号线（312D1）。当αsig-x表示与通过激光散斑法确定的具有信号线（312D1）的信号线配置区域（A）中的信号线（312D1）基本平行的方向的热膨胀系数，αsig-y表示通过激光散斑法确定的与信号线基本正交的方向的热膨胀系数，由下式表示的热膨胀系数的信号线方向的相关率为25以下。热膨胀系数的信号线方向的依赖率=（|αsig-y-αsig-x | /αsig-x）×100。

40. 发明申请

US20100032826A1 SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION 有权
标题翻译：半导体包装，核心层材料，建筑材料和密封树脂组合物
公开(公告)号：US20100032826A1
公开(公告)日：2010-02-11
申请号：US12517551
申请日：2007-12-05
申请人： Kenya Tachibana , Masahiro Wada , Hitoshi Kawaguchi , Kensuke Nakamura
发明人： Kenya Tachibana , Masahiro Wada , Hitoshi Kawaguchi , Kensuke Nakamura
IPC分类号： H01L23/48 , C08G18/77
CPC分类号： H01L21/563 , C08L63/00 , H01L23/293 , H01L23/3735 , H01L23/3737 , H01L23/49822 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/0271 , H05K3/305 , H05K3/4602 , H05K2201/068 , H05K2201/10674 , H05K2201/10977 , H01L2924/00 , H01L2224/0401
摘要： A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75° C. of the cured member is 15 to 35 ppm/° C., the glass transition temperature of at least one buildup layer is 170° C. or more, and the coefficient of linear expansion of at 25 to 75° C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination.
摘要翻译：倒装芯片半导体封装包括具有芯层和至少一个堆积层的电路板，通过金属凸块连接到电路板的半导体器件，以及由密封树脂组合物制成的封装在其间的固化构件半导体器件和电路板。固化部件的25〜75℃的线膨胀系数为15〜35ppm /℃，至少一层积层的玻璃化转变温度为170℃以上，线膨胀系数在平面方向上的至少一个堆积层的25〜75℃为25ppm以下。可以通过防止裂纹和抑制分层而提供高度可靠的倒装芯片半导体封装，堆积层材料，芯层材料和密封树脂组合物。

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