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31. 发明申请

US20050051810A1 Semiconductor package and method of manufacturing the same 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US20050051810A1
公开(公告)日：2005-03-10
申请号：US10968890
申请日：2004-10-21
申请人： Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人： Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
IPC分类号： H01L23/29 , H01L21/56 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/498 , H01L29/768
CPC分类号： H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
摘要翻译：半导体封装具有（a）封装基座，（b）形成在封装基座上并用于将半导体封装连接到另一器件的封装端子，（c）形成在封装基座上并电连接到封装端子的布线层，（d）安装在封装基板上并电连接到布线层的半导体芯片，（e）在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层，和 f）树脂模具密封封装基座，布线层，半导体芯片和低弹性树脂层。

32. 发明授权

US06322581B1 Suturing needle for medical use 有权
标题翻译：缝合针医疗用途
公开(公告)号：US06322581B1
公开(公告)日：2001-11-27
申请号：US09644745
申请日：2000-08-24
申请人： Masatoshi Fukuda , Masaaki Matsutani
发明人： Masatoshi Fukuda , Masaaki Matsutani
IPC分类号： A61B1706
CPC分类号： A61B17/06066 , A61B17/06004
摘要： The present invention relates to a suturing needle for medical use comprising a needle tip portion for piercing a body tissue, a distal end portion for coupling a suture and a body portion formed between the needle tip portion and the distal end portion The body portion is constituted of a pair of flat surfaces opposing to each other and a pair of grooves opposing to each other in a direction intersecting with the opposing direction of the flat surfaces.
摘要翻译：本发明涉及一种医疗用缝合针，包括用于穿刺身体组织的针尖部分，用于连接缝合线的前端部分和形成在针尖部分和远端部分之间的主体部分。主体部分构成一对彼此相对的平坦表面和在与平坦表面的相对方向相交的方向上彼此相对的一对槽。

33. 发明授权

US5327762A Rolling roller and rolling mill 失效
标题翻译：轧辊和轧机
公开(公告)号：US5327762A
公开(公告)日：1994-07-12
申请号：US970656
申请日：1992-11-02
申请人： Takashi Nagamine , Jun Furukawa , Masayoshi Matsuda , Misao Makinohara , Hiroatsu Asari , Masatoshi Fukuda , Ryoichi Yamase
发明人： Takashi Nagamine , Jun Furukawa , Masayoshi Matsuda , Misao Makinohara , Hiroatsu Asari , Masatoshi Fukuda , Ryoichi Yamase
IPC分类号： B21B27/02 , B21B31/18 , F16C1/14 , F16C1/22
CPC分类号： F16C1/14 , B21B27/028 , B21B31/18 , F16C1/22 , F16C1/223 , Y10T403/32426 , Y10T74/2045 , Y10T74/20462 , Y10T74/20654 , Y10T74/2066 , Y10T74/2151
摘要： The present invention provides a rolling roller for rolling steel sections and that can have the roller width changed while not having a drive mechanism for changing the roller width provided to the rolling roller itself, thereby having a simple structure that facilitates exchange, and also provides a rolling mill suitable for use with such a rolling roller. The rolling roller has rolling wheels on a roller shaft and a sleeve and that engage the sleeve with respect to the roller shaft. In addition, the sleeve and the roller shaft are tightened and engaged at a place other than the inner side of the roller wheel and oil injection to the place of tightening and engagement is performed via hydraulic fluid supply paths formed inside the roller shaft.
摘要翻译：本发明提供一种用于轧制钢部分的滚动辊，并且可以在不具有用于改变设置到滚动辊本身的辊宽度的驱动机构的同时改变辊宽度，从而具有便于更换的简单结构，并且还提供适用于这种轧辊的轧机。滚动辊在辊轴和套筒上具有滚轮，并且相对于辊轴接合套筒。此外，套筒和辊轴被紧固并接合在辊轮内侧以外的位置，并且通过形成在辊轴内部的液压流体供给路径进行注油到紧固和接合的位置。

34. 发明授权

US09362196B2 Semiconductor package and mobile device using the same 有权
标题翻译：半导体封装和移动设备使用相同
公开(公告)号：US09362196B2
公开(公告)日：2016-06-07
申请号：US13181737
申请日：2011-07-13
申请人： Keiju Yamada , Takashi Yamazaki , Masatoshi Fukuda , Yasuhiro Koshio
发明人： Keiju Yamada , Takashi Yamazaki , Masatoshi Fukuda , Yasuhiro Koshio
IPC分类号： H01L23/02 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/00
CPC分类号： H01L23/552 , H01L23/3114 , H01L23/3128 , H01L23/49805 , H01L23/49816 , H01L23/49827 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate. A part of the plural vias has a cutting plane exposing to the side surface of the interposer board and cut in a thickness direction of the interposer board. The cutting plane of the via is electrically connected to the conductive shielding layer.
摘要翻译：根据实施例，半导体封装包括安装在插入板上的半导体芯片，密封半导体芯片的密封剂以及覆盖密封剂的导电屏蔽层和插入板的侧表面的至少一部分。插入板具有通过绝缘基板的多个通路。多个通孔的一部分具有暴露于插入板的侧表面并在插入板的厚度方向上切割的切割平面。通孔的切割平面电连接到导电屏蔽层。

35. 发明授权

US08710654B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08710654B2
公开(公告)日：2014-04-29
申请号：US13477387
申请日：2012-05-22
申请人： Satoshi Tsukiyama , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
发明人： Satoshi Tsukiyama , Masatoshi Fukuda , Hiroshi Watabe , Keita Mizoguchi , Naoyuki Komuta
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L24/81 , H01L21/50 , H01L23/3128 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/14151 , H01L2224/14155 , H01L2224/14156 , H01L2224/14177 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81139 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/83104 , H01L2224/83815 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/01047 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.
摘要翻译：在一个实施例中，半导体器件包括堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片。第一和第二半导体芯片通过第一凸块连接部电连接。止动器突起和接合突起设置在第一和第二半导体芯片中的至少一个上。止动突起与未粘合状态的第一和第二半导体芯片中的另一个接触。接合突起接合到第一和第二半导体芯片。

36. 发明授权

US08710653B2 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent 有权
标题翻译：片上半导体器件包括具有含有胺系固化剂的树脂的底层填充层
公开(公告)号：US08710653B2
公开(公告)日：2014-04-29
申请号：US13397098
申请日：2012-02-15
申请人： Masatoshi Fukuda , Hiroshi Watabe
发明人： Masatoshi Fukuda , Hiroshi Watabe
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L21/563 , H01L23/3135 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1412 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81444 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06568 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.
摘要翻译：一种半导体器件，包括：布线基板，安装在布线基板上的层叠体，填充在层叠体的各半导体芯片之间的间隙中的底部填充层; 以及由在层叠体的外部被覆盖并形成的成型树脂等构成的成型体。底部填充层由含有胺类固化剂的树脂材料的固化物构成，固化物的Tg为65℃以上且100℃以下。

37. 发明授权

US08445321B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08445321B2
公开(公告)日：2013-05-21
申请号：US12887772
申请日：2010-09-22
申请人： Masatoshi Fukuda
发明人： Masatoshi Fukuda
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/81 , H01L23/3128 , H01L23/3171 , H01L23/562 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/0231 , H01L2224/0401 , H01L2224/04042 , H01L2224/11901 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13155 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48229 , H01L2224/731 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81007 , H01L2224/81065 , H01L2224/81097 , H01L2224/81194 , H01L2224/81815 , H01L2224/9212 , H01L2225/0651 , H01L2225/06513 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/3511 , H01L2224/81 , H01L2224/85 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a method of manufacturing a semiconductor device is disclosed. The method includes forming a cured film of an insulation resin on a surface of a first semiconductor chip and flip-chip bonding a second semiconductor via a bump on the first semiconductor chip on which the cured film of the insulation resin is formed. The insulation resin can be cured at temperature range from (A−50)° C. to (A+50)° C., wherein “A” is a solidification point of the bump.
摘要翻译：在一个实施例中，公开了制造半导体器件的方法。该方法包括在第一半导体芯片的表面上形成绝缘树脂的固化膜，并且在其上形成有绝缘树脂的固化膜的第一半导体芯片上经由凸块将第二半导体结合到第二半导体。绝缘树脂可以在（A-50）℃至（A + 50）℃的温度范围内固化，其中“A”是凸点的凝固点。

38. 发明申请

US20120001324A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120001324A1
公开(公告)日：2012-01-05
申请号：US13175247
申请日：2011-07-01
申请人： Hideo AOKI , Hideko Mukaida , Masatoshi Fukuda , Yasuhiro Koshio , Hiroshi Watabe
发明人： Hideo AOKI , Hideko Mukaida , Masatoshi Fukuda , Yasuhiro Koshio , Hiroshi Watabe
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L23/562 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/85375 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06572 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/0105 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/1033 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a semiconductor device includes a circuit substrate, and first and second semiconductor chips mounted on it. The first semiconductor chip and the second semiconductor chip are flip-chip connected, and an underfill resin is filled between them. The underfill resin has a fillet portion. A thickness T1 of the first semiconductor chip and a thickness T2 of the second semiconductor chip satisfy a relationship of T1/(T1+T2)≦0.6.
摘要翻译：在一个实施例中，半导体器件包括电路基板，以及安装在其上的第一和第二半导体芯片。第一半导体芯片和第二半导体芯片被倒装连接，并且在它们之间填充底部填充树脂。底部填充树脂具有圆角部分。第一半导体芯片的厚度T1和第二半导体芯片的厚度T2满足T1 /（T1 + T2）＆nlE; 0.6的关系。

39. 发明授权

US07883960B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07883960B2
公开(公告)日：2011-02-08
申请号：US12409979
申请日：2009-03-24
申请人： Masatoshi Fukuda , Akiyoshi Hatada , Katsuaki Ookoshi , Kenichi Okabe , Tomonari Yamamoto
发明人： Masatoshi Fukuda , Akiyoshi Hatada , Katsuaki Ookoshi , Kenichi Okabe , Tomonari Yamamoto
IPC分类号： H01L21/8234 , H01L21/8244 , H01L21/8242 , H01L21/336
CPC分类号： H01L27/0629
摘要： A method of manufacturing a semiconductor device includes forming a conductive layer over a semiconductor substrate, selectively removing the conductive layer for forming a resistance element and a gate electrode, forming sidewall spacers over sidewalls of the remaining conductive layer, forming a first insulating film containing a nitrogen over the semiconductor substrate having the sidewall spacers, implanting ions in the semiconductor substrate through the first insulating film, forming a second insulating film containing a nitrogen over the first insulating film after implanting ions in the semiconductor substrate through the first insulating film, and selectively removing the first and the second insulating film such that at least a part of the first and the second insulating films is remained over the semiconductor substrate and over the conductive layer.
摘要翻译：一种制造半导体器件的方法包括在半导体衬底上形成导电层，选择性地去除用于形成电阻元件和栅电极的导电层，在剩余导电层的侧壁上形成侧壁间隔物，形成第一绝缘膜，在具有侧壁间隔物的半导体衬底上的氮气，通过第一绝缘膜在半导体衬底中注入离子，在通过第一绝缘膜植入离子到半导体衬底中之后，在第一绝缘膜上形成含有氮的第二绝缘膜，并且选择性地去除第一和第二绝缘膜，使得第一和第二绝缘膜的至少一部分保留在半导体衬底上并在导电层上方。

40. 发明申请

US20100280535A1 Stripping Knife 有权
标题翻译：剥线刀
公开(公告)号：US20100280535A1
公开(公告)日：2010-11-04
申请号：US12597384
申请日：2008-04-25
申请人： Akio Yamaguchi , Masatoshi Fukuda , Masahiko Saito
发明人： Akio Yamaguchi , Masatoshi Fukuda , Masahiko Saito
IPC分类号： A61B17/32
CPC分类号： A61F9/0133 , A61B17/3211
摘要： [Problems] To ensure the sharpness of a stripping knife whereby a part of a living tissue is incised and stripped while preventing a cut along the thickness direction.[Means for Solving Problems] A stripping knife (A) having a plate-shaped blade (3) having an edge (1) around the periphery, a shank (5) connected to the blade (3), and a handle (7) holding the shank (5) in the integrated state, wherein the blade (3) is composed of the edge (1) formed at the front end and a guide face (2) which is formed between the edge (1) and the front face (3b) of the connected plate constituting the blade (3) and brought into contact with the surface (13) of the remaining tissue.
摘要翻译： [问题]为了确保剥离刀的清晰度，由此一边活动组织被切开并剥离，同时防止沿着厚度方向的切割。解决问题的手段具有围绕周边具有边缘（1）的板状刀片（3）的剥离刀（A），连接到刀片（3）的柄（5）和手柄（7）将所述柄（5）保持在一体状态，其中所述刀片（3）由形成在所述前端的边缘（1）和形成在所述边缘（1）和所述前表面（3）的连接板（3b）并与其余组织的表面（13）接触。

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