专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明专利

JP2014009890A Heat exchange member, radiant tube, and heat treat furnace including radiant tube 审中-公开
标题翻译：热交换器，辐射管和热处理炉，包括放射管
公开(公告)号：JP2014009890A
公开(公告)日：2014-01-20
申请号：JP2012147096
申请日：2012-06-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI , ODA TAKEHIRO
IPC分类号： F23C3/00
摘要： PROBLEM TO BE SOLVED: To provide a heat exchange member which inhibits the occurence of distortion etc. and maintains the reliability over a long time, and to provide a radiant tube and a heat treat furnace including the radiant tube.SOLUTION: A heat exchange member 10 includes: multiple tubular members 1 in which a fluid flows; and a connection member 2 which is connected with the tubular members 1 and has passages for flowing the fluid F flowing in the one tubular member 1a to the other tubular member 1b. In the connection member 2, at least a part of an outer surface between the one tubular member 1a and the other tubular member 1b is formed into a flat surface.
摘要翻译：要解决的问题：提供一种抑制变形等的发生并且长时间保持可靠性的热交换构件，并且提供包括辐射管的辐射管和热处理炉。解决方案：热交换构件 10包括：流体流动的多个管状构件1; 以及连接构件2，其与管状构件1连接并且具有用于使流过一个管状构件1a的流体F流动到另一个管状构件1b的通道。在连接构件2中，一个管状构件1a和另一个管状构件1b之间的外表面的至少一部分形成为平坦表面。

32. 发明专利

JP2013154361A Brazing filler metal, and joined body which is joined by using the same 有权
标题翻译：制动填充金属和加入体的相互接合
公开(公告)号：JP2013154361A
公开(公告)日：2013-08-15
申请号：JP2012015403
申请日：2012-01-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI
IPC分类号： B23K35/30 , B23K1/19 , B23K101/36 , C04B37/02 , C22C5/06 , H01M8/02 , H01M8/12
CPC分类号： Y02E60/525
摘要： PROBLEM TO BE SOLVED: To provide a brazing filler metal with less voids and having the high joining strength even when the brazing filler metal is exposed to not only the room temperature but also to high temperature, and a joined body which is joined by using the same.SOLUTION: The brazing filler metal includes a member to be joined which consists of a ceramic sintered body. The brazing filler metal is used for joining a plurality of members to be joined with each other. The brazing filler metal contains no copper, but metal components of at least one kind of reactive metal of silver, titanium, zirconium, hafnium, and niobium, and cobalt. The content of each metal component, by mass, to the total 100% is ≥90% for silver, ≥0.5% and ≤9.0% for reactive metal, ≥0.3% and ≤5.0% for cobalt.
摘要翻译：要解决的问题：即使当钎焊料不仅暴露于室温而且暴露于高温时，即使提供孔隙少且接合强度高的钎料，也可以使用接合体钎焊料包括由陶瓷烧结体组成的待接合部件。钎料用于连接多个待接合的构件。钎料不含铜，但金属成分为银，钛，锆，铪，铌和钴中的至少一种活性金属。每个金属组分的含量按质量计，总计为100％，银的≥90％，活性金属的≥0.5％和≤9.0％，钴的含量分别为≥0.3％和≤5.0％。

33. 发明专利

JP2006157258A Circularly polarized array antenna and radio system using same 有权
标题翻译：使用相同的圆形极化阵列天线和无线电系统
公开(公告)号：JP2006157258A
公开(公告)日：2006-06-15
申请号：JP2004342329
申请日：2004-11-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： MIYASATO KENTARO , UCHIMURA HIROSHI , SHINO NAOYUKI
IPC分类号： H01Q13/22 , H01Q21/08
摘要： PROBLEM TO BE SOLVED: To reduce an axial ratio and to expand a bandwidth in a circularly polarized array antenna in which a plurality of radiating elements are provided whose power is fed from a power feeder circuit.
SOLUTION: The array antenna has the plurality of radiating elements 1a, 1j, and a power feeding structure for feeding power to at least two radiating elements 1a, 1j from one power feeder circuit where both ends are terminated, and irradiates circularly polarized waves. A power feeder to the power feeder circuit 2 is positioned at an area to the power feeders to two radiating elements. When distance to the power feeder of the radiating element 1a provided at the nearest position from one termination section 2a of the power feeder circuit 2 is set to A, and distance to the power feeder to the radiating element provided at the nearest position from the other termination section 2b of the power feeder circuit 2 is set to B, the distance A differs from that B.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了减小轴向比并扩大其中提供多个辐射元件的圆极化阵列天线的带宽，其中功率由馈电电路供电。解决方案：阵列天线具有多个辐射元件1a，1j和用于从两端终止的一个馈电电路向至少两个辐射元件1a，1j供电的馈电结构，并且照射圆极化波浪。供电电路2的馈电器位于两个辐射元件的馈电线的区域。当设置在距离供电电路2的一个终端部分2a最近的位置处的辐射元件1a的供电器的距离设置为A，并且距离设置在距离另一个最近位置的辐射元件的馈电器的距离馈电电路2的终端部分2b被设置为B，距离A与B不同。版权所有（C）2006，JPO＆NCIPI

34. 发明专利

JP2006086808A Antenna module 审中-公开
标题翻译：天线模块
公开(公告)号：JP2006086808A
公开(公告)日：2006-03-30
申请号：JP2004269448
申请日：2004-09-16
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI
IPC分类号： H01Q23/00 , H01Q19/06
摘要： PROBLEM TO BE SOLVED: To provide an antenna module which reduces an influence over the generation of an unnecessary emission in the antenna module, which has excellent antenna characteristics and which reduces an interference during wiring and the malfunction of a circuit.
SOLUTION: The antenna module includes an antenna substrate 3 which has a single or a plurality of antenna elements 6 provided on one surface or in the interior of an insulating substrate, and which carries a semiconductor element 7 connected with the antenna element 6 in the other surface of the insulating substrate 3; and a module substrate 4 which mounts the antenna substrate 4. The signal radiated or received by the antenna element 6 is an analog signal. A signal exchanged between the antenna substrate 3 and the module substrate 4 is a digital signal.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种天线模块，其减小对天线模块中产生不必要的发射的影响，其具有优异的天线特性，并且减少了布线期间的干扰和电路的故障。解决方案：天线模块包括天线基板3，其具有设置在绝缘基板的一个表面或内部的单个或多个天线元件6，并且其携带与天线元件6连接的半导体元件7 在绝缘基板3的另一个表面上; 以及安装天线基板4的模块基板4.由天线元件6辐射或接收的信号是模拟信号。在天线基板3和模块基板4之间交换的信号是数字信号。版权所有（C）2006，JPO＆NCIPI

35. 发明专利

JP2005159767A Branch structure of waveguide structural body and antenna substrate 有权
标题翻译：波导结构体和天线基板的分支结构
公开(公告)号：JP2005159767A
公开(公告)日：2005-06-16
申请号：JP2003396131
申请日：2003-11-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI , UCHIMURA HIROSHI
IPC分类号： H01P3/12 , H01P5/12 , H01Q21/08
摘要： PROBLEM TO BE SOLVED: To provide a branch structure in a compact waveguide structural body having excellent transmission characteristics and a waveguide power distributing function. SOLUTION: A second waveguide structural body 1 is overlapped and arranged at the end of a first waveguide structural body 2 so that the transmission direction of high-frequency signals becomes orthogonal, and coupling windows 3 are formed on each of waveguide walls of the overlapped site. A thin portion 5 in which the distance between the wall surface on which the coupling window 3 is formed near the portion of overlapping the second waveguide 1 and the wall surface opposing this is smaller than the distance of the other portion is provided, and the waveguide structural body 1 is disposed so that the center of the transmission direction of the thin portion 5 is deviated from the center of the coupling window 3. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有优异的传输特性和波导功率分配功能的紧凑型波导结构体中的分支结构。解决方案：第二波导结构体1重叠并布置在第一波导结构体2的端部，使得高频信号的传输方向变为正交，并且耦合窗口3形成在每个波导壁上重叠的网站。提供了薄壁部分5，其中形成接合窗口3的壁表面之间的距离与重叠第二波导1的部分相邻的壁面与与其相反的壁面之间的距离小于另一部分的距离，并且波导结构体1被设置成使得薄壁部分5的传播方向的中心偏离联接窗口3的中心。（C）2005，JPO＆NCIPI

36. 发明专利

JP2005051331A Coupling structure between microstrip line and dielectric waveguide 有权
标题翻译： MICROSTRIP线和介质波导之间的耦合结构
公开(公告)号：JP2005051331A
公开(公告)日：2005-02-24
申请号：JP2003203402
申请日：2003-07-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI , UCHIMURA HIROSHI
IPC分类号： H01P5/107
摘要： PROBLEM TO BE SOLVED: To provide a coupling structure between a dielectric waveguide and a microstrip line at a low conversion loss that can easily be manufactured by multilayer technologies of prior arts and to provide a filter board or an antenna board with a coupling structure with a low conversion loss.
SOLUTION: The structure is used to couple the microstrip line 7 to the dielectric waveguide 6 provided with a pair of major conductor layers sandwiching a dielectric layer and formed in parallel, and two columns of a via-hole group formed to electrically connect the conductor layers at the interval of a cut-off wavelength in a signal transmission direction. Further, in the structure, a transmission via-hole 11 is extended into the dielectric waveguide 6 via an opening 14 provided to the major conductor layer of the dielectric waveguide 6 from the end of the microstrip line 7, and a conductor pattern 12 in parallel with the major conductor layers is formed to the other end of the transmission via-hole 11.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供可以容易地通过现有技术的多层技术制造的低转换损耗的介电波导和微带线之间的耦合结构，并且提供具有耦合的滤波器板或天线板具有低转换损耗的结构。解决方案：该结构用于将微带线7耦合到电介质波导6，该电介质波导6设置有夹在介质层上并平行形成的一对主导体层，以及形成为电连接的两列通孔组导体层以信号传输方向上的截止波长的间隔。此外，在该结构中，透射通孔11经由从微带线7的端部设置到电介质波导6的主导体层的开口14延伸到电介质波导6中，并且导体图案12并联主导体层形成在传输通孔11的另一端。（C）2005年，JPO和NCIPI

37. 发明专利

JPH11135661A PACKAGE FOR HIGH FREQUENCY ELEMENT 失效
公开(公告)号：JPH11135661A
公开(公告)日：1999-05-21
申请号：JP30092897
申请日：1997-10-31
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , NANJIYOU HIDEHIRO , ARIKAWA HIDEHIRO
IPC分类号： H01L23/12 , H01L23/02 , H01L23/04 , H01L23/08
摘要： PROBLEM TO BE SOLVED: To provide a package for high frequency element which is superior in airthight sealing properties and electromagnetic wave sealing properties in which the size can be reduced, while suppressing signal transmission losses. SOLUTION: This package for high frequency element comprises an insulating ceramic substrate 1, a wiring layer 2 of thin Au film formed on the surface of the substrate 1 and connected with a high frequency element 7, an insulating cover 5A bonded through glass 4 to the surface of the substrate 1 at a position intersecting a part of the wiring layer 2 in order to seal high frequency element 7 hermetically, and a metallic cover 5B fixed to the surface of the substrate 1, while covering the cover 5A with an opening 5B' being made at a part where the thin film wiring layer 2 is formed on the surface of the substrate 1. The largest diameter of the opening 5B' in the metallic cover 5B is set equal to or sorter than 1/2 the wavelength of a signal which propagating through the thin wiring layer 2. Furthermore, dielectric constant of the glass 4 and the insulating cover 5A is set less than 15 and the difference of coefficient of thermal expansion is set less than 1.2×10 / deg.C among the substrate 1, the glass 4, and the insulating cover 5A.

38. 发明专利

JPH1174397A PACKAGE FOR HOUSING HIGH FREQUENCY ELEMENT 失效
公开(公告)号：JPH1174397A
公开(公告)日：1999-03-16
申请号：JP23121897
申请日：1997-08-27
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , NANJIYOU HIDEHIRO , ARIKAWA HIDEHIRO , FUJII MIKIO
IPC分类号： H01L23/12 , H01L23/02 , H01L23/08 , H01L23/10 , H01L23/15
摘要： PROBLEM TO BE SOLVED: To provide a package for housing a high frequency element capable of reducing signal transmission loss, improving an airtight sealing property and being miniaturized. SOLUTION: This package is provided with an insulating ceramic substrate 1, a thin film wiring layer 2 formed on a substrate surface, connected to the high frequency element and composed of Au capable of transmitting high frequency signals, and an insulating cover body 5 joined by glass 4 at a position crossing with the wiring layer 2 on the surface of the ceramic substrate 1 for airtightly sealing the high frequency element inside. In this case, control is performed so as to make the dielectric constant of the glass 4 for joining and the dielectric constant of the insulating cover body be less than 15, and to make both of thermal expansion differences between the ceramic substrate 1 and the glass 4, and between the insulating cover body 5 and the glass 4 be less than 1.2×10 / deg.C. Also, it is desirable that the insulating ceramic substrate 1 is composed of a multi-layer wiring board composed of alumina ceramics whose alumina content is more than 98% for which a power supply layer is formed inside.

39. 发明专利

JPH10130049A COLORED ALUMINOUS SINTERED COMPACT AND ITS PRODUCTION 失效
公开(公告)号：JPH10130049A
公开(公告)日：1998-05-19
申请号：JP28700796
申请日：1996-10-29
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , ARIKAWA HIDEHIRO
IPC分类号： C04B35/10 , C04B35/111 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a colored aluminous sintered compact having an easily distinguishable blackish color without deteriorating electrical characteristics peculiar to an aluminous sintered compact as the insulating substrate of a multilayer circuit board, package for housing semiconductor device, etc., in a high frequency region. SOLUTION: A compact consisting of 0.05-5wt.% (expressed in terms of oxide) Nb or Nb compd., 0.02-5wt.% (expressed in terms of oxide) at least one among Y, Yb and their compds. and the balance Al2 O3 is fired in a reducing atmosphere to obtain the objective colored aluminous sintered compact consisting of 0.05-5wt.% (expressed in terms of oxide) Nb, 0.02-5wt.% (expressed in terms of oxide) at least one of Y and Yb and the balance Al2 O3 with inevitable impurities.

40. 发明专利

JPH10112513A PACKAGE FOR STORING SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH10112513A
公开(公告)日：1998-04-28
申请号：JP26575696
申请日：1996-10-07
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , ARIKAWA HIDEHIRO
IPC分类号： C04B35/111 , H01L23/02 , H01L23/04 , H01L23/08 , H01L23/10
摘要： PROBLEM TO BE SOLVED: To reduce signal transmission loss and to maintain the transmission efficiency of a signal to be high as a package, especially in the high-frequency region of a terminal fitting member for storing semiconductor element for storing the semiconductor element of a high frequency semiconductor element and an element for optical communication as a package. SOLUTION: The package is composed of a metal frame body 3 for forming a dead space storing the semiconductor element inside, a metal substrate 4 to which the metal frame body 3 is fitted and a terminal fitting member 5, fitted to the metal frame body 3 or the metal substrate 4. In such a case, a wiring layer 6 leading from the inner side of the metal frame body 3, constituting the terminal fitting member 5 to an outer side, is formed by a sintered body containing not less than 99.0wt.% of Al2 O3 as a ceramic member 7 which is electrically insulated from the metal frame body 3 and/or the metal substrate 4.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式