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    • 32. 发明授权
    • Light emitting device
    • 发光装置
    • US08530913B2
    • 2013-09-10
    • US13019681
    • 2011-02-02
    • Yukie NishikawaTakashi KataokaHironori YamasakiHisashi MoriKazunari Yabe
    • Yukie NishikawaTakashi KataokaHironori YamasakiHisashi MoriKazunari Yabe
    • H01L33/00H01L33/60
    • H01L33/22H01L33/325H01L33/405
    • According to one embodiment, a light emitting device includes a light emitting layer, a first electrode, a first and second layers, and a cladding layer. The first layer has a first impurity concentration of a first conductivity type, and allows a carrier to be diffused in the light emitting layer. The second layer has a second impurity concentration of the first conductivity type higher than the first impurity concentration, and includes a first and second surfaces. The first surface is with the first layer. The second surface has a formation region and a non-formation region of the first electrode. The non-formation region includes convex structures with an average pitch not more than a wavelength of the emission light. The cladding layer is provided between the first layer and the light emitting layer and has an impurity concentration of the first conductivity type.
    • 根据一个实施例,发光器件包括发光层,第一电极,第一和第二层以及包层。 第一层具有第一导电类型的第一杂质浓度,并允许载体在发光层中扩散。 第二层具有高于第一杂质浓度的第一导电类型的第二杂质浓度,并且包括第一和第二表面。 第一个表面是第一个表面。 第二表面具有第一电极的形成区域和非形成区域。 非形成区域包括平均间距不大于发射光波长的凸结构。 包覆层设置在第一层和发光层之间,并且具有第一导电类型的杂质浓度。
    • 33. 发明申请
    • LIGHT EMITTING DEVICE
    • 发光装置
    • US20120025233A1
    • 2012-02-02
    • US13019681
    • 2011-02-02
    • Yukie NishikawaTakashi KataokaHironori YamasakiHisashi MoriKazunari Yabe
    • Yukie NishikawaTakashi KataokaHironori YamasakiHisashi MoriKazunari Yabe
    • H01L33/14H01L33/30
    • H01L33/22H01L33/325H01L33/405
    • According to one embodiment, a light emitting device includes a light emitting layer, a first electrode, a first and second layers, and a cladding layer. The first layer has a first impurity concentration of a first conductivity type, and allows a carrier to be diffused in the light emitting layer. The second layer has a second impurity concentration of the first conductivity type higher than the first impurity concentration, and includes a first and second surfaces. The first surface is with the first layer. The second surface has a formation region and a non-formation region of the first electrode. The non-formation region includes convex structures with an average pitch not more than a wavelength of the emission light. The cladding layer is provided between the first layer and the light emitting layer and has an impurity concentration of the first conductivity type.
    • 根据一个实施例,发光器件包括发光层,第一电极,第一和第二层以及包层。 第一层具有第一导电类型的第一杂质浓度,并允许载体在发光层中扩散。 第二层具有高于第一杂质浓度的第一导电类型的第二杂质浓度,并且包括第一和第二表面。 第一个表面是第一个表面。 第二表面具有第一电极的形成区域和非形成区域。 非形成区域包括平均间距不大于发射光波长的凸结构。 包覆层设置在第一层和发光层之间,并且具有第一导电类型的杂质浓度。
    • 37. 发明授权
    • Method of producing a surface-treated copper foil
    • 表面处理铜箔的制造方法
    • US06579437B2
    • 2003-06-17
    • US09769251
    • 2001-01-26
    • Masakazu MitsuhashiTakashi KataokaNaotomi Takahashi
    • Masakazu MitsuhashiTakashi KataokaNaotomi Takahashi
    • C25D550
    • C25D1/04C23C28/00C25D3/565C25D5/16C25D5/48H05K3/384H05K3/389H05K2201/0355H05K2203/0307H05K2203/0723H05K2203/1105Y10T428/12431Y10T428/12549Y10T428/12569
    • An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards which has been subjected to nodular treatment and anti-corrosion treatment of a surface of a copper foil, wherein the anti-corrosion treatment includes forming a zinc or zinc alloy plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the zinc or zinc alloy plating layer; forming a chromic-ion-containing silane coupling agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.
    • 本发明的目的是提供一种表面处理铜箔,其能够一致地获得在由铜箔制备的铜图案上测量的耐盐酸降解的剥离强度的百分比损失为10%以下,并且线宽为 通过排出镀锌或镀锌合金的防腐铜箔中所用的硅烷偶联剂的最大效果,可以得到0.2mm。 另一个目的是赋予表面处理铜箔优异的耐湿性,耐热性和长期保存稳定性。 为了达到上述目的,本发明提供一种表面处理铜箔,用于制造已对铜箔表面进行结节处理和防腐蚀处理的印刷线路板,其中防腐蚀处理包括形成 锌或锌合金镀层在铜箔的表面上; 在锌或锌合金镀层上形成电解铬酸盐层; 在电解铬酸盐层上形成含铬离子的硅烷偶联剂吸附层; 并将铜箔干燥2-6秒,使铜箔达到105℃-200℃。