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    • 32. 发明授权
    • Forming surface features using self-assembling masks
    • 使用自组装掩模形成表面特征
    • US07828986B2
    • 2010-11-09
    • US11926722
    • 2007-10-29
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • B44C1/22H01L21/302
    • H01L21/0337B81C1/00031B81C2201/0149B81C2201/0198H01L21/0271H01L21/0332
    • A method. A combination is provided of a block copolymer and additional material. The copolymer includes a first block of a first polymer covalently bonded to a second block of a second polymer. The additional material is miscible with the first polymer. The first polymer includes polystyrene and the second polymer includes poly(ethylene oxide). A first layer including polydimethylglutarimide is adhered onto a surface of a substrate including a dielectric coated silicon wafer. A film is formed of the combination directly onto a surface of the first layer. Nanostructures of the additional material self-assemble within the first polymer block. The film and the first layer are simultaneously etched. The nanostructures have an etch rate lower than an etch rate of the block copolymer and lower than an etch rate of the first layer. Portions of the film are removed. Features remain on the surface of the first layer.
    • 一个方法。 提供了一种嵌段共聚物和另外的材料的组合。 共聚物包括共价键合到第二聚合物的第二嵌段的第一聚合物的第一嵌段。 附加材料与第一聚合物混溶。 第一聚合物包括聚苯乙烯,第二聚合物包括聚(环氧乙烷)。 包括聚二甲基戊二酰亚胺的第一层粘附到包括电介质涂覆的硅晶片的基材的表面上。 该组合物直接由第一层的表面形成。 附加材料的纳米结构在第一聚合物嵌段内自组装。 同时蚀刻膜和第一层。 纳米结构的蚀刻速率低于嵌段共聚物的蚀刻速率,并且低于第一层的蚀刻速率。 部分电影被删除。 特征保留在第一层的表面上。
    • 35. 发明授权
    • Methods of forming topographical features using segregating polymer mixtures
    • 使用分离聚合物混合物形成地形特征的方法
    • US08734904B2
    • 2014-05-27
    • US12957008
    • 2010-11-30
    • Joy ChengHayato NamaiCharles Thomas RettnerDaniel Paul SandersRatnam Sooriyakumaran
    • Joy ChengHayato NamaiCharles Thomas RettnerDaniel Paul SandersRatnam Sooriyakumaran
    • B81C1/00B82Y40/00H01L21/027
    • B81C1/00031B81C2201/0149H01L21/0337H01L21/0338
    • Methods are disclosed for forming topographical features. In one method, a pre-patterned structure is provided which comprises i) a support member having a surface and ii) an element for topographically guiding segregation of a polymer mixture including a first polymer and a second polymer, the element comprising a feature having a sidewall adjoined to the surface. The polymer mixture is disposed on the pre-patterned structure, wherein the disposed polymer mixture has contact with the sidewall and the surface. The first polymer and the second polymer are segregated in a plane parallel to the surface, thereby forming a segregated structure comprising a first polymer domain and a second polymer domain. The first polymer domain and/or the second polymer domain are lithographically patterned, thereby forming topographical features comprising at least one of i) a first feature comprising a lithographically patterned first polymer domain and ii) a second feature comprising a lithographically patterned second polymer domain.
    • 公开了形成形貌特征的方法。 在一种方法中,提供预先图案化的结构,其包括i)具有表面的支撑构件和ii)用于拓扑地引导包括第一聚合物和第二聚合物的聚合物混合物的偏析的元件,所述元件包括具有 侧壁与表面相邻。 聚合物混合物设置在预图案化结构上,其中所设置的聚合物混合物与侧壁和表面接触。 第一聚合物和第二聚合物在平行于表面的平面中分离,从而形成包含第一聚合物结构域和第二聚合物结构域的分离结构。 第一聚合物结构域和/或第二聚合物结构域被光刻图案化,从而形成包括以下至少一个的拓扑特征:i)包含光刻图案化的第一聚合物结构域的第一特征和ii)包含光刻图案化的第二聚合物结构域的第二特征。
    • 39. 发明申请
    • METHOD OF FORMING SEMICONDUCTOR STRUCTURES WITH CONTACT HOLES
    • 形成具有接触角的半导体结构的方法
    • US20120028476A1
    • 2012-02-02
    • US12846020
    • 2010-07-29
    • Wai-Kin LiWu-Song HuangJoy ChengKuang-Jung Chen
    • Wai-Kin LiWu-Song HuangJoy ChengKuang-Jung Chen
    • H01L21/312
    • H01L21/0337H01L21/0338
    • Embodiments of the present invention provide a method of forming a semiconductor structure. The method includes forming a set of shapes on top of a substrate; applying a layer of copolymer covering the substrate; causing the copolymer to form a plurality of cylindrical blocks both inside and outside the shapes; forming a pattern of contact holes from the plurality of cylindrical blocks; and transferring the pattern of contact holes to the substrate to form the semiconductor structure. In one embodiment, the shapes are rings and forming the set of shapes includes forming a set of rings that are equally and squarely spaced. In another embodiment, causing the copolymer to form the plurality of cylindrical blocks includes forming only one cylindrical block inside each of the rings and only one cylindrical block outside every four (4) squarely neighboring rings.
    • 本发明的实施例提供一种形成半导体结构的方法。 该方法包括在衬底的顶部上形成一组形状; 涂覆覆盖基材的共聚物层; 使共聚物在形状内部和外部形成多个圆柱形块; 从所述多个圆柱形块形成接触孔的图案; 并将接触孔的图案转移到衬底以形成半导体结构。 在一个实施例中,形状是环,并且形成一组形状包括形成均匀且平直间隔的一组环。 在另一个实施方案中,使共聚物形成多个圆柱形块包括仅在每个环内形成一个圆柱形块,并且在每四(4)个正方形相邻的环周围仅形成一个圆柱形块。
    • 40. 发明授权
    • Method of forming semiconductor structures with contact holes
    • 形成具有接触孔的半导体结构的方法
    • US09449822B2
    • 2016-09-20
    • US12846020
    • 2010-07-29
    • Wai-Kin LiWu-Song HuangJoy ChengKuang-Jung Chen
    • Wai-Kin LiWu-Song HuangJoy ChengKuang-Jung Chen
    • H01L21/033
    • H01L21/0337H01L21/0338
    • Embodiments of the present invention provide a method of forming a semiconductor structure. The method includes forming a set of shapes on top of a substrate; applying a layer of copolymer covering the substrate; causing the copolymer to form a plurality of cylindrical blocks both inside and outside the shapes; forming a pattern of contact holes from the plurality of cylindrical blocks; and transferring the pattern of contact holes to the substrate to form the semiconductor structure. In one embodiment, the shapes are rings and forming the set of shapes includes forming a set of rings that are equally and squarely spaced. In another embodiment, causing the copolymer to form the plurality of cylindrical blocks includes forming only one cylindrical block inside each of the rings and only one cylindrical block outside every four (4) squarely neighboring rings.
    • 本发明的实施例提供一种形成半导体结构的方法。 该方法包括在衬底的顶部上形成一组形状; 涂覆覆盖基材的共聚物层; 使共聚物在形状内部和外部形成多个圆柱形块; 从所述多个圆柱形块形成接触孔的图案; 并将接触孔的图案转移到衬底以形成半导体结构。 在一个实施例中,形状是环,并且形成一组形状包括形成均匀且平直间隔的一组环。 在另一个实施方案中,使共聚物形成多个圆柱形块包括仅在每个环内形成一个圆柱形块,并且在每四(4)个正方形相邻的环周围仅形成一个圆柱形块。