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31. 发明授权

US07985975B2 Light emitting package and light emitting package array formed by coupled electrodes 有权
标题翻译：由耦合电极形成的发光封装和发光封装阵列
公开(公告)号：US07985975B2
公开(公告)日：2011-07-26
申请号：US12805404
申请日：2010-07-29
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body-including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体 - 包括其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从第一电极突出的第一电极所述封装主体以及与所述封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

32. 发明授权

US07888689B2 Light emitting package and light emitting package array 有权
标题翻译：发光封装和发光封装阵列
公开(公告)号：US07888689B2
公开(公告)日：2011-02-15
申请号：US11798390
申请日：2007-05-14
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体，其包括具有其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从所述发光器件突出的第一电极封装主体和与封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

33. 发明授权

US07535942B2 Semiconductor laser device including a light shield plate, semiconductor laser device package, and methods of manufacturing the same 失效
标题翻译：包括遮光板，半导体激光器件封装的半导体激光器件及其制造方法
公开(公告)号：US07535942B2
公开(公告)日：2009-05-19
申请号：US11907879
申请日：2007-10-18
申请人： Han-youl Ryu , Hyung-kun Kim
发明人： Han-youl Ryu , Hyung-kun Kim
IPC分类号： H01S3/09 , H01S5/00
CPC分类号： H01S5/02212 , H01S5/005 , H01S5/021 , H01S5/0213 , H01S5/2027 , H01S5/22 , H01S5/32341
摘要： Provided is a semiconductor laser device, a semiconductor laser device package including the semiconductor laser device and methods of manufacturing the same. A semiconductor laser device may include a light emission structure including a first clad layer, an active layer and a second clad layer sequentially deposited on a substrate, a submount to which the light emission structure bonded, and a light shield plate in the submount, wherein the light shield plate blocks an end of the substrate on a light emission face of the light emission structure and blocks light leaked through the end of the substrate.
摘要翻译：提供一种半导体激光器件，包括半导体激光器件的半导体激光器器件封装及其制造方法。半导体激光器件可以包括发光结构，其包括顺序地沉积在衬底上的第一覆盖层，有源层和第二覆盖层，接合发光结构的基座以及基座中的遮光板，其中遮光板在发光结构的发光面上阻挡基板的一端，并且阻挡通过基板的端部泄漏的光。

34. 发明申请

US20080113462A1 Method of manufacturing vertical light emitting device 有权
标题翻译：制造垂直发光装置的方法
公开(公告)号：US20080113462A1
公开(公告)日：2008-05-15
申请号：US11882259
申请日：2007-07-31
申请人： Hyun-soo Kim , Kyoung-kook Kim , Hyung-kun Kim , Kwang-ki Choi , Jeong-wook Lee
发明人： Hyun-soo Kim , Kyoung-kook Kim , Hyung-kun Kim , Kwang-ki Choi , Jeong-wook Lee
IPC分类号： H01L21/02
CPC分类号： H01L33/0079 , H01L33/44
摘要： Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.
摘要翻译：提供一种垂直发光装置的制造方法。制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层，有源层和p型半导体层的发射层，形成将发光层划分成发光器件的第一沟槽其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度，在发射层上形成钝化层，在p型半导体层上形成p型电极发射层，在钝化层和p型电极上形成金属支撑层，去除衬底，当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分，形成n型电极，并且切割金属支撑层以将发光层划分为发光器件单元。

35. 发明申请

US20070267637A1 Light emitting package and light emitting package array 有权
标题翻译：发光封装和发光封装阵列
公开(公告)号：US20070267637A1
公开(公告)日：2007-11-22
申请号：US11798390
申请日：2007-05-14
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体，其包括具有其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从所述发光器件突出的第一电极封装体，以及与封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

36. 发明申请

US20060249744A1 Submount for light emitting device 失效
标题翻译：发光装置底座
公开(公告)号：US20060249744A1
公开(公告)日：2006-11-09
申请号：US11372204
申请日：2006-03-10
申请人： Hyung-kun Kim , Su-hee Chae , Tae-hoon Jang
发明人： Hyung-kun Kim , Su-hee Chae , Tae-hoon Jang
IPC分类号： H01L33/00
CPC分类号： H01L23/15 , H01L23/49811 , H01L23/49838 , H01L33/62 , H01L2224/10175
摘要： A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process.
摘要翻译：提供了一种用于发光器件封装的基座。基座包括基板; 分别形成在所述基板上的第一接合层和第二接合层; 分别形成在第一接合层和第二接合层上的第一阻挡层和第二阻挡层; 分别形成在第一阻挡层和第二阻挡层上的第一焊料和第二焊料; 以及形成在第一阻挡层和第二阻挡层周围的第一阻挡层和第二阻挡层，在倒装芯片工艺期间阻挡熔化的第一焊料和熔化的第二焊料溢出。

37. 发明申请

US20060245195A1 Light emitting device package 失效
标题翻译：发光装置封装
公开(公告)号：US20060245195A1
公开(公告)日：2006-11-02
申请号：US11347257
申请日：2006-02-06
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： F21V29/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01S5/02276 , H01S5/02292 , H01L2924/00014
摘要： A light emitting device package is provided. The light emitting device package includes a light emitting device; a package body on which the light emitting device is loaded and which dissipates heat generated from the light emitting device to the outside; a first electrode formed in the package body in a single body; and a second electrode inserted into the package body.
摘要翻译：提供发光器件封装。发光器件封装包括发光器件; 封装体，其上装载有发光器件并且将从发光器件产生的热量散发到外部; 在单体中形成在封装主体中的第一电极; 以及插入到封装主体中的第二电极。

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