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31. 发明授权

US07473937B2 Side-emission type LED package 有权
标题翻译：侧面发射型LED封装
公开(公告)号：US07473937B2
公开(公告)日：2009-01-06
申请号：US11318837
申请日：2005-12-28
申请人： Young Sam Park , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Hun Joo Hahm , Bum Jin Kim
发明人： Young Sam Park , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Hun Joo Hahm , Bum Jin Kim
IPC分类号： H01L29/22
CPC分类号： H01L33/60 , F21K9/68 , H01L33/54
摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
摘要翻译：提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。下部结构具有下反射镜和透明密封构件。下部结构支持LED芯片。下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。透明密封件形成在下反射镜内部的LED芯片周围。上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

32. 发明授权

US07097337B2 Vertical light emitting type backlight module 失效
标题翻译：垂直发光型背光模组
公开(公告)号：US07097337B2
公开(公告)日：2006-08-29
申请号：US10917383
申请日：2004-08-13
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： F21V8/00
CPC分类号： G02F1/133603 , F21K9/00 , F21Y2105/10 , F21Y2115/10
摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.
摘要翻译：本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板在水平方向读取，以将光线的路径改变为垂直方向。

33. 发明授权

US06972439B1 Light emitting diode device 失效
标题翻译：发光二极管装置
公开(公告)号：US06972439B1
公开(公告)日：2005-12-06
申请号：US10916525
申请日：2004-08-12
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： G02F1/13357 , H01L29/22 , H01L33/54 , H01L33/60
CPC分类号： H01L33/54 , H01L33/60
摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.
摘要翻译：这里公开了一种发光二极管（LED）装置。发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

34. 发明授权

US07513632B2 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US07513632B2
公开(公告)日：2009-04-07
申请号：US11860391
申请日：2007-09-24
申请人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
发明人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.
摘要翻译：使用LED的直接照明背光装置包括平面反射板，LED光源，透明板，散射图案和导光体。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。

35. 发明申请

US20080076198A1 Method of manufacturing light emitting diode package and white light source module 审中-公开
标题翻译：制造发光二极管封装和白光源模块的方法
公开(公告)号：US20080076198A1
公开(公告)日：2008-03-27
申请号：US11902233
申请日：2007-09-20
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim
IPC分类号： H01L21/00 , H01J9/02
CPC分类号： H01L33/507 , H01L2933/0041
摘要： A method of manufacturing a light emitting diode package, the method including: forming a resin mold encapsulating a light emitting diode chip; and forming a phosphor thin film on a surface of the resin mold by applying a phosphor-containing coating material on the surface of the resin mold.
摘要翻译：一种制造发光二极管封装的方法，所述方法包括：形成封装发光二极管芯片的树脂模; 以及通过在树脂模具的表面上涂布含磷的涂料，在树脂模具的表面上形成荧光体薄膜。

36. 发明授权

US07186013B2 Large size backlight apparatus reduced in thickness 失效
标题翻译：大尺寸背光设备厚度减小
公开(公告)号：US07186013B2
公开(公告)日：2007-03-06
申请号：US11060286
申请日：2005-02-18
申请人： Young June Jeong , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young Sam Park , Bum Jin Kim , Hun Joo Hahm
发明人： Young June Jeong , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young Sam Park , Bum Jin Kim , Hun Joo Hahm
IPC分类号： F21V8/00
CPC分类号： G02B6/0021 , G02B6/0036 , G02B6/0055 , G02B6/0061 , G02B6/0068 , G02B6/0076
摘要： In a backlight apparatus used in an LCD, in which upper and lower reflective plates are installed under upper and lower transparent plates, respectively. The lower transparent plates and the lower reflective plates introduce light generated by lower light sources in upward directions and the upper transparent plate and the upper reflective plates introduce light generated by an upper light source into those areas, which are not lighted by the lower light sources. This can prevent the formation of dark areas above the lower light sources thereby enhancing the overall uniformity of light.
摘要翻译：在LCD中使用的背光装置中，上下反射板分别安装在上透明板和下透明板之下。下透明板和下反射板在向上方向引入由下光源产生的光，并且上透明板和上反射板将由上光源产生的光引入那些未被下光源照射的区域。这可以防止在较低光源之上形成暗区，从而增强光的整体均匀性。

37. 发明授权

US07172325B2 Backlight unit of liquid crystal display 失效
标题翻译：背光单元液晶显示
公开(公告)号：US07172325B2
公开(公告)日：2007-02-06
申请号：US10916480
申请日：2004-08-12
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： F21V5/04
CPC分类号： G02F1/133603 , G02F1/133605 , Y10S362/80
摘要： A backlight unit of a liquid crystal display includes a plurality of light emitting diode packages arranged in a matrix while being spaced a uniform distance apart from each other. Each light emitting diode package includes one or more light emitting diode chips and is structured such that light generated from the light emitting chips is emitted in the horizontal direction. A reflector consists of a plurality of reflection cells connected to each other in a matrix. Each of the reflection cells of a unit size has each of the light generating packages positioned at the center thereof, and reflects the light, emitted from the light emitting diode at the center thereof in the horizontal direction, in the vertical direction.
摘要翻译：液晶显示器的背光单元包括以矩阵形式布置的多个发光二极管封装，同时彼此间隔开均匀的距离。每个发光二极管封装包括一个或多个发光二极管芯片，并且被构造为使得从发光芯片产生的光在水平方向上发射。反射器由以矩阵形式彼此连接的多个反射单元组成。单位尺寸的每个反射单元具有位于其中心的每个发光组件，并且在垂直方向上将从发光二极管的水平方向的中心发射的光反射。

38. 发明授权

US07968894B2 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US07968894B2
公开(公告)日：2011-06-28
申请号：US12549252
申请日：2009-08-27
申请人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

39. 发明授权

US07321137B2 RGB light emitting diode package with improved color mixing properties 有权
标题翻译： RGB发光二极管封装，具有改进的混色性能
公开(公告)号：US07321137B2
公开(公告)日：2008-01-22
申请号：US10959154
申请日：2004-10-07
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Young June Jeong
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Young June Jeong
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： An RGB light emitting diode package with improved color mixing properties includes red, green, and blue light emitting diode chips provided on a reflector. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light emitting diode chips. The photomixing material and filler resin are applied onto upper sides of the light emitting diode chips while being mixed with each other, and the photomixing material is uniformly dispersed in the filler resin.
摘要翻译：具有改进的混色特性的RGB发光二极管封装包括设置在反射器上的红色，绿色和蓝色发光二极管芯片。光混合材料和填充树脂散射射线，以均匀混合从发光二极管芯片发出的光线。将光混合材料和填料树脂彼此混合地施加到发光二极管芯片的上侧，并且光混合材料均匀地分散在填充树脂中。

40. 发明授权

US07195364B2 Backlight apparatus reduced in thickness 失效
标题翻译：背光装置的厚度减小
公开(公告)号：US07195364B2
公开(公告)日：2007-03-27
申请号：US11059406
申请日：2005-02-17
申请人： Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Ho Sik Anh , Young Sam Park , Bum Jin Kim , Young June Jeong
发明人： Hun Joo Hahm , Hyung Suk Kim , Jung Kyu Park , Ho Sik Anh , Young Sam Park , Bum Jin Kim , Young June Jeong
IPC分类号： G01D11/28
CPC分类号： G02B6/0068 , G02B6/0016 , G02B6/0043 , G02F1/133603
摘要： In a backlight apparatus for an LCD, a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.
摘要翻译：在用于LCD的背光装置中，多个条形的第一LED光源被布置在反射板上以横向发光。多个浅色调布置在第一光源的上方。透明板放置在浅色调之上。散射图案形成在透明板底部的对应于浅色调的位置上。在透明板的一侧设置条状的第二LED光源，以将光发射到透明板中。布置在透明板一侧的光源防止了现有技术中的黑色区域的形成，从而增强了光的整体均匀性。然后，即使应用于大型LCD也能够使背光装置保持薄型化。

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