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    • 33. 发明授权
    • Chemically amplified resist compositions
    • 化学扩增抗蚀剂组合物
    • US06416927B1
    • 2002-07-09
    • US09675500
    • 2000-09-29
    • Sang-jun ChoiChun-geun ParkYoung-bum Koh
    • Sang-jun ChoiChun-geun ParkYoung-bum Koh
    • G03F7004
    • C08F220/18C08F222/06G03F7/0045G03F7/039Y10S430/111Y10S430/115
    • Copolymers and terpolyers are used in chemically amplified resists. The terpolymers are of the formula: wherein R3 is selected from the group consisting of hydrogen and a C1 to C10 aliphatic hydrocarbon, wherein the aliphatic hydrocarbon contains substituents selected from the group consisting of hydrogen, hydroxy, carboxylic acid, carboxylic anhydride, and combinations thereof; R4 is selected from the group consisting of hydrogen and a C1 to C10 aliphatic hydrocarbon, wherein the aliphatic hydrocarbon contains substituents selected from the group consisting of hydrogen, hydroxy, carboxylic acid, carboxylic anhydride, and combinations thereof; R5 is selected from the group consisting of hydrogen and methyl; R6 is selected from the group consisting of t-butyl and tetrahydropyranyl; m and n are each integers; and wherein n/(m+n) ranges from about 0.1 to about 0.5.
    • 共聚物和三聚体用于化学增强抗蚀剂。 三元共聚物具有下式:其中R 3选自氢和C 1至C 10脂族烃,其中脂族烃包含选自氢,羟基,羧酸,羧酸酐及其组合的取代基 ; R4选自氢和C1至C10脂族烃,其中脂族烃包含选自氢,羟基,羧酸,羧酸酐及其组合的取代基; R5选自氢和甲基; R6选自叔丁基和四氢吡喃基; m和n分别为整数; 并且其中n /(m + n)为约0.1至约0.5。
    • 34. 发明授权
    • Method for manufacturing a photoresist pattern defining a small opening and method for manufacturing semiconductor device using the same
    • 用于制造限定小开口的光致抗蚀剂图案的方法和使用其制造半导体器件的方法
    • US06284438B1
    • 2001-09-04
    • US09420555
    • 1999-10-19
    • Sang-jun ChoiYool KangSi-hyeung LeeJoo-tae Moon
    • Sang-jun ChoiYool KangSi-hyeung LeeJoo-tae Moon
    • G03F726
    • G03F7/40G03F7/0045G03F7/039
    • A method for manufacturing a photoresist pattern that defines an opening having a small size, and a method for manufacturing a semiconductor device using the same are provided. A photoresist pattern defining the opening can be formed using a photoresist composition that includes either polymer mixture I containing a polymer A in which an acid-labile di-alkyl malonate group is pendant to the polymer backbone, and a polymer B in which a group that thermally decomposes at a temperature lower than the glass transition temperature of the polymer B itself is pendant to the polymer backbone, or polymer mixture II containing the polymer B and a polymer C including a (meth)acrylate as a monomer, as a main component. The size of the opening then can be reduced by thermal flowing the photoresist pattern. It is possible to form the photoresist pattern defining an opening having a small size since the photoresist composition comprises the polymer mixture which has advantageous characteristics, such as high contrast, and in which the flow rate of the composition upon thermal flowing can easily be controlled.
    • 提供了限定具有小尺寸的开口的光致抗蚀剂图案的制造方法以及使用其的半导体装置的制造方法。 可以使用光致抗蚀剂组合物形成限定开口的光致抗蚀剂图案,该光致抗蚀剂组合物包括含有聚合物A的聚合物混合物I,其中酸不稳定的二烷基丙二酸酯基团悬挂于聚合物主链,聚合物B, 在低于聚合物B本身的玻璃化转变温度的温度下热分解为聚合物主链,或含有聚合物B的聚合物混合物II和包含(甲基)丙烯酸酯作为单体的聚合物C作为主要成分。 然后可以通过光致抗蚀剂图案的热流动来减小开口的尺寸。 可以形成限定具有小尺寸的开口的光致抗蚀剂图案,因为光致抗蚀剂组合物包含聚合物混合物,其具有诸如高对比度的有利特征,并且其中组合物在热流动时的流速可以容易地被控制。
    • 35. 发明授权
    • Chemically amplified resist compositions
    • 化学扩增抗蚀剂组合物
    • US06171754B2
    • 2001-01-09
    • US09124597
    • 1998-07-29
    • Sang-jun ChoiChun-geun ParkYoung-bum Koh
    • Sang-jun ChoiChun-geun ParkYoung-bum Koh
    • B03F7004
    • C08F220/18C08F222/06G03F7/0045G03F7/039Y10S430/111Y10S430/115
    • Copolymers and terpolyers are used in chemically amplified resists. The terpolymers are of the formula: wherein R3 is selected from the group consisting of hydrogen and a C1 to C10 aliphatic hydrocarbon, wherein the aliphatic hydrocarbon contains substituents selected from the group consisting of hydrogen, hydroxy, carboxylic acid, carboxylic anhydride, and combinations thereof; R4 is selected from the group consisting of hydrogen and a C1 to C10 aliphatic hydrocarbon, wherein the aliphatic hydrocarbon contains substituents selected from the group consisting of hydrogen, hydroxy, carboxylic acid, carboxylic anhydride, and combinations thereof; R5 is selected from the group consisting of hydrogen and methyl; R6 is selected from the group consisting of t-butyl and tetrahydropyranyl; m and n are each integers; and wherein n/(m+n) ranges from about 0.1 to about 0.5.
    • 共聚物和三聚体用于化学增强抗蚀剂。 三元共聚物具有下式:其中R 3选自氢和C 1至C 10脂族烃,其中脂族烃包含选自氢,羟基,羧酸,羧酸酐及其组合的取代基 ; R4选自氢和C1至C10脂族烃,其中脂族烃包含选自氢,羟基,羧酸,羧酸酐及其组合的取代基; R5选自氢和甲基; R6选自叔丁基和四氢吡喃基; m和n分别为整数; 并且其中n /(m + n)为约0.1至约0.5。